USD962183S1 - Retainer plate of top heater for wafer processing furnace - Google Patents

Retainer plate of top heater for wafer processing furnace Download PDF

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Publication number
USD962183S1
USD962183S1 US29/718,671 US201929718671F USD962183S US D962183 S1 USD962183 S1 US D962183S1 US 201929718671 F US201929718671 F US 201929718671F US D962183 S USD962183 S US D962183S
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US
United States
Prior art keywords
retainer plate
wafer processing
processing furnace
top heater
heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/718,671
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English (en)
Inventor
Shinobu Sugiura
Tetsuya Kosugi
Takatomo Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOSUGI, TETSUYA, SUGIURA, SHINOBU, YAMAGUCHI, TAKATOMO
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US29/718,671 2019-07-11 2019-12-27 Retainer plate of top heater for wafer processing furnace Active USD962183S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-015586 2019-01-31
JPD2019-15586F JP1651618S (ko) 2019-07-11 2019-07-11

Publications (1)

Publication Number Publication Date
USD962183S1 true USD962183S1 (en) 2022-08-30

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ID=69183110

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Application Number Title Priority Date Filing Date
US29/718,671 Active USD962183S1 (en) 2019-07-11 2019-12-27 Retainer plate of top heater for wafer processing furnace

Country Status (3)

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US (1) USD962183S1 (ko)
JP (1) JP1651618S (ko)
TW (1) TWD207699S (ko)

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6659850B2 (en) * 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US7326105B2 (en) * 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
US20080171500A1 (en) * 2007-01-16 2008-07-17 Tokyo Seimitsu Co., Ltd Retainer ring for polishing head
USD589471S1 (en) * 2006-09-28 2009-03-31 Tokyo Electron Limited Heater for manufacturing semiconductor
USD601521S1 (en) * 2006-09-28 2009-10-06 Tokyo Electron Limited Heater for manufacturing semiconductor
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD732094S1 (en) * 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
US9227297B2 (en) * 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US20170009367A1 (en) * 2015-07-09 2017-01-12 Applied Materials, Inc. Wafer electroplating chuck assembly
USD794585S1 (en) * 2015-10-06 2017-08-15 Ebara Corporation Retainer ring for substrate
USD797690S1 (en) * 2015-03-16 2017-09-19 Nuflare Technology, Inc. Heater for semiconductor manufacturing apparatus
USD798250S1 (en) * 2015-12-01 2017-09-26 Nuflare Technology, Inc. Heater
USD826185S1 (en) * 2016-10-14 2018-08-21 Hitachi Kokusai Electric Inc. Ceiling heater for substrate processing apparatus
US20190024232A1 (en) * 2017-07-14 2019-01-24 Hitachi Kokusai Electric Inc. Substrate processing apparatus and substrate retainer
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US20190284696A1 (en) * 2016-12-01 2019-09-19 Kokusai Electric Corporation Substrate processing apparatus and ceiling heater
US10500694B2 (en) * 2013-01-11 2019-12-10 Applied Materials, Inc. Chemical mechanical polishing apparatus and methods
USD918848S1 (en) * 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6659850B2 (en) * 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US7326105B2 (en) * 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
USD589471S1 (en) * 2006-09-28 2009-03-31 Tokyo Electron Limited Heater for manufacturing semiconductor
USD601521S1 (en) * 2006-09-28 2009-10-06 Tokyo Electron Limited Heater for manufacturing semiconductor
US20080171500A1 (en) * 2007-01-16 2008-07-17 Tokyo Seimitsu Co., Ltd Retainer ring for polishing head
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD732094S1 (en) * 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
US10500694B2 (en) * 2013-01-11 2019-12-10 Applied Materials, Inc. Chemical mechanical polishing apparatus and methods
US9227297B2 (en) * 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD797690S1 (en) * 2015-03-16 2017-09-19 Nuflare Technology, Inc. Heater for semiconductor manufacturing apparatus
US20170009367A1 (en) * 2015-07-09 2017-01-12 Applied Materials, Inc. Wafer electroplating chuck assembly
USD794585S1 (en) * 2015-10-06 2017-08-15 Ebara Corporation Retainer ring for substrate
USD798250S1 (en) * 2015-12-01 2017-09-26 Nuflare Technology, Inc. Heater
USD826185S1 (en) * 2016-10-14 2018-08-21 Hitachi Kokusai Electric Inc. Ceiling heater for substrate processing apparatus
US20190284696A1 (en) * 2016-12-01 2019-09-19 Kokusai Electric Corporation Substrate processing apparatus and ceiling heater
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US20190024232A1 (en) * 2017-07-14 2019-01-24 Hitachi Kokusai Electric Inc. Substrate processing apparatus and substrate retainer
USD918848S1 (en) * 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device

Also Published As

Publication number Publication date
TWD207699S (zh) 2020-10-11
JP1651618S (ko) 2020-01-27

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