TWD125600S1 - 半導體製造用加工處理管 - Google Patents

半導體製造用加工處理管

Info

Publication number
TWD125600S1
TWD125600S1 TW096301947F TW96301947F TWD125600S1 TW D125600 S1 TWD125600 S1 TW D125600S1 TW 096301947 F TW096301947 F TW 096301947F TW 96301947 F TW96301947 F TW 96301947F TW D125600 S1 TWD125600 S1 TW D125600S1
Authority
TW
Taiwan
Prior art keywords
cylinder
groove portion
long groove
view
semiconductor manufacturing
Prior art date
Application number
TW096301947F
Other languages
English (en)
Inventor
井上久司
遠藤篤史
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TWD125600S1 publication Critical patent/TWD125600S1/zh

Links

Abstract

【物品用途】;本創作的物品是一種半導體製造用加工處理管,主要;為用來製造半導體時,作為反應氣體的導入路徑,讓反;應氣體從設置在其內壁的透孔,供應到反應管內。;【創作特點】;如各圖所示,該加工處理管為一透明的圓筒體,該圓;筒體的下方設置一向外突出的管口,且在管口的附近,;如前視圖及B-B剖面圖所示,形成一條自圓筒體的一側;向上延伸且略突出於外周的長槽部,且如C-C剖面圖所;示,該長槽部與圓筒體是藉由設置在長槽部之內壁上錯;開配置的許多小孔所連通,以此形成管體的導入路徑;綜上所述,確為一深具科技美感之設計。;
TW096301947F 2006-10-12 2007-04-10 半導體製造用加工處理管 TWD125600S1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006027524 2006-10-12

Publications (1)

Publication Number Publication Date
TWD125600S1 true TWD125600S1 (zh) 2008-10-21

Family

ID=40349734

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096301947F TWD125600S1 (zh) 2006-10-12 2007-04-10 半導體製造用加工處理管

Country Status (2)

Country Link
US (1) USD586768S1 (zh)
TW (1) TWD125600S1 (zh)

Families Citing this family (34)

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Publication number Priority date Publication date Assignee Title
TWD127410S1 (zh) * 2007-04-20 2009-02-11 東京威力科創股份有限公司 半導體製造用製程管
TWD143034S1 (zh) * 2008-03-28 2011-10-01 東京威力科創股份有限公司 半導體製造用處理管
TWD133943S1 (zh) * 2008-05-09 2010-03-21 日立國際電氣股份有限公司 反應管
USD610559S1 (en) * 2008-05-30 2010-02-23 Hitachi Kokusai Electric, Inc. Reaction tube
USD655258S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD655262S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD720308S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD724551S1 (en) * 2011-11-18 2015-03-17 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD725053S1 (en) * 2011-11-18 2015-03-24 Tokyo Electron Limited Outer tube for process tube for manufacturing semiconductor wafers
US9816184B2 (en) 2012-03-20 2017-11-14 Veeco Instruments Inc. Keyed wafer carrier
USD712852S1 (en) * 2012-03-20 2014-09-09 Veeco Instruments Inc. Spindle key
TWD168774S (zh) * 2013-06-28 2015-07-01 日立國際電氣股份有限公司 反應管之部分
TWD167985S (zh) * 2013-06-28 2015-05-21 日立國際電氣股份有限公司 反應管之部分
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
TWD167986S (zh) * 2013-06-28 2015-05-21 日立國際電氣股份有限公司 反應管之部分
TWD167987S (zh) * 2013-06-28 2015-05-21 日立國際電氣股份有限公司 反應管之部分
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
USD776801S1 (en) * 2014-06-24 2017-01-17 Kobe Steel, Ltd Heat exchanger tube
JP1534829S (zh) * 2015-02-23 2015-10-13
JP1534828S (zh) * 2015-02-23 2015-10-13
JP1535455S (zh) * 2015-02-25 2015-10-19
JP1546345S (zh) * 2015-09-04 2016-03-22
JP1548462S (zh) * 2015-09-04 2016-04-25
JP1546512S (zh) * 2015-09-04 2016-03-22
JP6462161B2 (ja) * 2016-02-09 2019-01-30 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置および半導体装置の製造方法
JP1605460S (zh) * 2017-08-09 2021-05-31
JP1605461S (zh) * 2017-08-10 2021-05-31
JP1605982S (zh) * 2017-12-27 2021-05-31
USD918669S1 (en) * 2019-03-18 2021-05-11 Beau Lucas Storage container
JP1644260S (zh) * 2019-03-20 2019-10-28
USD931823S1 (en) * 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
USD1017338S1 (en) * 2021-07-06 2024-03-12 Beau Lucas Storage container

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
JP3024449B2 (ja) * 1993-07-24 2000-03-21 ヤマハ株式会社 縦型熱処理炉及び熱処理方法
USD406113S (en) * 1997-01-31 1999-02-23 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD404368S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Outer tube for use in a semiconductor wafer heat processing apparatus
USD405062S (en) * 1997-08-20 1999-02-02 Tokyo Electron Ltd. Processing tube for use in a semiconductor wafer heat processing apparatus
US5948300A (en) * 1997-09-12 1999-09-07 Kokusai Bti Corporation Process tube with in-situ gas preheating
JP2000243747A (ja) * 1999-02-18 2000-09-08 Kokusai Electric Co Ltd 基板処理装置
JP3497450B2 (ja) * 2000-07-06 2004-02-16 東京エレクトロン株式会社 バッチ式熱処理装置及びその制御方法
US6538237B1 (en) * 2002-01-08 2003-03-25 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus for holding a quartz furnace
TWD104755S1 (zh) * 2003-11-04 2005-05-21 東京威力科創股份有限公司 半導體製造裝置之處理管
USD520467S1 (en) * 2003-11-04 2006-05-09 Tokyo Electron Limited Process tube for semiconductor device manufacturing apparatus

Also Published As

Publication number Publication date
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