USD808350S1 - Fixture for delivering interconnect members onto a substrate - Google Patents

Fixture for delivering interconnect members onto a substrate Download PDF

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Publication number
USD808350S1
USD808350S1 US29/596,169 US201729596169F USD808350S US D808350 S1 USD808350 S1 US D808350S1 US 201729596169 F US201729596169 F US 201729596169F US D808350 S USD808350 S US D808350S
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US
United States
Prior art keywords
fixture
delivering
substrate
members onto
interconnect members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/596,169
Inventor
Martin B. Hart
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Topline Corp
Original Assignee
Topline Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Topline Corp filed Critical Topline Corp
Priority to US29/596,169 priority Critical patent/USD808350S1/en
Assigned to TOPLINE CORPORATION reassignment TOPLINE CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HART, MARTIN B.
Application granted granted Critical
Publication of USD808350S1 publication Critical patent/USD808350S1/en
Application status is Active legal-status Critical
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top perspective view of a fixture for delivering interconnect members onto a substrate, with a base plate shown in broken lines, showing my new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a front side view thereof;

FIG. 8 is a rear side view thereof;

FIG. 9 is a top exploded perspective view thereof;

FIG. 10 is a bottom exploded perspective view thereof; and,

FIG. 11 is a bottom view of a top plate of the fixture for delivering interconnect members onto a substrate, in which the base plate in broken lines is removed for ease of illustration.

The broken lines depict environmental features that form no part of the claimed design, including the array of openings in the center of the top plate.

Claims (1)

    CLAIM
  1. The ornamental design for a fixture for delivering interconnect members onto a substrate, as shown and described.
US29/596,169 2017-03-06 2017-03-06 Fixture for delivering interconnect members onto a substrate Active USD808350S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/596,169 USD808350S1 (en) 2017-03-06 2017-03-06 Fixture for delivering interconnect members onto a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/596,169 USD808350S1 (en) 2017-03-06 2017-03-06 Fixture for delivering interconnect members onto a substrate

Publications (1)

Publication Number Publication Date
USD808350S1 true USD808350S1 (en) 2018-01-23

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Family Applications (1)

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US29/596,169 Active USD808350S1 (en) 2017-03-06 2017-03-06 Fixture for delivering interconnect members onto a substrate

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD831085S1 (en) * 2016-12-09 2018-10-16 Hitachi High-Technologies Corporation Substrate processing unit
USD831086S1 (en) * 2016-12-09 2018-10-16 Hitachi High-Technologies Corporation Substrate processing unit
USD847237S1 (en) * 2016-12-09 2019-04-30 Hitachi High-Technologies Corporation Substrate processing unit

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
US4664309A (en) 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4705205A (en) 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4712721A (en) 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
US4842184A (en) 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US5029748A (en) 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
US5040717A (en) 1990-03-27 1991-08-20 Metcal, Inc. Solder delivery system
US5497938A (en) 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
US5626278A (en) 1994-04-15 1997-05-06 Tang; Ching C. Solder delivery and array apparatus
US5695109A (en) 1995-11-22 1997-12-09 Industrial Technology Research Institute Solder paste inter-layer alignment apparatus for area-array on-board rework
USD402274S (en) * 1997-04-01 1998-12-08 Sony Corporation Connector for printed circuit boards
US6136128A (en) 1998-06-23 2000-10-24 Amerasia International Technology, Inc. Method of making an adhesive preform lid for electronic devices
US6204678B1 (en) * 1997-03-17 2001-03-20 Micron Technology, Inc. Direct connect interconnect for testing semiconductor dice and wafers
US6276596B1 (en) 2000-08-28 2001-08-21 International Business Machines Corporation Low temperature solder column attach by injection molded solder and structure formed
US6296173B2 (en) 1996-07-17 2001-10-02 International Business Machines Corporation Method and apparatus for soldering ball grid array modules to substrates
US6412685B2 (en) 1997-01-28 2002-07-02 Galahad, Co. Method and apparatus for release and optional inspection for conductive preforms placement apparatus
USD503691S1 (en) * 2001-03-28 2005-04-05 International Rectifier Corporation Conductive clip for a semiconductor package
US6955285B2 (en) 2002-12-17 2005-10-18 Senju Metal Industry Co., Ltd. Apparatus for aligning and dispensing solder columns in an array
US20090223710A1 (en) 2008-03-07 2009-09-10 International Business Machines Corporation Method of Forming Solid Vias in a Printed Circuit Board
US20090267227A1 (en) 2008-04-24 2009-10-29 Lockheed Martin Corporation Plastic ball grid array ruggedization
US8277255B2 (en) * 2010-12-10 2012-10-02 Tyco Electronics Corporation Interconnect member for an electronic module with embedded components
US20140262498A1 (en) 2013-03-13 2014-09-18 U.S.A. As Represented By The Administrator Of The National Aeronautics And Space Administration Interconnect Device and Assemblies Made Therewith
US9108262B1 (en) 2014-04-17 2015-08-18 Topline Corporation Disposable apparatus for aligning and dispensing solder columns in an array
US9629259B1 (en) * 2016-08-16 2017-04-18 Topline Corporation Refillable apparatus for aligning and depositing solder columns in a column grid array

Patent Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
US4664309A (en) 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4705205A (en) 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4712721A (en) 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
US5029748A (en) 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
US4842184A (en) 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US5040717A (en) 1990-03-27 1991-08-20 Metcal, Inc. Solder delivery system
US5626278A (en) 1994-04-15 1997-05-06 Tang; Ching C. Solder delivery and array apparatus
US5497938A (en) 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
US5695109A (en) 1995-11-22 1997-12-09 Industrial Technology Research Institute Solder paste inter-layer alignment apparatus for area-array on-board rework
US6296173B2 (en) 1996-07-17 2001-10-02 International Business Machines Corporation Method and apparatus for soldering ball grid array modules to substrates
USD407383S (en) * 1996-12-11 1999-03-30 Sony Corporation Connector for printed circuit boards
USD402273S (en) * 1996-12-26 1998-12-08 Sony Corporation Connector for printed circuit boards
US6412685B2 (en) 1997-01-28 2002-07-02 Galahad, Co. Method and apparatus for release and optional inspection for conductive preforms placement apparatus
US6204678B1 (en) * 1997-03-17 2001-03-20 Micron Technology, Inc. Direct connect interconnect for testing semiconductor dice and wafers
USD402274S (en) * 1997-04-01 1998-12-08 Sony Corporation Connector for printed circuit boards
USD421968S (en) * 1998-04-21 2000-03-28 Advantest Corporation Contactor for semiconductor IC testers
USD432504S (en) * 1998-04-21 2000-10-24 Advantest Corporation Contactor for semiconductor IC testers
USD426522S (en) * 1998-04-21 2000-06-13 Advantest Corporation Contactor for semiconductor IC testers
US6136128A (en) 1998-06-23 2000-10-24 Amerasia International Technology, Inc. Method of making an adhesive preform lid for electronic devices
US6276596B1 (en) 2000-08-28 2001-08-21 International Business Machines Corporation Low temperature solder column attach by injection molded solder and structure formed
USD503691S1 (en) * 2001-03-28 2005-04-05 International Rectifier Corporation Conductive clip for a semiconductor package
US6955285B2 (en) 2002-12-17 2005-10-18 Senju Metal Industry Co., Ltd. Apparatus for aligning and dispensing solder columns in an array
US20090223710A1 (en) 2008-03-07 2009-09-10 International Business Machines Corporation Method of Forming Solid Vias in a Printed Circuit Board
US20090267227A1 (en) 2008-04-24 2009-10-29 Lockheed Martin Corporation Plastic ball grid array ruggedization
US8277255B2 (en) * 2010-12-10 2012-10-02 Tyco Electronics Corporation Interconnect member for an electronic module with embedded components
US20140262498A1 (en) 2013-03-13 2014-09-18 U.S.A. As Represented By The Administrator Of The National Aeronautics And Space Administration Interconnect Device and Assemblies Made Therewith
US9108262B1 (en) 2014-04-17 2015-08-18 Topline Corporation Disposable apparatus for aligning and dispensing solder columns in an array
US9629259B1 (en) * 2016-08-16 2017-04-18 Topline Corporation Refillable apparatus for aligning and depositing solder columns in a column grid array

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD831085S1 (en) * 2016-12-09 2018-10-16 Hitachi High-Technologies Corporation Substrate processing unit
USD831086S1 (en) * 2016-12-09 2018-10-16 Hitachi High-Technologies Corporation Substrate processing unit
USD847237S1 (en) * 2016-12-09 2019-04-30 Hitachi High-Technologies Corporation Substrate processing unit

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