TWD207699S - Holding plate of ceiling heater for substrate processing device - Google Patents
Holding plate of ceiling heater for substrate processing device Download PDFInfo
- Publication number
- TWD207699S TWD207699S TW108306967F TW108306967F TWD207699S TW D207699 S TWD207699 S TW D207699S TW 108306967 F TW108306967 F TW 108306967F TW 108306967 F TW108306967 F TW 108306967F TW D207699 S TWD207699 S TW D207699S
- Authority
- TW
- Taiwan
- Prior art keywords
- processing device
- substrate processing
- holding plate
- ceiling heater
- ceiling
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 3
Images
Abstract
【物品用途】;本設計的物品是基板處理裝置用吸頂式加熱器的保持板,如「使用狀態參考圖」所示,安裝成從上方覆蓋住設置在用來加熱基板處理裝置的吸頂式加熱器之加熱線,以使加熱線之間互相絕緣。;【設計說明】;(無)[Use of the article]; The article of this design is a retaining plate for a ceiling-type heater for a substrate processing device. As shown in the "Usage Reference Picture", it is installed to cover the ceiling of the substrate processing device from above. The heating wires of the heater should be insulated from each other. ;[Design description];(none)
Description
本設計的物品是基板處理裝置用吸頂式加熱器的保持板,如「使用狀態參考圖」所示,安裝成從上方覆蓋住設置在用來加熱基板處理裝置的吸頂式加熱器之加熱線,以使加熱線之間互相絕緣。The article of this design is the holding plate of the ceiling heater for the substrate processing device. As shown in the "use state reference drawing", it is installed to cover the heating of the ceiling heater installed in the substrate processing device from above. Wire to insulate the heating wires from each other.
(無)(no)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-015586 | 2019-01-31 | ||
| JPD2019-15586F JP1651618S (en) | 2019-07-11 | 2019-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD207699S true TWD207699S (en) | 2020-10-11 |
Family
ID=69183110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108306967F TWD207699S (en) | 2019-07-11 | 2019-11-13 | Holding plate of ceiling heater for substrate processing device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD962183S1 (en) |
| JP (1) | JP1651618S (en) |
| TW (1) | TWD207699S (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1114751S1 (en) * | 2021-10-18 | 2026-02-24 | Lam Research Corporation | Hub with gas deflectors |
| USD1107669S1 (en) * | 2022-05-02 | 2025-12-30 | Lam Research Corporation | Processing chamber purge plate |
| JP1775347S (en) * | 2024-01-30 | 2024-07-12 | Circuit board transport holder |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6436228B1 (en) * | 1998-05-15 | 2002-08-20 | Applied Materials, Inc. | Substrate retainer |
| US6390905B1 (en) * | 2000-03-31 | 2002-05-21 | Speedfam-Ipec Corporation | Workpiece carrier with adjustable pressure zones and barriers |
| US7326105B2 (en) * | 2005-08-31 | 2008-02-05 | Micron Technology, Inc. | Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces |
| TWD125598S1 (en) * | 2006-09-28 | 2008-10-21 | 東京威力科創股份有限公司 | Heater for semiconductor manufacturing |
| TWD125599S1 (en) * | 2006-09-28 | 2008-10-21 | 東京威力科創股份有限公司 | Heater for semiconductor manufacturing |
| JP2008177248A (en) * | 2007-01-16 | 2008-07-31 | Tokyo Seimitsu Co Ltd | Retaining ring for polishing head |
| USD649126S1 (en) * | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
| USD633452S1 (en) * | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD732094S1 (en) * | 2012-07-20 | 2015-06-16 | Ivoclar Vivadent Ag | Firing plate for a dental furnace |
| WO2014109929A1 (en) * | 2013-01-11 | 2014-07-17 | Applied Materials, Inc | Chemical mechanical polishing apparatus and methods |
| US9227297B2 (en) * | 2013-03-20 | 2016-01-05 | Applied Materials, Inc. | Retaining ring with attachable segments |
| USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| USD724553S1 (en) * | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| JP1541874S (en) * | 2015-03-16 | 2016-01-18 | ||
| US10174437B2 (en) * | 2015-07-09 | 2019-01-08 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
| JP1556433S (en) * | 2015-10-06 | 2016-08-15 | ||
| JP1560719S (en) * | 2015-12-01 | 2016-10-11 | ||
| JP1581406S (en) * | 2016-10-14 | 2017-07-18 | ||
| JP6912497B2 (en) * | 2016-12-01 | 2021-08-04 | 株式会社Kokusai Electric | Manufacturing method for substrate processing equipment, ceiling heaters and semiconductor equipment |
| USD859332S1 (en) * | 2017-06-29 | 2019-09-10 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
| KR20190008101A (en) * | 2017-07-14 | 2019-01-23 | 가부시키가이샤 코쿠사이 엘렉트릭 | Substrate processing apparatus, substrate retainer and method of manufacturing semiconductor device |
| JP1651623S (en) * | 2019-07-18 | 2020-01-27 | ||
| USD940670S1 (en) * | 2019-09-26 | 2022-01-11 | Willbe S&T Co., Ltd. | Retainer ring for chemical mechanical polishing device |
-
2019
- 2019-07-11 JP JPD2019-15586F patent/JP1651618S/ja active Active
- 2019-11-13 TW TW108306967F patent/TWD207699S/en unknown
- 2019-12-27 US US29/718,671 patent/USD962183S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD962183S1 (en) | 2022-08-30 |
| JP1651618S (en) | 2020-01-27 |
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