TWD188261S - Part of the substrate processing component - Google Patents
Part of the substrate processing componentInfo
- Publication number
- TWD188261S TWD188261S TW106301391F TW106301391F TWD188261S TW D188261 S TWD188261 S TW D188261S TW 106301391 F TW106301391 F TW 106301391F TW 106301391 F TW106301391 F TW 106301391F TW D188261 S TWD188261 S TW D188261S
- Authority
- TW
- Taiwan
- Prior art keywords
- gas
- vacuum processing
- article
- processing chamber
- reference picture
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract description 9
- 238000010586 diagram Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000011144 upstream manufacturing Methods 0.000 abstract description 2
- 239000007789 gas Substances 0.000 abstract 10
- 235000012431 wafers Nutrition 0.000 abstract 1
Abstract
【物品用途】;本設計的物品是基板處理組件,為一種應用於半導體晶圓的製造,具有兩個處理空間,且具備:形成有分別連接在該兩個處理空間的氣體供給路及排氣路的真空處理室;和用以將基板分別保持在該真空處理室內的驅動式基板台的基板處理組件。於本物品中,如「使用狀態之參考圖」所示,在兩個真空處理室中央部配置複數個(參考圖中為四個)氣體導入閥,在該氣體導入閥的上游與各真空處理室連接的氣體配管,以及在該氣體導入閥的下游與氣體供給裝置連接的氣體配管是經由過濾器而連接。藉此就能均勻地將處理氣體供給到各真空處理室內。;【設計說明】;另外,使用狀態之參考圖,是在複數個氣體導入閥下方(前述過濾器的前方)配置蓋板之狀態的圖。;圖式所揭露之虛線部分,為本案不主張設計之部分。
Description
本設計的物品是基板處理組件,為一種應用於半導體晶圓的製造,具有兩個處理空間,且具備:形成有分別連接在該兩個處理空間的氣體供給路及排氣路的真空處理室;和用以將基板分別保持在該真空處理室內的驅動式基板台的基板處理組件。於本物品中,如「使用狀態之參考圖」所示,在兩個真空處理室中央部配置複數個(參考圖中為四個)氣體導入閥,在該氣體導入閥的上游與各真空處理室連接的氣體配管,以及在該氣體導入閥的下游與氣體供給裝置連接的氣體配管是經由過濾器而連接。藉此就能均勻地將處理氣體供給到各真空處理室內。
另外,使用狀態之參考圖,是在複數個氣體導入閥下方(前述過濾器的前方)配置蓋板之狀態的圖。
圖式所揭露之虛線部分,為本案不主張設計之部分。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2016-26821F JP1582103S (zh) | 2016-12-09 | 2016-12-09 | |
JP2016-026821 | 2016-12-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD188261S true TWD188261S (zh) | 2018-02-01 |
Family
ID=59351791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106301391F TWD188261S (zh) | 2016-12-09 | 2017-03-17 | Part of the substrate processing component |
Country Status (3)
Country | Link |
---|---|
US (1) | USD831085S1 (zh) |
JP (1) | JP1582103S (zh) |
TW (1) | TWD188261S (zh) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM492529U (zh) | 2013-03-14 | 2014-12-21 | Applied Materials Inc | 使用具有加熱器的基板支撐台的基板支撐組件 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD556226S1 (en) * | 2005-08-23 | 2007-11-27 | Motoman, Inc. | Robotic bartender and bar |
USD581438S1 (en) * | 2006-08-30 | 2008-11-25 | Tie Tao Liu | Hydraulic mechanism |
USD675172S1 (en) * | 2008-11-14 | 2013-01-29 | Applied Materials, Inc. | Substrate support |
USD623673S1 (en) * | 2008-12-24 | 2010-09-14 | Applied Materials, Inc. | Large area substrate processor |
JP1456090S (zh) | 2012-01-13 | 2015-11-16 | ||
JP1456479S (zh) | 2012-01-13 | 2015-11-16 | ||
JP1545407S (zh) * | 2015-06-16 | 2016-03-14 | ||
USD805044S1 (en) * | 2015-10-30 | 2017-12-12 | Hirata Corporation | Adhesive sheet for substrate |
USD811457S1 (en) * | 2015-11-02 | 2018-02-27 | Hirata Corporation | Substrate conveyance arm |
USD785578S1 (en) * | 2016-03-22 | 2017-05-02 | Asm Ip Holding B.V. | Substrate supporting arm for semiconductor manufacturing apparatus |
USD808350S1 (en) * | 2017-03-06 | 2018-01-23 | Topline Corporation | Fixture for delivering interconnect members onto a substrate |
-
2016
- 2016-12-09 JP JPD2016-26821F patent/JP1582103S/ja active Active
-
2017
- 2017-03-17 TW TW106301391F patent/TWD188261S/zh unknown
- 2017-06-07 US US29/606,718 patent/USD831085S1/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM492529U (zh) | 2013-03-14 | 2014-12-21 | Applied Materials Inc | 使用具有加熱器的基板支撐台的基板支撐組件 |
Also Published As
Publication number | Publication date |
---|---|
JP1582103S (zh) | 2017-07-24 |
USD831085S1 (en) | 2018-10-16 |
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