JP1560719S - - Google Patents

Info

Publication number
JP1560719S
JP1560719S JPD2015-26892F JP2015026892F JP1560719S JP 1560719 S JP1560719 S JP 1560719S JP 2015026892 F JP2015026892 F JP 2015026892F JP 1560719 S JP1560719 S JP 1560719S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2015-26892F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2015-26892F priority Critical patent/JP1560719S/ja
Priority to US29/566,273 priority patent/USD798250S1/en
Application granted granted Critical
Publication of JP1560719S publication Critical patent/JP1560719S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2015-26892F 2015-12-01 2015-12-01 Active JP1560719S (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2015-26892F JP1560719S (ko) 2015-12-01 2015-12-01
US29/566,273 USD798250S1 (en) 2015-12-01 2016-05-27 Heater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-26892F JP1560719S (ko) 2015-12-01 2015-12-01

Publications (1)

Publication Number Publication Date
JP1560719S true JP1560719S (ko) 2016-10-11

Family

ID=57048113

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2015-26892F Active JP1560719S (ko) 2015-12-01 2015-12-01

Country Status (2)

Country Link
US (1) USD798250S1 (ko)
JP (1) JP1560719S (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
JP1581406S (ko) * 2016-10-14 2017-07-18
USD832229S1 (en) * 2017-05-26 2018-10-30 TinyPCB, Inc. Modular circuit board
USD841605S1 (en) * 2017-05-30 2019-02-26 TinyPCB, Inc. Modular circuit board
USD842260S1 (en) * 2017-05-30 2019-03-05 TinyPCB, Inc. Modular circuit board
USD839222S1 (en) * 2017-05-30 2019-01-29 TinyPCB, Inc. Modular circuit board
USD839221S1 (en) * 2017-05-30 2019-01-29 TinyPCB, Inc. Modular circuit board
USD839223S1 (en) * 2017-05-30 2019-01-29 TinyPCB, Inc. Modular circuit board
USD841606S1 (en) * 2017-05-30 2019-02-26 TinyPCB, Inc. Modular circuit board
USD887358S1 (en) * 2018-12-06 2020-06-16 Lofelt Gmbh Motor membrane
JP1651619S (ko) * 2019-07-11 2020-01-27
JP1651618S (ko) * 2019-07-11 2020-01-27
JP1651623S (ko) * 2019-07-18 2020-01-27
JP1684469S (ja) * 2020-09-24 2021-05-10 基板処理装置用天井ヒータ

Family Cites Families (25)

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Publication number Priority date Publication date Assignee Title
US5540782A (en) * 1992-10-15 1996-07-30 Tokyo Electron Kabushiki Kaisha Heat treating apparatus having heat transmission-preventing plates
USD405427S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD404016S (en) * 1997-01-31 1999-01-12 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD427570S (en) * 1997-01-31 2000-07-04 Tokyo Electron Limited Quartz fin heat retaining tube
USD405428S (en) * 1997-01-31 1999-02-09 Tokyo Electron Ltd. Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD428858S (en) * 1997-01-31 2000-08-01 Tokyo Electron Limited Quartz fin heat retaining tube
US6616767B2 (en) * 1997-02-12 2003-09-09 Applied Materials, Inc. High temperature ceramic heater assembly with RF capability
US5911896A (en) * 1997-06-25 1999-06-15 Brooks Automation, Inc. Substrate heating apparatus with glass-ceramic panels and thin film ribbon heater element
USD404375S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Heat retaining tube base for use in a semiconductor wafer head processing apparatus
US6037574A (en) * 1997-11-06 2000-03-14 Watlow Electric Manufacturing Quartz substrate heater
US6700099B2 (en) * 2000-07-10 2004-03-02 Temptronic Corporation Wafer chuck having thermal plate with interleaved heating and cooling elements, interchangeable top surface assemblies and hard coated layer surfaces
US6529686B2 (en) * 2001-06-06 2003-03-04 Fsi International, Inc. Heating member for combination heating and chilling apparatus, and methods
US6506994B2 (en) * 2001-06-15 2003-01-14 Applied Materials, Inc. Low profile thick film heaters in multi-slot bake chamber
US7645342B2 (en) * 2004-11-15 2010-01-12 Cree, Inc. Restricted radiated heating assembly for high temperature processing
USD604257S1 (en) * 2005-10-27 2009-11-17 Tokyo Electron Limited Heater for semiconductor manufacturing
USD601521S1 (en) * 2006-09-28 2009-10-06 Tokyo Electron Limited Heater for manufacturing semiconductor
USD589471S1 (en) * 2006-09-28 2009-03-31 Tokyo Electron Limited Heater for manufacturing semiconductor
KR101480971B1 (ko) * 2006-10-10 2015-01-09 에이에스엠 아메리카, 인코포레이티드 전구체 전달 시스템
US8986456B2 (en) * 2006-10-10 2015-03-24 Asm America, Inc. Precursor delivery system
USD600220S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD600660S1 (en) * 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD615937S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD616393S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US8933375B2 (en) * 2012-06-27 2015-01-13 Asm Ip Holding B.V. Susceptor heater and method of heating a substrate

Also Published As

Publication number Publication date
USD798250S1 (en) 2017-09-26

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