USD808350S1 - Fixture for delivering interconnect members onto a substrate - Google Patents
Fixture for delivering interconnect members onto a substrate Download PDFInfo
- Publication number
- USD808350S1 USD808350S1 US29/596,169 US201729596169F USD808350S US D808350 S1 USD808350 S1 US D808350S1 US 201729596169 F US201729596169 F US 201729596169F US D808350 S USD808350 S US D808350S
- Authority
- US
- United States
- Prior art keywords
- delivering
- fixture
- substrate
- interconnect members
- members onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrates Substances 0.000 title claims description 4
Images
Description
The broken lines depict environmental features that form no part of the claimed design, including the array of openings in the center of the top plate.
Claims (1)
- The ornamental design for a fixture for delivering interconnect members onto a substrate, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/596,169 USD808350S1 (en) | 2017-03-06 | 2017-03-06 | Fixture for delivering interconnect members onto a substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/596,169 USD808350S1 (en) | 2017-03-06 | 2017-03-06 | Fixture for delivering interconnect members onto a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
USD808350S1 true USD808350S1 (en) | 2018-01-23 |
Family
ID=60956585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/596,169 Active USD808350S1 (en) | 2017-03-06 | 2017-03-06 | Fixture for delivering interconnect members onto a substrate |
Country Status (1)
Country | Link |
---|---|
US (1) | USD808350S1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD831085S1 (en) * | 2016-12-09 | 2018-10-16 | Hitachi High-Technologies Corporation | Substrate processing unit |
USD831086S1 (en) * | 2016-12-09 | 2018-10-16 | Hitachi High-Technologies Corporation | Substrate processing unit |
USD847237S1 (en) * | 2016-12-09 | 2019-04-30 | Hitachi High-Technologies Corporation | Substrate processing unit |
USD874413S1 (en) | 2018-11-02 | 2020-02-04 | Topline Corporation | Fixture for delivering 1752 solder columns onto a substrate |
USD908648S1 (en) | 2019-12-12 | 2021-01-26 | Topline Corporation | Adjustable fixture for aligning column grid array substrates |
Citations (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3838984A (en) * | 1973-04-16 | 1974-10-01 | Sperry Rand Corp | Flexible carrier and interconnect for uncased ic chips |
US4664309A (en) | 1983-06-30 | 1987-05-12 | Raychem Corporation | Chip mounting device |
US4705205A (en) | 1983-06-30 | 1987-11-10 | Raychem Corporation | Chip carrier mounting device |
US4712721A (en) | 1986-03-17 | 1987-12-15 | Raychem Corp. | Solder delivery systems |
US4842184A (en) | 1988-06-23 | 1989-06-27 | Ltv Aerospace & Defense Company | Method and apparatus for applying solder preforms |
US5029748A (en) | 1987-07-10 | 1991-07-09 | Amp Incorporated | Solder preforms in a cast array |
US5040717A (en) | 1990-03-27 | 1991-08-20 | Metcal, Inc. | Solder delivery system |
US5497938A (en) | 1994-09-01 | 1996-03-12 | Intel Corporation | Tape with solder forms and methods for transferring solder to chip assemblies |
US5626278A (en) | 1994-04-15 | 1997-05-06 | Tang; Ching C. | Solder delivery and array apparatus |
US5695109A (en) | 1995-11-22 | 1997-12-09 | Industrial Technology Research Institute | Solder paste inter-layer alignment apparatus for area-array on-board rework |
USD402273S (en) * | 1996-12-26 | 1998-12-08 | Sony Corporation | Connector for printed circuit boards |
USD402274S (en) * | 1997-04-01 | 1998-12-08 | Sony Corporation | Connector for printed circuit boards |
USD407383S (en) * | 1996-12-11 | 1999-03-30 | Sony Corporation | Connector for printed circuit boards |
USD421968S (en) * | 1998-04-21 | 2000-03-28 | Advantest Corporation | Contactor for semiconductor IC testers |
USD426522S (en) * | 1998-04-21 | 2000-06-13 | Advantest Corporation | Contactor for semiconductor IC testers |
US6136128A (en) | 1998-06-23 | 2000-10-24 | Amerasia International Technology, Inc. | Method of making an adhesive preform lid for electronic devices |
US6204678B1 (en) * | 1997-03-17 | 2001-03-20 | Micron Technology, Inc. | Direct connect interconnect for testing semiconductor dice and wafers |
US6276596B1 (en) | 2000-08-28 | 2001-08-21 | International Business Machines Corporation | Low temperature solder column attach by injection molded solder and structure formed |
US6296173B2 (en) | 1996-07-17 | 2001-10-02 | International Business Machines Corporation | Method and apparatus for soldering ball grid array modules to substrates |
US6412685B2 (en) | 1997-01-28 | 2002-07-02 | Galahad, Co. | Method and apparatus for release and optional inspection for conductive preforms placement apparatus |
USD503691S1 (en) * | 2001-03-28 | 2005-04-05 | International Rectifier Corporation | Conductive clip for a semiconductor package |
US6955285B2 (en) | 2002-12-17 | 2005-10-18 | Senju Metal Industry Co., Ltd. | Apparatus for aligning and dispensing solder columns in an array |
US20090223710A1 (en) | 2008-03-07 | 2009-09-10 | International Business Machines Corporation | Method of Forming Solid Vias in a Printed Circuit Board |
US20090267227A1 (en) | 2008-04-24 | 2009-10-29 | Lockheed Martin Corporation | Plastic ball grid array ruggedization |
US8277255B2 (en) * | 2010-12-10 | 2012-10-02 | Tyco Electronics Corporation | Interconnect member for an electronic module with embedded components |
US20140262498A1 (en) | 2013-03-13 | 2014-09-18 | U.S.A. As Represented By The Administrator Of The National Aeronautics And Space Administration | Interconnect Device and Assemblies Made Therewith |
US9108262B1 (en) | 2014-04-17 | 2015-08-18 | Topline Corporation | Disposable apparatus for aligning and dispensing solder columns in an array |
US9629259B1 (en) * | 2016-08-16 | 2017-04-18 | Topline Corporation | Refillable apparatus for aligning and depositing solder columns in a column grid array |
-
2017
- 2017-03-06 US US29/596,169 patent/USD808350S1/en active Active
Patent Citations (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3838984A (en) * | 1973-04-16 | 1974-10-01 | Sperry Rand Corp | Flexible carrier and interconnect for uncased ic chips |
US4664309A (en) | 1983-06-30 | 1987-05-12 | Raychem Corporation | Chip mounting device |
US4705205A (en) | 1983-06-30 | 1987-11-10 | Raychem Corporation | Chip carrier mounting device |
US4712721A (en) | 1986-03-17 | 1987-12-15 | Raychem Corp. | Solder delivery systems |
US5029748A (en) | 1987-07-10 | 1991-07-09 | Amp Incorporated | Solder preforms in a cast array |
US4842184A (en) | 1988-06-23 | 1989-06-27 | Ltv Aerospace & Defense Company | Method and apparatus for applying solder preforms |
US5040717A (en) | 1990-03-27 | 1991-08-20 | Metcal, Inc. | Solder delivery system |
US5626278A (en) | 1994-04-15 | 1997-05-06 | Tang; Ching C. | Solder delivery and array apparatus |
US5497938A (en) | 1994-09-01 | 1996-03-12 | Intel Corporation | Tape with solder forms and methods for transferring solder to chip assemblies |
US5695109A (en) | 1995-11-22 | 1997-12-09 | Industrial Technology Research Institute | Solder paste inter-layer alignment apparatus for area-array on-board rework |
US6296173B2 (en) | 1996-07-17 | 2001-10-02 | International Business Machines Corporation | Method and apparatus for soldering ball grid array modules to substrates |
USD407383S (en) * | 1996-12-11 | 1999-03-30 | Sony Corporation | Connector for printed circuit boards |
USD402273S (en) * | 1996-12-26 | 1998-12-08 | Sony Corporation | Connector for printed circuit boards |
US6412685B2 (en) | 1997-01-28 | 2002-07-02 | Galahad, Co. | Method and apparatus for release and optional inspection for conductive preforms placement apparatus |
US6204678B1 (en) * | 1997-03-17 | 2001-03-20 | Micron Technology, Inc. | Direct connect interconnect for testing semiconductor dice and wafers |
USD402274S (en) * | 1997-04-01 | 1998-12-08 | Sony Corporation | Connector for printed circuit boards |
USD421968S (en) * | 1998-04-21 | 2000-03-28 | Advantest Corporation | Contactor for semiconductor IC testers |
USD432504S (en) * | 1998-04-21 | 2000-10-24 | Advantest Corporation | Contactor for semiconductor IC testers |
USD426522S (en) * | 1998-04-21 | 2000-06-13 | Advantest Corporation | Contactor for semiconductor IC testers |
US6136128A (en) | 1998-06-23 | 2000-10-24 | Amerasia International Technology, Inc. | Method of making an adhesive preform lid for electronic devices |
US6276596B1 (en) | 2000-08-28 | 2001-08-21 | International Business Machines Corporation | Low temperature solder column attach by injection molded solder and structure formed |
USD503691S1 (en) * | 2001-03-28 | 2005-04-05 | International Rectifier Corporation | Conductive clip for a semiconductor package |
US6955285B2 (en) | 2002-12-17 | 2005-10-18 | Senju Metal Industry Co., Ltd. | Apparatus for aligning and dispensing solder columns in an array |
US20090223710A1 (en) | 2008-03-07 | 2009-09-10 | International Business Machines Corporation | Method of Forming Solid Vias in a Printed Circuit Board |
US20090267227A1 (en) | 2008-04-24 | 2009-10-29 | Lockheed Martin Corporation | Plastic ball grid array ruggedization |
US8277255B2 (en) * | 2010-12-10 | 2012-10-02 | Tyco Electronics Corporation | Interconnect member for an electronic module with embedded components |
US20140262498A1 (en) | 2013-03-13 | 2014-09-18 | U.S.A. As Represented By The Administrator Of The National Aeronautics And Space Administration | Interconnect Device and Assemblies Made Therewith |
US9108262B1 (en) | 2014-04-17 | 2015-08-18 | Topline Corporation | Disposable apparatus for aligning and dispensing solder columns in an array |
US9629259B1 (en) * | 2016-08-16 | 2017-04-18 | Topline Corporation | Refillable apparatus for aligning and depositing solder columns in a column grid array |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD831085S1 (en) * | 2016-12-09 | 2018-10-16 | Hitachi High-Technologies Corporation | Substrate processing unit |
USD831086S1 (en) * | 2016-12-09 | 2018-10-16 | Hitachi High-Technologies Corporation | Substrate processing unit |
USD847237S1 (en) * | 2016-12-09 | 2019-04-30 | Hitachi High-Technologies Corporation | Substrate processing unit |
USD874413S1 (en) | 2018-11-02 | 2020-02-04 | Topline Corporation | Fixture for delivering 1752 solder columns onto a substrate |
USD908648S1 (en) | 2019-12-12 | 2021-01-26 | Topline Corporation | Adjustable fixture for aligning column grid array substrates |
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