TWD125598S1 - Heater for semiconductor manufacturing - Google Patents

Heater for semiconductor manufacturing

Info

Publication number
TWD125598S1
TWD125598S1 TW096301455F TW96301455F TWD125598S1 TW D125598 S1 TWD125598 S1 TW D125598S1 TW 096301455 F TW096301455 F TW 096301455F TW 96301455 F TW96301455 F TW 96301455F TW D125598 S1 TWD125598 S1 TW D125598S1
Authority
TW
Taiwan
Prior art keywords
semiconductor manufacturing
heater
creation
article
disc
Prior art date
Application number
TW096301455F
Other languages
Chinese (zh)
Inventor
小松智仁
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TWD125598S1 publication Critical patent/TWD125598S1/en

Links

Abstract

【物品用途】;本創作的物品是一種半導體製造用加熱器,配置在半;導體製造用處理室來使用的加熱器。;【創作特點】;如各圖所示,本體為石英製的透明圓盤體,如前、後;視圖所示,在圓盤體的最外周有一圈波浪狀的加熱構;件,且於波浪狀的內側環繞一圈形成多角形,並由此向;內以回繞的方式佈滿整個圓盤體,詳細的斷面構成則如;A-A剖面圖所示;綜上所述,確為一深具科技美感之;設計。;[Purpose of the article] The article of this creation is a heater for semiconductor manufacturing, which is used in a processing room for semiconductor manufacturing. [Features of the creation] As shown in the figures, the main body is a transparent disc made of quartz. As shown in the front and rear views, there is a circle of wavy heating components on the outermost periphery of the disc, and it surrounds the inner side of the wavy shape to form a polygon, and from there, it is arranged in a winding manner to cover the entire disc inward. The detailed cross-sectional structure is shown in the A-A cross-sectional view. In summary, it is indeed a design with a deep sense of technological beauty.

TW096301455F 2006-09-28 2007-03-14 Heater for semiconductor manufacturing TWD125598S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006026092 2006-09-28

Publications (1)

Publication Number Publication Date
TWD125598S1 true TWD125598S1 (en) 2008-10-21

Family

ID=40474447

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096301455F TWD125598S1 (en) 2006-09-28 2007-03-14 Heater for semiconductor manufacturing

Country Status (2)

Country Link
US (1) USD589471S1 (en)
TW (1) TWD125598S1 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5073751B2 (en) * 2006-10-10 2012-11-14 エーエスエム アメリカ インコーポレイテッド Precursor delivery system
USD654033S1 (en) * 2010-01-20 2012-02-14 Celadon Systems, Inc. Grooved wire support for a probe test core
USD656600S1 (en) * 2011-11-02 2012-03-27 Idc Enchanted Lighting Company, Llc Heating plate
USD667101S1 (en) * 2011-11-02 2012-09-11 Idc Enchanted Lighting Company, Llc Fragrance disk
USD662583S1 (en) * 2011-11-02 2012-06-26 Idc Enchanted Lighting Company, Llc Heating unit
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD764423S1 (en) * 2014-03-05 2016-08-23 Hzo, Inc. Corrugated elements for defining longitudinal channels in a boat for a deposition apparatus
USD673254S1 (en) * 2012-02-07 2012-12-25 Idc Enchanted Lighting Company, Llc Heating unit
USD703208S1 (en) * 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD722048S1 (en) 2013-07-08 2015-02-03 Witricity Corporation Printed resonator coil
USD705745S1 (en) * 2013-07-08 2014-05-27 Witricity Corporation Printed resonator coil
USD713363S1 (en) * 2013-12-31 2014-09-16 Celadon Systems, Inc. Support for a probe test core
WO2015113142A1 (en) 2014-01-30 2015-08-06 Draingarde Inc. Watershed protection device and system
USD768843S1 (en) 2014-11-28 2016-10-11 Draingarde Inc. Catch basin cover
JP1541874S (en) * 2015-03-16 2016-01-18
JP1560719S (en) * 2015-12-01 2016-10-11
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD841629S1 (en) * 2017-03-29 2019-02-26 Megabyte Limited RFID antenna
USD887358S1 (en) * 2018-12-06 2020-06-16 Lofelt Gmbh Motor membrane
JP1653576S (en) * 2019-04-09 2020-02-25
JP1651619S (en) * 2019-07-11 2020-01-27
JP1651618S (en) * 2019-07-11 2020-01-27
JP1651623S (en) * 2019-07-18 2020-01-27
USD936187S1 (en) * 2020-02-12 2021-11-16 Applied Materials, Inc. Gas distribution assembly lid
JP1684469S (en) * 2020-09-24 2021-05-10 Ceiling heater for substrate processing equipment
USD1071103S1 (en) 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1037778S1 (en) 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate
USD1085029S1 (en) 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5540782A (en) * 1992-10-15 1996-07-30 Tokyo Electron Kabushiki Kaisha Heat treating apparatus having heat transmission-preventing plates
USD428858S (en) * 1997-01-31 2000-08-01 Tokyo Electron Limited Quartz fin heat retaining tube
USD427570S (en) * 1997-01-31 2000-07-04 Tokyo Electron Limited Quartz fin heat retaining tube
US6616767B2 (en) * 1997-02-12 2003-09-09 Applied Materials, Inc. High temperature ceramic heater assembly with RF capability
US5911896A (en) * 1997-06-25 1999-06-15 Brooks Automation, Inc. Substrate heating apparatus with glass-ceramic panels and thin film ribbon heater element
US6037574A (en) * 1997-11-06 2000-03-14 Watlow Electric Manufacturing Quartz substrate heater
AU2001271904A1 (en) * 2000-07-10 2002-02-05 Temptronic Corporation Wafer chuck having with interleaved heating and cooling elements
US6998579B2 (en) * 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
US6529686B2 (en) * 2001-06-06 2003-03-04 Fsi International, Inc. Heating member for combination heating and chilling apparatus, and methods
US6506994B2 (en) * 2001-06-15 2003-01-14 Applied Materials, Inc. Low profile thick film heaters in multi-slot bake chamber
JP2007189093A (en) * 2006-01-13 2007-07-26 Disco Abrasive Syst Ltd Semiconductor wafer

Also Published As

Publication number Publication date
USD589471S1 (en) 2009-03-31

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