TWD169005S - 反應管之部分 - Google Patents
反應管之部分Info
- Publication number
- TWD169005S TWD169005S TW103305359D01F TW103305359D01F TWD169005S TW D169005 S TWD169005 S TW D169005S TW 103305359D01 F TW103305359D01 F TW 103305359D01F TW 103305359D01 F TW103305359D01 F TW 103305359D01F TW D169005 S TWD169005 S TW D169005S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- case
- article
- gas supply
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 4
Abstract
【物品用途】;本設計的物品是反應管,為一種在將基板排列成複數段來進行處理的基板處理裝置中,用來將基板收容在本物品的內部的反應管。;【設計說明】;在本物品的內側,設置具有複數個氣體供給口的氣體供給部,將從氣體供給口所導入的氣體,形成對於基板呈水平,且從上部至下部均勻的流動,並從氣體排氣口被排氣;再者,外管上部的外壁,是保有比側壁更厚實膨凸形狀和構造強度。本衍生設計與原設計之外觀差異在於:如各圖所示,兩者反應管的頂部略有所不同,本案為向上隆起的圓拱狀,因此本案與原設計案之差異些微,不影響原設計與衍生設計之近似。;圖式所揭露之實線部分,為本案主張設計之部分;圖式所揭露之虛線部分,為本案不主張設計之部分;圖式中一點鏈線所圍繞者,係界定本案所欲主張之範圍,該一點鏈線本身為本案不主張設計之部分。本物品全體為透明。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014005211 | 2014-03-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD169005S true TWD169005S (zh) | 2015-07-11 |
Family
ID=55175340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103305359D01F TWD169005S (zh) | 2014-03-12 | 2014-09-12 | 反應管之部分 |
Country Status (2)
Country | Link |
---|---|
US (1) | USD748594S1 (zh) |
TW (1) | TWD169005S (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1534829S (zh) * | 2015-02-23 | 2015-10-13 | ||
USD813181S1 (en) * | 2016-07-26 | 2018-03-20 | Hitachi Kokusai Electric Inc. | Cover of seal cap for reaction chamber of semiconductor |
USD801176S1 (en) * | 2016-08-16 | 2017-10-31 | Partners in Packaging, LLC | Container cover |
USD820086S1 (en) * | 2017-02-13 | 2018-06-12 | Partners in Packaging, LLC | Container cover |
JP1620194S (zh) * | 2018-01-22 | 2018-12-10 | ||
USD1004111S1 (en) * | 2021-01-19 | 2023-11-07 | R2 Technologies, Inc. | Treatment tip of a cooling treatment device |
USD1004112S1 (en) * | 2021-01-19 | 2023-11-07 | R2 Technologies, Inc. | Treatment tip of a cooling treatment device |
USD990630S1 (en) * | 2021-05-28 | 2023-06-27 | Charlotte Grace | Sink cover |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD268394S (en) * | 1979-08-03 | 1983-03-29 | Phillips Petroleum Company | Combined cap and extruding plunger for dispensing container |
KR890008922A (ko) * | 1987-11-21 | 1989-07-13 | 후세 노보루 | 열처리 장치 |
JP3024449B2 (ja) * | 1993-07-24 | 2000-03-21 | ヤマハ株式会社 | 縦型熱処理炉及び熱処理方法 |
JP3218164B2 (ja) * | 1995-05-31 | 2001-10-15 | 東京エレクトロン株式会社 | 被処理体の支持ボート、熱処理装置及び熱処理方法 |
USD406113S (en) * | 1997-01-31 | 1999-02-23 | Tokyo Electron Limited | Processing tube for use in a semiconductor wafer heat processing apparatus |
USD405429S (en) * | 1997-01-31 | 1999-02-09 | Tokyo Electron Limited | Processing tube for use in a semiconductor wafer heat processing apparatus |
USD424024S (en) * | 1997-01-31 | 2000-05-02 | Tokyo Electron Limited | Quartz process tube |
USD417438S (en) * | 1997-01-31 | 1999-12-07 | Tokyo Electron Limited | Quartz outer tube |
USD423463S (en) * | 1997-01-31 | 2000-04-25 | Tokyo Electron Limited | Quartz process tube |
USD404368S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Outer tube for use in a semiconductor wafer heat processing apparatus |
USD405062S (en) * | 1997-08-20 | 1999-02-02 | Tokyo Electron Ltd. | Processing tube for use in a semiconductor wafer heat processing apparatus |
USD405431S (en) * | 1997-08-20 | 1999-02-09 | Tokyo Electron Ltd. | Tube for use in a semiconductor wafer heat processing apparatus |
JP2000243747A (ja) * | 1999-02-18 | 2000-09-08 | Kokusai Electric Co Ltd | 基板処理装置 |
USD443040S1 (en) * | 2000-04-04 | 2001-05-29 | American Standard International Inc. | Cap |
US20020102187A1 (en) * | 2001-01-26 | 2002-08-01 | Bellenger Denise Dicharry | Sectioned fragrance candle |
JP3985899B2 (ja) * | 2002-03-28 | 2007-10-03 | 株式会社日立国際電気 | 基板処理装置 |
USD536614S1 (en) * | 2005-12-01 | 2007-02-13 | J.L. Clark, Inc. | Container lid |
USD600659S1 (en) * | 2006-09-12 | 2009-09-22 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
TWD125600S1 (zh) * | 2006-10-12 | 2008-10-21 | 東京威力科創股份有限公司 | 半導體製造用加工處理管 |
USD619630S1 (en) * | 2007-05-08 | 2010-07-13 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
USD564879S1 (en) * | 2007-07-17 | 2008-03-25 | Rieke Corporation | Plastic plug with overcap |
TWD143034S1 (zh) * | 2008-03-28 | 2011-10-01 | 東京威力科創股份有限公司 | 半導體製造用處理管 |
TWD133943S1 (zh) * | 2008-05-09 | 2010-03-21 | 日立國際電氣股份有限公司 | 反應管 |
USD610559S1 (en) * | 2008-05-30 | 2010-02-23 | Hitachi Kokusai Electric, Inc. | Reaction tube |
USD597840S1 (en) * | 2008-12-24 | 2009-08-11 | Drug Plastics & Glass Company, Inc. | Bottle cap |
USD657675S1 (en) * | 2011-04-07 | 2012-04-17 | Averill Walter J | Reusable resilient bottle capsule |
USD720309S1 (en) * | 2011-11-18 | 2014-12-30 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
USD720308S1 (en) * | 2011-11-18 | 2014-12-30 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
USD710196S1 (en) * | 2012-09-11 | 2014-08-05 | Becton Dickinson and Company Limited | Soft cap for a connector |
TWD168774S (zh) * | 2013-06-28 | 2015-07-01 | 日立國際電氣股份有限公司 | 反應管之部分 |
TWD167987S (zh) * | 2013-06-28 | 2015-05-21 | 日立國際電氣股份有限公司 | 反應管之部分 |
-
2014
- 2014-09-10 US US29/501,923 patent/USD748594S1/en active Active
- 2014-09-12 TW TW103305359D01F patent/TWD169005S/zh unknown
Also Published As
Publication number | Publication date |
---|---|
USD748594S1 (en) | 2016-02-02 |
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