JP1556433S - - Google Patents

Info

Publication number
JP1556433S
JP1556433S JPD2015-21985F JP2015021985F JP1556433S JP 1556433 S JP1556433 S JP 1556433S JP 2015021985 F JP2015021985 F JP 2015021985F JP 1556433 S JP1556433 S JP 1556433S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2015-21985F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2015-21985F priority Critical patent/JP1556433S/ja
Priority to TW105301716F priority patent/TWD179672S/zh
Priority to US29/560,291 priority patent/USD794585S1/en
Application granted granted Critical
Publication of JP1556433S publication Critical patent/JP1556433S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2015-21985F 2015-10-06 2015-10-06 Active JP1556433S (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2015-21985F JP1556433S (ko) 2015-10-06 2015-10-06
TW105301716F TWD179672S (zh) 2015-10-06 2016-03-31 基板保持環之部分
US29/560,291 USD794585S1 (en) 2015-10-06 2016-04-05 Retainer ring for substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-21985F JP1556433S (ko) 2015-10-06 2015-10-06

Publications (1)

Publication Number Publication Date
JP1556433S true JP1556433S (ko) 2016-08-15

Family

ID=56612403

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2015-21985F Active JP1556433S (ko) 2015-10-06 2015-10-06

Country Status (3)

Country Link
US (1) USD794585S1 (ko)
JP (1) JP1556433S (ko)
TW (1) TWD179672S (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1544543S (ko) * 2015-05-14 2019-02-18
JP1584784S (ko) * 2017-01-31 2017-08-28
JP1651619S (ko) * 2019-07-11 2020-01-27
JP1651618S (ko) * 2019-07-11 2020-01-27
JP1651623S (ko) * 2019-07-18 2020-01-27
USD931241S1 (en) 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device
JP1671171S (ko) * 2020-05-22 2020-10-26
USD981459S1 (en) * 2021-06-16 2023-03-21 Ebara Corporation Retaining ring for substrate

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5944593A (en) * 1997-09-01 1999-08-31 United Microelectronics Corp. Retainer ring for polishing head of chemical-mechanical polish machines
US6116992A (en) * 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6224472B1 (en) * 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing
US6186880B1 (en) * 1999-09-29 2001-02-13 Semiconductor Equipment Technology Recyclable retaining ring assembly for a chemical mechanical polishing apparatus
US6869335B2 (en) * 2002-07-08 2005-03-22 Micron Technology, Inc. Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
CN1910012B (zh) * 2003-11-13 2012-03-21 应用材料公司 具有成型表面的固定环
US7029386B2 (en) * 2004-06-10 2006-04-18 R & B Plastics, Inc. Retaining ring assembly for use in chemical mechanical polishing
US7029375B2 (en) * 2004-08-31 2006-04-18 Tech Semiconductor Pte. Ltd. Retaining ring structure for edge control during chemical-mechanical polishing
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US7186171B2 (en) * 2005-04-22 2007-03-06 Applied Materials, Inc. Composite retaining ring
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US7326105B2 (en) * 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
JP2008229790A (ja) * 2007-03-22 2008-10-02 Nec Electronics Corp リテーナリングおよび研磨装置
US8517803B2 (en) * 2009-09-16 2013-08-27 SPM Technology, Inc. Retaining ring for chemical mechanical polishing
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
JP1438745S (ko) * 2011-09-20 2015-04-06
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD734377S1 (en) * 2013-03-28 2015-07-14 Hirata Corporation Top cover of a load lock chamber
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD729730S1 (en) * 2013-06-06 2015-05-19 Jon Simon Gillespie-Brown Power charging ring

Also Published As

Publication number Publication date
TWD179672S (zh) 2016-11-21
USD794585S1 (en) 2017-08-15

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