US5540782A
(en)
*
|
1992-10-15 |
1996-07-30 |
Tokyo Electron Kabushiki Kaisha |
Heat treating apparatus having heat transmission-preventing plates
|
USD405427S
(en)
*
|
1997-01-31 |
1999-02-09 |
Tokyo Electron Limited |
Heat retaining tube for use in a semiconductor wafer heat processing apparatus
|
USD404016S
(en)
*
|
1997-01-31 |
1999-01-12 |
Tokyo Electron Limited |
Heat retaining tube for use in a semiconductor wafer heat processing apparatus
|
USD427570S
(en)
*
|
1997-01-31 |
2000-07-04 |
Tokyo Electron Limited |
Quartz fin heat retaining tube
|
USD405428S
(en)
*
|
1997-01-31 |
1999-02-09 |
Tokyo Electron Ltd. |
Heat retaining tube for use in a semiconductor wafer heat processing apparatus
|
USD428858S
(en)
*
|
1997-01-31 |
2000-08-01 |
Tokyo Electron Limited |
Quartz fin heat retaining tube
|
US6616767B2
(en)
*
|
1997-02-12 |
2003-09-09 |
Applied Materials, Inc. |
High temperature ceramic heater assembly with RF capability
|
US5911896A
(en)
*
|
1997-06-25 |
1999-06-15 |
Brooks Automation, Inc. |
Substrate heating apparatus with glass-ceramic panels and thin film ribbon heater element
|
USD404375S
(en)
*
|
1997-08-20 |
1999-01-19 |
Tokyo Electron Limited |
Heat retaining tube base for use in a semiconductor wafer head processing apparatus
|
US6037574A
(en)
*
|
1997-11-06 |
2000-03-14 |
Watlow Electric Manufacturing |
Quartz substrate heater
|
US6700099B2
(en)
*
|
2000-07-10 |
2004-03-02 |
Temptronic Corporation |
Wafer chuck having thermal plate with interleaved heating and cooling elements, interchangeable top surface assemblies and hard coated layer surfaces
|
US6529686B2
(en)
*
|
2001-06-06 |
2003-03-04 |
Fsi International, Inc. |
Heating member for combination heating and chilling apparatus, and methods
|
US6506994B2
(en)
*
|
2001-06-15 |
2003-01-14 |
Applied Materials, Inc. |
Low profile thick film heaters in multi-slot bake chamber
|
US7645342B2
(en)
*
|
2004-11-15 |
2010-01-12 |
Cree, Inc. |
Restricted radiated heating assembly for high temperature processing
|
USD604257S1
(en)
*
|
2005-10-27 |
2009-11-17 |
Tokyo Electron Limited |
Heater for semiconductor manufacturing
|
USD601521S1
(en)
*
|
2006-09-28 |
2009-10-06 |
Tokyo Electron Limited |
Heater for manufacturing semiconductor
|
USD589471S1
(en)
*
|
2006-09-28 |
2009-03-31 |
Tokyo Electron Limited |
Heater for manufacturing semiconductor
|
KR101480971B1
(ko)
*
|
2006-10-10 |
2015-01-09 |
에이에스엠 아메리카, 인코포레이티드 |
전구체 전달 시스템
|
US8986456B2
(en)
*
|
2006-10-10 |
2015-03-24 |
Asm America, Inc. |
Precursor delivery system
|
USD600220S1
(en)
*
|
2008-03-28 |
2009-09-15 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
|
USD600660S1
(en)
*
|
2008-03-28 |
2009-09-22 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
|
USD616392S1
(en)
*
|
2009-03-06 |
2010-05-25 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
|
USD615937S1
(en)
*
|
2009-03-06 |
2010-05-18 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
|
USD616393S1
(en)
*
|
2009-03-06 |
2010-05-25 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
|
US8933375B2
(en)
*
|
2012-06-27 |
2015-01-13 |
Asm Ip Holding B.V. |
Susceptor heater and method of heating a substrate
|