TWD207699S - Holding plate of ceiling heater for substrate processing device - Google Patents

Holding plate of ceiling heater for substrate processing device Download PDF

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Publication number
TWD207699S
TWD207699S TW108306967F TW108306967F TWD207699S TW D207699 S TWD207699 S TW D207699S TW 108306967 F TW108306967 F TW 108306967F TW 108306967 F TW108306967 F TW 108306967F TW D207699 S TWD207699 S TW D207699S
Authority
TW
Taiwan
Prior art keywords
processing device
substrate processing
holding plate
ceiling heater
ceiling
Prior art date
Application number
TW108306967F
Other languages
Chinese (zh)
Inventor
杉浦忍
小杉哲也
山口天和
Original Assignee
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司
Publication of TWD207699S publication Critical patent/TWD207699S/en

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Abstract

【物品用途】;本設計的物品是基板處理裝置用吸頂式加熱器的保持板,如「使用狀態參考圖」所示,安裝成從上方覆蓋住設置在用來加熱基板處理裝置的吸頂式加熱器之加熱線,以使加熱線之間互相絕緣。;【設計說明】;(無)[Use of the article]; The article of this design is a retaining plate for a ceiling-type heater for a substrate processing device. As shown in the "Usage Reference Picture", it is installed to cover the ceiling of the substrate processing device from above. The heating wires of the heater should be insulated from each other. ;[Design description];(none)

Description

基板處理裝置用吸頂式加熱器的保持板Holding plate of ceiling heater for substrate processing device

本設計的物品是基板處理裝置用吸頂式加熱器的保持板,如「使用狀態參考圖」所示,安裝成從上方覆蓋住設置在用來加熱基板處理裝置的吸頂式加熱器之加熱線,以使加熱線之間互相絕緣。The article of this design is the holding plate of the ceiling heater for the substrate processing device. As shown in the "use state reference drawing", it is installed to cover the heating of the ceiling heater installed in the substrate processing device from above. Wire to insulate the heating wires from each other.

(無)(no)

TW108306967F 2019-07-11 2019-11-13 Holding plate of ceiling heater for substrate processing device TWD207699S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-015586 2019-01-31
JPD2019-15586F JP1651618S (en) 2019-07-11 2019-07-11

Publications (1)

Publication Number Publication Date
TWD207699S true TWD207699S (en) 2020-10-11

Family

ID=69183110

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108306967F TWD207699S (en) 2019-07-11 2019-11-13 Holding plate of ceiling heater for substrate processing device

Country Status (3)

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US (1) USD962183S1 (en)
JP (1) JP1651618S (en)
TW (1) TWD207699S (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1114751S1 (en) * 2021-10-18 2026-02-24 Lam Research Corporation Hub with gas deflectors
USD1107669S1 (en) * 2022-05-02 2025-12-30 Lam Research Corporation Processing chamber purge plate
JP1775347S (en) * 2024-01-30 2024-07-12 Circuit board transport holder

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6390905B1 (en) * 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US7326105B2 (en) * 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
TWD125598S1 (en) * 2006-09-28 2008-10-21 東京威力科創股份有限公司 Heater for semiconductor manufacturing
TWD125599S1 (en) * 2006-09-28 2008-10-21 東京威力科創股份有限公司 Heater for semiconductor manufacturing
JP2008177248A (en) * 2007-01-16 2008-07-31 Tokyo Seimitsu Co Ltd Retaining ring for polishing head
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD732094S1 (en) * 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
WO2014109929A1 (en) * 2013-01-11 2014-07-17 Applied Materials, Inc Chemical mechanical polishing apparatus and methods
US9227297B2 (en) * 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
JP1541874S (en) * 2015-03-16 2016-01-18
US10174437B2 (en) * 2015-07-09 2019-01-08 Applied Materials, Inc. Wafer electroplating chuck assembly
JP1556433S (en) * 2015-10-06 2016-08-15
JP1560719S (en) * 2015-12-01 2016-10-11
JP1581406S (en) * 2016-10-14 2017-07-18
JP6912497B2 (en) * 2016-12-01 2021-08-04 株式会社Kokusai Electric Manufacturing method for substrate processing equipment, ceiling heaters and semiconductor equipment
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
KR20190008101A (en) * 2017-07-14 2019-01-23 가부시키가이샤 코쿠사이 엘렉트릭 Substrate processing apparatus, substrate retainer and method of manufacturing semiconductor device
JP1651623S (en) * 2019-07-18 2020-01-27
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device

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Publication number Publication date
USD962183S1 (en) 2022-08-30
JP1651618S (en) 2020-01-27

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