TW595095B - Arrangement and method for impedance matching - Google Patents

Arrangement and method for impedance matching Download PDF

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Publication number
TW595095B
TW595095B TW091101984A TW91101984A TW595095B TW 595095 B TW595095 B TW 595095B TW 091101984 A TW091101984 A TW 091101984A TW 91101984 A TW91101984 A TW 91101984A TW 595095 B TW595095 B TW 595095B
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Taiwan
Prior art keywords
node
current
impedance matching
inductance
capacitor
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TW091101984A
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English (en)
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Philippe Riondet
Gilles Montoriol
Jacques Trichet
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Motorola Inc
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Publication of TW595095B publication Critical patent/TW595095B/zh

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    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H11/00—Networks using active elements
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    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/38—Impedance-matching networks
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Description

595095 A7 B7 五、發明説明（1 發明範疇 本發明係關於抗阻匹配，特別的是關於電源放大器的阻 抗匹配。 發明背景 在本發明的範脅中，已經熟知的係如果想要從元件，例 如電源放大器，進行理想的能量傳輸的話，該電源放大器 的輸出阻抗必須與由該電源放大器所驅動的電路的輸入阻 抗匹配。實際上，電源放大器，例如積體電路（1C)電源放大 器（PA)，輸出阻抗通常係藉由電機/電子網路，包括安置於 該1C外部並且以線路連接至該1C的電感及電容元件進行匹 配。通常會使用線路黏接以連接該線路。電容係金屬-氧化-半導體電容（MOSCAPs)或表面黏著元件（SMD)電容。電感 則通常由傳導線，例如微線路（microstrip)或共面線路 (coplanar line)，利用上述的電容在精確的位置處轉接至接 地（ground)而產生。 不過，此方法的缺點是因為成本考量，所以該SMD電容 的品質較差其會導致損失及嚴重的串聯寄生電感使得頻寬 變窄，而且大範圍的容限值會影響到各種效能參數上該PA RF的效能誤差。此外，此類SMD的電容，因為其係自動 地拾取及放置（picked and placed)，所以具有最小的間隔規 格以符合該組裝機器的限制，因此會增加整體的電源放大 器應用尺寸。 所以必須進行阻抗匹配以便減少上述的缺點。 發明聲明 -5- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)
裝 訂
線 595095 A7
根據本發明第一觀點提供一種如申請專利範圍第1項用於 阻抗匹配之裝置。 根據本發明第二觀點提供一種如申請專利範圍第13項用 於阻抗匹配之方法。 圖式簡單說明 現在將僅透過實例，參考隨附的圖式對引用本發明之用 於阻抗匹配之四種裝置及方法作說明，其中： 圖1所示的係用於阻抗匹配之已知的裝置的部份剖面圖； 圖2所示的係引用本發明用於阻抗匹配之第一種新賴裝置 的部份剖面圖； 圖3所示的係圖2裝置的等效電子電路之方塊圖； 圖4所示的係圖3中電路的部份圖式； 圖5所示的係引用本發明利用兩個阻抗匹配單元，引用本 發明，進行阻抗匹配之第二種新穎裝置的部份剖面圖； 圖6所示的係與圖2原理相同的第三種新穎裝置的部份剖 面圖，利用交錯配置，引用本發明，進行阻抗匹配；以及 圖7所示的係與圖2原理相同的第四種新穎裝置的部份剖 面圖，利用具有兩個晶粒的交錯配置，引用本發明，進行 阻抗匹配。 較佳具體實例說明 首先參考圖1，電源放大器102(例如使用於無線電應用之 模組雙頻PA)之已知的阻抗匹配裝置1〇〇具有幾條利用傳統 的線路黏接技術黏貼在具有RF電源電晶體1 〇8要進行匹配的 1C 106及印刷傳輸線路110之間的線路1〇4。外部的表面黏 , 裝* 訂
線 -6-
595095 A7 ___B7 五、發明説明（3 ) 接元件（SMD)電容112係連接在接地卜訂也化⑺⑽幻及印刷傳 輸線路110的準確位置之間與線路1〇4相隔一段距離的位置。 在此裝置中可以瞭解的係電感（Llin + iwire)係利用印刷傳輸 線路110實現的，其長度決定電感值Lline，而該線路的電感 則會決定電感值lwire。印刷傳輸線路110的長度係由SMD電 谷112的準確位置所界定。此類裝置會構成一匹配單元其會 增加RF電源電晶體1〇8的輸出阻抗。通常在實際上，單獨使 用一阻抗匹配單元並無法使得該輸出阻抗達到一般需要的 50歐姆（從不匹配的3歐姆提昇）而且不降低電源放大器1〇2 之RF效能。接著會需要一額外的匹配單元並且將一第二 SMD電容連接在接地及印刷傳輸線路u〇的準確位置之間與 該第一SMD電容相隔一段距離的位置。對雙頻的電源放大 器應用而言，每個頻帶都需要一所述的裝置。 在此方法中，可以瞭解的係該印刷傳輸線路的長度，其 因為其寬度所以電感值較低，以及使用SMD電容，其需要 符合自動拾取及放置（pick-and-place)機器所要求的元件-元 件（component-to_component)之間的間隔，所以會大幅地增 加該電源放大器應用的尺寸及成本。 此外，因為成本考量，所以SMD電容的品質較差其會導 致損失及嚴重的串聯寄生電感使得頻寬變窄，而且大範圍 的容限值會影響到各種效能參數上該PARF的效能誤差。 - 現在參考圖2，雙頻帶無線電電源放大器模組的第一種新 -穎阻抗匹配裝置200具有幾條利用傳統的線路黏接技術黏貼 在具有RF電源電晶體206 (要進行匹配）的1C 204及積體 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 裝 訂
595095 A7 B7_____ 五、發明説明（4 ) 電容208以及分別為：印刷傳輸線路210，第一黏接墊212及 第二黏墊214，之間的線路2〇2a_2〇2f。 該印刷傳輸線路21〇，該第一黏接墊212及該第二黏接墊 214各利用兩條線路202連接至該1C 204(其中的個別層2〇4a ，204b，204c):該印刷傳輸線路210(其係共面線路或微線 路傳輸線路）係由兩條線路2〇2a及202b連接至1C層204c處的 積體電容208，該第一黏接墊212係由一條線路202c連接到 1C層204a處的RF電源電晶體206以及由一條線路202d連接到 1C層204b處的積體電容208，而該第二黏接墊214則由一條 線路202e連接到1C層204b處的積體電容208以及由一條線路 202f連接到1C層204a處的RF電源電晶體206。將於下面作細 部的說明，在線路對（202c & 202d，202e & 202f)中，某一 條線路（202c，202f)會從該IC 204上的RF電源電晶體206載 送RF電流，而另一條線路（202d，202e)則會將RF電流載送 到該1C 204上的積體電容208。可以瞭解的係實際上，為增 加電流載送量，個別敘述的線路202a，202b，202c，202d ，202e及202f實際上會聚集成線路群組，每個群組具有兩 條或多條線路β 在阻抗匹配裝置200中可以瞭解的係線路對（202c & 202d ，202e & 202f)會以反向平行的方式載送RF電流，因此其間 會產生交互電感其對該線路的自有電感會有負向加成的效 果進而產生耦合電感^可以瞭解的係此負向加成的效果會 降低每對線路的電感（與圖1中已知的裝置相比較），並且進 一步可以瞭解的係這會降低達到該第一匹配單元所需要的 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 595095 A7 _______B7__ 五、發明説明（5 P" " 一 低電感值的可能性。此外，圖2中的裝置的對稱幾何提供該 RF電源電晶體206具有熱特性及電子特性良好平衡（wei^ balanced)的工作狀態。 可以理解的係雖然已經參考電源放大器的輸出阻抗匹配 於上面對本發明進行說明，不過本發明還可以使用於多級 (multi-stage)放大器的各級之間（interstage)的匹配網路中。 現在參考圖3，阻抗匹配裝置2〇〇之等效電子電路300具有 一由電感L，該電感係由線路對（202c&202d)及（202e及202f) 所產生的電感Led及Lef平行放置所產生的，及一電容c(其 係整合於與該PA 1C相同的晶粒中）所構成的匹配單元302。 現在參考圖4，圖中的匹配單元302之示意圖400所示的係 該裝置並未使用外部元件，因為該電容C已經整合至該1C晶 粒中以及該電感係由上述的線路對202所構成。因此可以瞭 解的係該阻抗匹配裝置200可以提供高Q值的元件，小晶粒 的尺寸並且與圖1中已知的裝置比較起來所需要的外部元件 數量較少。 現在參考圖5，雙頻帶無線電電源放大器模組的第二種新 穎阻抗匹配裝置500，與圖2中的相似，利用兩個阻抗匹配 單元。在該兩個單元裝置500中具有幾條利用傳統的線路黏 接技術黏貼在具有RF電源電晶體506要進行匹配的1C 504(分 別在504a，504b及504c中）及積體電容508與509(圖中有兩 個部份509.1及509.2)以及分別為：印刷傳輸線路522，第一 一 黏接墊5 14及第二黏墊516，第三黏接墊518及第四黏墊520 ，之間的線路502a-502j。 -9- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 裝’ 訂
線 595095 A7 B7
五、發明説明（6 ) 該第一黏接墊514及第二黏墊516會分別利用線路502c及 502j連接以接收1C層504a處的1C 504的RF電流；該第一黏接 墊5 14及第二黏墊516會分別利用線路502d及502i連接以便 將RF電流傳送到引用積體電容508之該1C 504的504b層。該 第三黏接墊518及第四黏墊520會分別利用線路502e及502h 連接以便接收到引用積體電容508之該1C 504的504b層處的 RF電流；該第三黏接墊518及第四黏墊520會分別利用線路 502f及502g連接以便將RF電流傳送到引用積體電容509之該 1C 504的5 04c層，其會利用線路502a及502b連接到該印刷傳 輸線路522 〇 在阻抗匹配裝置500中，可以瞭解的係線路對（202c &202d，202e & 202f，202g & 202h，202i & 202j)會以反向 平行的方式載送RF電流，因此其間會產生交互電感其對該 線路的自有電感會有負向加成的效果進而產生耦合電感， 與圖2中的裝置200相同，其優點如上所述。可以進一步瞭 解的係因為該裝置500引用兩個阻抗匹配單元（分別是514， 502c，502d，516，502i，502j，508及518，502e，502f， 520，502g，502h，509)，與圖2中的單一單元裝置200比較 起來，電源玫大器504的輸出阻抗可以更有效地從一般的3Ω 增加到所希望的50 Ω。 現在參考圖6，第三種新穎阻抗匹配裝置600與圖2中的單 一單元裝置的原理類似並且引用交錯配置。雙頻帶無線電 一 電源放大器模組的阻抗匹配裝置600具有幾條利用傳統的線 路黏接技術黏貼在具有RF電源電晶體606要進行匹配的1C -10- 本紙張尺度適用中國國家榡準(CNS) A4規格(210 X 297公釐)
裝 訂
線 595095 A7 B7 五、發明説明（7 ) 604，積體電容608，黏接區610及印刷傳輸線路622之間的 線路602。該積體電容6〇8分散在IC晶粒上，而分別將電流 從電晶體606傳送到黏接區610，從黏接區610傳送到積體電 容608以及從積體電容608傳送到印刷傳輸線路622的線路 602則交錯分布於該晶粒上。在此方法中可以瞭解的是，該 裝置600具有上面圖2中裝置200的全部優點，同時因為rf電 流傳導遍佈整個晶粒所以另外還可以進行更有效的熱及電 子操作^ 可以瞭解的係圖6的裝置600，因為其係基於類似上面圖2 中的裝置200的單一阻抗匹配單元，亦可以延伸成兩個或多 個阻抗匹配單元。 現在參考圖7，第四種新穎阻抗匹配裝置7〇〇與圖6的裝置 600類似’並且引用交錯配置同時利用兩個不同的晶粒。雙 頻帶無線電電源放大器模組之阻抗匹配裝置7〇〇具有幾條利 用傳統的線路黏接技術黏貼在具有RF電源電晶體706要進行 匹配的第一 1C晶粒704a，引用積體電容708的第二1C晶粒 704b，黏接區710及印刷傳輸線路722之間的線路702。如圖 6中的裝置600，該積體電容708分散在1C晶粒704b上，而分 別將電流從該1C晶粒704a上的電晶體706傳送到黏接區710 ’伙黏¥區傳送到該1C晶粒704b上積體電容708以及從 該1C晶粒704b上的積體電容708傳送到印刷傳輸線路722的 線路702則父錯分布於該晶粒上。在此方法中可以瞭解的係 ’該裝置700具有上面圖2中裝置200的全部優點還具有圖6 中裝置600額外的熱分散的優點。另外可以暸解的係因為利 -11- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 595095 A7 B7 五、發明説明（8 ) 用兩個晶粒704a及704b，而且因為晶粒704a(其通常係一種 較南成本的砷化鎵半導體）的尺寸可以降低至只提供該電 源電晶體706所需要的大小，而提供該積體電容7〇8的晶粒 704b可以較低成本的矽半導體製造，所以該裝置7〇〇可以降 低該裝置的整體成本。 可以瞭解的係圖7中的阻抗匹配裝置70〇，因為其係基於 類似如上所述之圖2中的裝置200及圖6中的裝置600的單一 阻抗匹配單元，所以可以延伸成兩個或多個阻抗匹配單元 。在此情形中，該第二單元（以及任何其它的單元）所需要的 電容全部都可以提供在成本較低的晶粒7〇4b中。 可以瞭解的係雖然本發明已經於上面針對RF電源放大器 作說明’但是本發明另外可以使用在較高或較低頻率或在 其它需要阻抗轉換，例如，壓控振盪器（VCO)或低雜訊放大 器（LNA)的應用中。亦可以瞭解的係本發明可以使用於標準
調變例如 GSM，CDMA，TDMA，W-CDMA，GPRS , EDGE ’ UMTS，或是其它所希望的調變技術的電信應用中β 可以理解的係上述用於阻抗匹配的裝置及方法提供下列 的優點·· •易於執行 •增加匹配的準確性 •需要較少的外部元件 •易於製造 •不需要專屬的設計流程 •只需要標準1C生產及測試工具 -12- 本紙張尺度適用中國國家標準(CNS) Α4規格(210X 297公釐) 裝， 訂
線 595095 A7 B7 五 發明説明（9 ) •使用低損失匹配網路 •只會些微地增加晶粒的大小（因為電容整合的原因） ，但因為外部元件的數量降低所以本方式的總體尺寸 會大幅地減少（例如減少50%)。 -13- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)

Claims (1)

  1. 1. 一種用於阻抗匹配之裝置（200)，包括· 電流的第一節點 一用以接收要進行阻抗匹配的輪出 (204a)； 一用以接收來自該第一節點的輪出電流的第二節點 (212 » 214)； 即點 -用以將電流從㈣-節點載送到該第二節點 電流導體（202c);以及 流的第三節點 一用以接收來自該第二節點的輪出 (204b)； 一用以將電流從該第二節點載送到該第三節點的第二 電流導體（202d);以及 一耦合至該第三節點的電容構件（208)，藉此該第一及 第二電流導體非常的接近，因此其電感係其自有電感及 其負交互電感的總和。 2 ·如申請專利範圍第1項之阻抗匹配裝置，其中該第一節 點及該第三節點係提供於積體電路（2〇4)中。 3·如申請專利範圍第1項之阻抗匹配裝置，其中該第一節 點及該第三節點係提供於個別的積體電路（7〇4a，7〇4b) 中0 4 ·如申凊專利範圍第1、2或3項之阻抗匹配裝置，進一步 包括： 一用以接收來自該第三節點的輸出電流的第四節點 (518 , 520); 一用以將電流從該第三節點載送到該第四節點的第三 本紙張尺度適用中國國家標準(CMS) A4規格(210X 297公釐） 595095 作年今月了日
    A8 B8 C8 D8 申請專利範圍 電流導體（502e，502h); 一用以接收來自該第四節點的輸出電流之第五節點； 以及 一用以將電流從該第四節點載送到該第五節點的第四 電流導體（502f，502g)， K而δ亥第二及第四電流導體非常的接近，因此其電感 係其自有電感及其負交互電感的總和。 5·如申請專利範圍第4項之阻抗匹配裝置，其中該電容裝 置包括： 一耗合至該第三節點的第一電容（5〇8);以及 一耦合至第五節點用以耦合至傳輸線（522)之第二電容 (509) 〇 6· —種用於阻抗匹配之方法，包括·· 提供一用以接收要進行阻抗匹配之輸出電流的第一節 點（204a); 提供一用以接收來自該第一節點的輸出電流的第二節 點（212，214); 提供一用以將電流從該第一節點載送到該第二節點之 第一電流導體（202c);以及 提供一用以接收來自該第二節點的輸出電流之第三節 點（204b); 提供一用以將電流從該第二節點栽送到該第三節點 第二電流導體（202d);以及 提供耦合到該第三節點的電容裝置（2〇8), -2-
    595095
    8 8 8 8 A B c D 々、申請專利範圍 藉此該第一及第二電流導體非常的接近，因此其電感 係其自有電感及其負交互電感的總和。 -3- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐）
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CN1494741A (zh) 2004-05-05
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CN1284238C (zh) 2006-11-08
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KR100862874B1 (ko) 2008-10-15
EP1237189A1 (en) 2002-09-04
HK1064208A1 (en) 2005-01-21
JP2004523172A (ja) 2004-07-29
US20070159266A1 (en) 2007-07-12
WO2002069403A1 (en) 2002-09-06
US20040085152A1 (en) 2004-05-06
US7432778B2 (en) 2008-10-07

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