TWD187804S - Part of the substrate processing component - Google Patents

Part of the substrate processing component

Info

Publication number
TWD187804S
TWD187804S TW106301392F TW106301392F TWD187804S TW D187804 S TWD187804 S TW D187804S TW 106301392 F TW106301392 F TW 106301392F TW 106301392 F TW106301392 F TW 106301392F TW D187804 S TWD187804 S TW D187804S
Authority
TW
Taiwan
Prior art keywords
gas
vacuum processing
article
processing chamber
reference picture
Prior art date
Application number
TW106301392F
Other languages
English (en)
Inventor
属優作
川崎裕通
Original Assignee
日立全球先端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立全球先端科技股份有限公司 filed Critical 日立全球先端科技股份有限公司
Publication of TWD187804S publication Critical patent/TWD187804S/zh

Links

Abstract

【物品用途】;本設計的物品是基板處理組件,為一種應用於半導體晶圓的製造,具有兩個處理空間,且具備:形成有分別連接在該兩個處理空間的氣體供給路及排氣路的真空處理室;和用以將基板分別保持在該真空處理室內的驅動式基板台的基板處理組件。於本物品中,如「使用狀態之參考圖」所示,在兩個真空處理室中央部配置複數個(參考圖中為四個)氣體導入閥,在該氣體導入閥的上游與各真空處理室連接的氣體配管,以及在該氣體導入閥的下游與氣體供給裝置連接的氣體配管是經由過濾器而連接。藉此就能均勻地將處理氣體供給到各真空處理室內。;【設計說明】;另外,使用狀態之參考圖,是在複數個氣體導入閥下方(前述過濾器的前方)配置蓋板之狀態的圖。;圖式所揭露之虛線部分,為本案不主張設計之部分。

Description

基板處理組件之部分
本設計的物品是基板處理組件,為一種應用於半導體晶圓的製造,具有兩個處理空間,且具備:形成有分別連接在該兩個處理空間的氣體供給路及排氣路的真空處理室;和用以將基板分別保持在該真空處理室內的驅動式基板台的基板處理組件。於本物品中,如「使用狀態之參考圖」所示,在兩個真空處理室中央部配置複數個(參考圖中為四個)氣體導入閥,在該氣體導入閥的上游與各真空處理室連接的氣體配管,以及在該氣體導入閥的下游與氣體供給裝置連接的氣體配管是經由過濾器而連接。藉此就能均勻地將處理氣體供給到各真空處理室內。
另外,使用狀態之參考圖,是在複數個氣體導入閥下方(前述過濾器的前方)配置蓋板之狀態的圖。
圖式所揭露之虛線部分,為本案不主張設計之部分。
TW106301392F 2016-12-09 2017-03-17 Part of the substrate processing component TWD187804S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2016-26822F JP1582104S (zh) 2016-12-09 2016-12-09
JP2016-026822 2016-12-09

Publications (1)

Publication Number Publication Date
TWD187804S true TWD187804S (zh) 2018-01-11

Family

ID=59351723

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106301392F TWD187804S (zh) 2016-12-09 2017-03-17 Part of the substrate processing component

Country Status (3)

Country Link
US (1) USD831086S1 (zh)
JP (1) JP1582104S (zh)
TW (1) TWD187804S (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM492529U (zh) 2013-03-14 2014-12-21 Applied Materials Inc 使用具有加熱器的基板支撐台的基板支撐組件

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD556226S1 (en) * 2005-08-23 2007-11-27 Motoman, Inc. Robotic bartender and bar
USD581438S1 (en) * 2006-08-30 2008-11-25 Tie Tao Liu Hydraulic mechanism
USD675172S1 (en) * 2008-11-14 2013-01-29 Applied Materials, Inc. Substrate support
USD623673S1 (en) * 2008-12-24 2010-09-14 Applied Materials, Inc. Large area substrate processor
JP1456090S (zh) 2012-01-13 2015-11-16
JP1456479S (zh) 2012-01-13 2015-11-16
JP1545407S (zh) * 2015-06-16 2016-03-14
USD805044S1 (en) * 2015-10-30 2017-12-12 Hirata Corporation Adhesive sheet for substrate
USD811457S1 (en) * 2015-11-02 2018-02-27 Hirata Corporation Substrate conveyance arm
USD785578S1 (en) * 2016-03-22 2017-05-02 Asm Ip Holding B.V. Substrate supporting arm for semiconductor manufacturing apparatus
USD808350S1 (en) * 2017-03-06 2018-01-23 Topline Corporation Fixture for delivering interconnect members onto a substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM492529U (zh) 2013-03-14 2014-12-21 Applied Materials Inc 使用具有加熱器的基板支撐台的基板支撐組件

Also Published As

Publication number Publication date
USD831086S1 (en) 2018-10-16
JP1582104S (zh) 2017-07-24

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