TW593127B - Interference display plate and manufacturing method thereof - Google Patents

Interference display plate and manufacturing method thereof Download PDF

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Publication number
TW593127B
TW593127B TW092122676A TW92122676A TW593127B TW 593127 B TW593127 B TW 593127B TW 092122676 A TW092122676 A TW 092122676A TW 92122676 A TW92122676 A TW 92122676A TW 593127 B TW593127 B TW 593127B
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Taiwan
Prior art keywords
substrate
scope
item
opening
manufacturing
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TW092122676A
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English (en)
Inventor
Wen-Jian Lin
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Prime View Int Co Ltd
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Priority to TW092122676A priority Critical patent/TW593127B/zh
Priority to US10/807,128 priority patent/US7532385B2/en
Priority to JP2004102019A priority patent/JP3886502B2/ja
Priority to KR1020040043323A priority patent/KR100639173B1/ko
Application granted granted Critical
Publication of TW593127B publication Critical patent/TW593127B/zh
Priority to US12/463,312 priority patent/US8004736B2/en

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0009Structural features, others than packages, for protecting a device against environmental influences
    • B81B7/0012Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion or pin assignment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/04Optical MEMS
    • B81B2201/045Optical switches

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Micromachines (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

593127 玖、發明說明 【發明所屬之技術領域】 本發明是有關於一種平面顯示器,且特別是有關於一 種光干涉式顯示面板。 【先前技術】
平面顯示器由於具有體積小、重量輕的特性,在可攜 式顯示設備,以及小空間應㈣_器市場中極具優勢。 現今的平面顯示器除液晶顯示器仏咖^ Qysw D—,LCD)、有機電激發光二極體(〇哪心 EleCtr〇-Luminescent Display,〇LED)和電漿顯示哭 (Plasma Display Pane卜PDP)等等之外,一種利用光干; 式的平面顯示模式已被提出。 V
此-由光干涉式可變色畫素單元陣列所形成的顯 器之特色在本質上具有低電力耗能、快速應答⑽
Time)及雙穩態(Bi_Stable)特性,將可應用於顯示器之 板’特別是在可攜式(P(mable)產品之應用,例如;于動: 活(MobUe Ph〇ne)、個人數位助理 (P〇mbleComputer)...等等。 了攜式電月 請參見美國第5,835,255號專利,該專利 一_ 見光的調整元件(ΑΠ^ Modulate),即為—^ ΓΑ早二,:來作為平面顯示器之用。請參見帛1Α圖,; 圖係繪示習知可變色畫素單元的剖面示意圖。每一偏 5 593127 可變色畫素單A 100形成於-基板110之上,包含兩道牆 _1)102及104,兩道牆1〇2、1〇4間係由支撐物1〇6所 支撐而形成腔室(Cavity) 108。兩道牆1〇2、1〇4間的距 離也就疋腔至108的長度為D。牆1〇2係為一光入射電 極具有光吸收率,可吸收部分可見光。牆丨〇4則係為一 光反射電極’利用電壓驅動可以使其產生形變。 通常利用白光作為此可變色晝素單元1〇〇的入射光 源’白光係包含可見光頻譜範圍中各種不同波長(Wave Length,以λ表示)的光線所混成。當入射光穿過牆ι〇2 而進入腔室108中時,僅有符合公式1.1中波長限制的入 射光會在腔體1〇8中產生建設性干涉而被反射輸出,其中 Ν為自然數。換句話說, 2D= Ν λ 丨 (1.1) 當腔室108的兩倍長度2D滿足入射光波長;ί 1之整 數倍時,即可使此入射光波長λ 1在此腔室108中產生建 設性干涉,而輸出該波長λ 1之反射光。此時,觀察者的 眼睛順著入射光入射牆1 〇2的方向觀察,可以看到波長為 λ 1的反射光,因此,對可變色畫素單元1〇〇而言係處於” 開’’的狀態,即為一亮態狀態。 第1Β圖係繪示第1Α圖中之可變色畫素單元1〇〇在 加上電壓後的剖面示意圖。請參照第1Β圖,在電壓的驅 6 W127 動下’牆104會因為靜電吸引力而產生形變,向牆ι〇2 的方向塌下。此時,兩道牆i 〇2、丨〇4間的距離,也就是 腔室108的長度並不為零,而是為(1,且此d可以等於零。 也就是說’公式1 · 1中的D將以d置換,入射光中所 有光線的波長中’僅有符合公式1 · 1的波長(A 2)可以在腔 體108中產生建設性干涉,經由牆1〇4的反射穿透牆1〇2 而輸出。在此可變色晝素單元丨〇〇中,牆1 〇2被設計成對 波長為λ 2的光具有較高的光吸收率,因此入射光中的所 有光線均被濾除’對順著入射光入射牆丨〇2的方向觀察之 觀察者而言,將不會看到任何的光線被反射出來。因此, 此時對可變色畫素單元1〇〇而言係處於,,關,,的狀態,即為 一暗態狀態。 如上所述,在電壓的驅動下,牆丨04會因為靜電吸引 力而產生形變,向牆102的方向塌下,使得此可變色畫素 單元1 0 0由’’開’’的狀態切換為’’關”的狀態。而當可變色書 素單元100要由"關,,的狀態切換為,,開,,的狀態時,則必須 先移除用以驅動牆104形變的電壓,接著,依靠自己本身 的形變恢復力,失去靜電吸引力作用的牆1〇4會恢復成如 第1圖之原始的狀態,使此可變色晝素單元丨〇〇呈現一,, 開π的狀態。 然而,上述之光反射電極(牆104)為一薄膜層 (Membrane),其材質一般為金屬材料,且通常係利用微機 電結構糸統(Micro Electro Mechanical System,MEMS)中 7 593127 的犧牲層技術來製造。此光反射電極之厚度非常薄,因此 非常容易因外力的些許碰觸就造成損傷,而影響其致動的 能力。再者,腔室108為一空氣間隙(AirGap),用以間隔 上述兩電極(牆102與牆1〇4)。然而,實際上卻經常會因 為外在環i兄的影響而損害此可變色晝素單元1 的顯示 σσ質。尤其是在其製造過程中,外在環境對可變色畫素單 元1 〇〇所造成的破壞特別嚴重。 舉例來說,在製造過程中,例如上述之犧牲層被蝕刻 移除之後,空氣中的水分子非常容易就吸附在腔室108 之中。腔室108之長度D —般會小於i ,此時吸附的 水刀子會在兩電極之間產生不必要的靜電吸引力,當此可 鲨色畫素單το 100要呈現一”開”的狀態時,卻會因為水分 子的靜電吸引力,讓兩電極相互吸附而靠在一起,使得此 可變色畫素單元1 00反而呈現一,,關,,的狀態。 或者在製造過程中,例如上述之犧牲層被蝕刻移出除 後,或是加工切割基板時,空氣中的灰塵也可能吸附於腔 至108之中,妨礙光反射電極之正常開關操作。此外,空 氣中的氧氣接觸到此兩電極後,也會氧化此兩電極,因而 改變此兩電極的光學或電性特性。 【發明内容】 有鑑於此,本發明提供一保護結構與基板黏合,使得 可k色畫素單兀被密封包覆於其中,以試圖來解決上述之 8 J題羔而,右疋在製程中先移除犧牲層,然後再黏合保 蒦、、。構/、基板,則依照此步驟順序所生產之可變色畫素單 凡,雖可略為降低上述問題對可變色晝素單元的影響,仍 …、無法全避免上述之問題。因為在移除犧牲層之後,進 行保護層的製程之前,可變色畫素單元仍會暴露於大氣之 中,此時大氣中的水分子與氧氣還是會影響可變色畫素單 元而^成可變色晝素單元功效的下降。 因此本毛明的目的就是在提供一種光干涉式顯示面 ,以及其製造方法,用以防止空氣中之水分子、灰塵或氧 氣在製造過程中破壞光干涉式反射結構。 本卷明之另一目的就是在提供一種光干涉式顯示面 板以及其製造方法,用以保護其中的光干涉式反射結構。 本I明之X目的就是在提供一種光干涉式顯示面 板以及其製造方法,用以提高光干涉式顯示面板的顯示品 質,並增加其可靠度以及延長其使用壽命。 本么明之#目的就是在提供一種光干涉式顯示面 板以及其製k方法’將結構釋放蝕刻製程置於保護結構與 基板黏合步驟之後,以防止習知光干涉式反射結構之犧牲 層被#刻後,因暴露於夫裔φ 、 路於大乱中而被水分子與氧氣破壞的問 題。 本發明之更-目的就是在提供—種光干涉式顯示面 板以及其製造方法’利用保護結構、基板以及黏合結構形 h具有開’㈣該開口進行—結構釋放製程以 593127 移除光干涉式反射結構之犧牲層,以降低水分子與氧氣破 壞光干涉式反射結構的機會。 根據本發明之上述目❺,提出一種光干涉式顯示面板 以及其製造方法。先在一基板上依序形成第一電極及犧牲 層,再於第一電極及犧牲層中形成第一開口以適用於形成 — 支撐物於其内。在第一開口内形成支撐物,然後再形成第 - 二電極於犧牲層及支撐物之上,以形成一微機電結構。接 著,利用黏合結構黏合一保護結構與基板,以形成一腔體 _ 將微機電結構包覆於其中,且此腔體之側壁上至少預留一 第二開口。進行一結構釋放蝕刻製程(Release以仏 Process),經由第二開口以一蝕刻劑移除犧牲層而形成腔 至。隶後將此第二開口封閉,使光干涉式反射結構被密封 於基板以及保護結構之間。 依照本發明一較佳實施例,光干涉式反射結構包含複 數個可變色畫素單元。黏合結構係將保護結構與基板之黏 合面之四周松封。保護結構之外型為一平板結構,例如一 籲 玻璃基板,黏合結構為紫外線膠、熱固膠或其他黏著劑。 再者’黏合結構中係添加間隙物(Spacer)。在另一較佳實 施例中,保護結構之外型亦可為一门字型結構或一側壁具 · 有上述之第二開口之门字型結構。 在本發明中,第二開口在腔體上之位置、形狀以及數 量並不限定,當第二開口越大或數目越多時,則結構釋放 14刻製程之鍅刻效率越好。第二開口之位置若能均勻分散 10 593127 於腔體之上,則可提升整體㈣製程之均勻性。 im4:二口二形成方式可先利用黏合結構將基板與保 第蒦T間完全封閉,然後再利用切割或其他方法形成此 :-:口。或是在一開始利用黏合結構封閉時,即先預留 第二開口亦可。 在此實施例中,結構釋放姓刻製程為-遠端姑刻電漿 餘刻製程。遠端姓刻電漿㈣製程係以含有氟基或是氣基 的蝕刻劑,例如二氟化氤、四氟化碳、三氯化硼、三氟化 氮或六氟化硫等蝕刻劑等為前驅物以產生一遠端電漿蝕 刻犧牲層。 本卷明係在進行結構釋放蝕刻製程以移除犧牲層之 丽,利用一接合結構先黏合保護結構與基板,以形成一腔 體將微機電結構包覆於其中,且此腔體之側壁上預留至少 一開口,以供進行後續之結構釋放蝕刻製程。如此可避免 在製造過程中,產品為了進行不同製程而暴露於大氣之 中,使得空氣中之水分子、灰塵或氧氣有機會影響光干涉 式反射結構’並傷害到光干涉式反射結構。 再者’保護結構與基板黏合,將微機電結構包覆於其 中,如此可以避免因外力直接碰觸而破壞光干涉式反射結 構。再者’最後並利用黏合結構將光干涉式反射結構密封 於基板以及保護結構之中,可有效地避免外在環境,例如 空氣中的水分子、灰塵或氧氣,接觸到光干涉式反射結構 而產生靜電吸引力或氧化其金屬薄膜,而破壞其光學或電 11 593127 性特性。因此,本發明可揾并本工 」捉开先干涉式顯示面板的顯示品 質,減少缺陷的發生率,並延具豆 卞上·延長其使用的壽命。 【實施方式】 為了避免空乳中之水分子、灰塵或氧氣在製造過程中 破壞光干涉式反射結構,本發明心—種光干涉式顯示面 板以及其製造方法。 本發明之製造方法係先在一基板上依序形成第一電 極及犧牲層,再於第一電極及犧牲層中形成第一開口以適 用於形成支撐物於其内。在第—開口内形成支撐物,然後 形成第二電極於犧牲層及支撐物之上,以形成一微機電結 構。接著,利用黏合結構黏合一保護結構與基板,以形成 一腔體將微機電結構包覆於其中,且此腔體之側壁上至少 預^弟一開口進行一結構釋放餘刻製程(Reiease Etch Process),經由第二開口以一蝕刻劑移除犧牲層而形成腔 至,最後將此第二開口封閉,使光干涉式反射結構被密封 於基板以及保護結構之間。 第2A圖係繪示本發明之一較佳實施例之剖面示意 圖。光干涉式反射結構由複數個可變色畫素單元組成,為 了表不方便,在解說以及圖中僅以一個可變晝素單元 1〇〇,來代表本發明之光干涉式顯示面板中之光干涉式反 射結構。如第2A圖所示,一平板保護結構2〇〇a利用黏 12 593127 合結構202與基板110黏合,其中此基板11〇例如為一破 璃基板或-對可見光透明之基板。如此平板保護結構 2〇〇a就可減少外力碰觸到可變色畫素單元1〇〇的機會。 再者,在此實施例中,黏合結構202係將平板保護結 構200a與基板11〇之黏合面的四周密封,使得可變色全 素單元1〇〇與外界環境隔絕,以避免空氣中的水分子、= 塵或氧氣侵入而損壞可變色畫素單元1〇〇。 如上所述,空氣中的水分子若進入可變色畫素單元 100之腔室108,由於腔t 1〇8之距離D相當小,因此水 分子之靜電吸引力會相對的變大,造成可變色晝素單元 100之開關無法順利切換的問題。若氧氣接觸到可變色畫 素早70中之金屬薄m,例如光人射電極以及光反射電極, 則因為金屬薄膜十分容易氧化,因此氧氣會氧化金屬薄 膜而破壞可麦色晝素單元1 00之光學以及電性特性。 本I月中之黏合結構在黏合保護結構以及基板時,可 一併將可變色畫素單元與外界隔絕,隔絕的程度越高,則 防止可變色畫素單元受到外界破壞的效果越好。依照本發 月之車又‘實施例’當黏合結構係以密封的方式黏合保護 結構以及基板,將可變色畫素單元完全密封於其中時,此 時可變色畫素單7L之可靠度以及使用壽命均可被大幅地 提昇。 在此實施例中,+板保護結才冓200a A 一玻璃基板。 黏合結構2G2之材t係使用紫外線膠或熱固膠。然而,其 13 593127 他適用於黏合平板保護結構200a與基板11〇之黏合結構 亦可運用於本發明之中,並不受本實施例所限制。σ… 此外,值得注意的是,平板保護結構2〇〇a在與基板 110黏合時,通常會經過一壓合過程,施以一力壓合使平 板保護結構200a在與基板110更緊密地黏合在一起。為 了避免在;C a日守,平板保護結構2 〇 〇 a壓壞可變色金素^ 凡100之牆104,或是避免之後保護結構時受到外力產2 偏移或在基板處傾斜的情形,本發明更可在黏合結構逝 中加入間隙物(spacer)。 具有間隙物的黏合結構2〇2除了可以防止平板保護 結構20〇a在壓合時壓壞可變色畫素單元⑽,並且可以 使平板保護結構2〇〇a與基板11〇之間保持固定的距離。 以本較佳實施例來說,間隙物的尺寸約在刚心,而可 變色晝素單元i 00之尺寸 寸通小於1 # m,因此平板保 I構與牆104相距相當大的距離 之壓壞的問題。 I王上4 ❿ 二圖係繪示本發明之另—較佳實施例之示意圖。 例中’本發明所提供之保護結構為一门字型保護 的°平板姓槿此门字型保護結構2嶋係為一具有延伸側壁 二,=構。同樣地’门字型保護結構雇利用黏合結 2 合’如此不但可減少外力碰觸到可變 =二元100的機會,而且也可避免空氣中的水分子、 乳侵入而損壞可變色畫素單元100。 14 593127 第3A圖至第3 C圖係繪示本發明之製造方法之示意 圖。如前所述’為了表示方便,在解說以及圖中僅以一個 可變晝素單元來代表光干涉式反射結構。請參照第3A 圖’在一基板309上先依序形成電極31〇及犧牲層311, 此犧牲層之材質為介電材質、金屬材質或矽材質。再於電 極3 10及犧牲層3 11中形成開口 3 12以適用於形成支撐物 306於其内。接著,在開口 312内形成支撐物3〇6,然後 形成電極314於犧牲層311及支撐物3〇6之上,以形成一 微機電結構。 明參知、第3B圖,利用黏合結構3〇8將平板保護結構 304與基板309黏合起來,將微機電結構包覆於其中,且 在此黏合結構308中至少預留一開口 32〇。而且,在黏合 時,可施以一壓合過程使平板保護結構3〇4與基板3〇9 之黏合更為緊密。此外,若利用熱固膠作為黏合結構 308,則可加上一加熱過程,使熱固膠能夠受熱而固定。 接著,進行一結構釋放蝕刻製程(Release以吮 Process),例如一遠端電漿蝕刻製程,經由開口 32〇以一 蝕刻劑移除犧牲層311而形成腔室316(犧牲層3ιι的位 置),腔室316的長度D即為犧牲層311的厚度。遠端蝕 刻電漿㈣製程係以含有氟基或是氯基的_劑,例如二 氟化氤、四氣化碳、三氣化蝴、三氟化氮或六氟化硫等餘 刻劑等為前驅物以產生一遠端電漿蝕刻犧牲層3ιι。 如第3 C圖所示,當上述之結構釋放蝕刻製程完成之 15 593127 後,即包含利用抽氣或其他方法將上述之蝕刻劑清除乾淨 之後,利用一黏合結構328將開口 32〇封閉起來,使得微 機電結構被密封於保護結構304與基板309之間。黏合結 構328之材質可為紫外線膠或熱固膠。依照本發明之另一 實施例,亦可用其他物體來封閉開口 32〇,例如塑膠、金 屬片或聚合物薄片等,並不㈣於本實施例中之黏合結構 328所使用之紫外線膠或熱固膠。 侍注意的是,此處用來封閉開口 32〇的黏合結構 328中並不需要加入間隙物。也就是說,黏合結構3⑽與 黏合結構328不-定為相同的材料。黏合結構·有時為 了要使基板309與平板保護結構3〇4之間保持一固定的距 離,因此會在其中加入間隙物。而另一方面,黏合結構 只是為了封閉開口 320之用,因此其中不必加入 物0 -以上的說明係解釋具有平板保護結構之光干涉式顯 造方法,而第2B圖中之具有门字型保 式^面板,其製造方法也與第3a圖與第a 說明。""I a方法相當類似,因此以下僅對其做簡單地 :先’在一基板上形成一微機電結構,包含第 黏著電極以及位於兩電極之間的犧牲層。接著,利用 機電結構包覆於其中。最後,經由腔體之側壁上腔:開將口微 16 593127
牙】用結構釋放蝕刻製程蝕刻微機電結構中的犧牲層,再將 炎匕 B B 汗口封閉起來。同樣地,當黏合時,可施以壓合過程使 门子保護結構與基板之黏合更為緊密。如此,即可製造 完成第2B圖中具有门字型保護結構之光干涉式顯示面 板。 第4A圖至第4C圖係繪示本發明之數個實施例之側 面不意圖,用以說明第3B圖中之開口 32〇之配置與形 狀。如第4A圖所示,本發明中之開口 412係位於黏合結 構406之上’其位置並不限定,且可為任何形狀,當開口 12越大日守’則結構釋放钱刻製程之姓刻效率越好。 再者,本發明中開口的數目可不止為一個,如第4B 圖之實施例所示,黏合結構4〇6係具有兩個開口 414,開 口數越多’則結構釋放蝕刻製程之蝕刻效率也越好。而 且,開口的位置若能均勻分散於黏合結構4〇6之上,則可 提升整體蝕刻製程之均勻性。 此外,依照本發明之另一實施例,此開口甚至可為基 板402與平板保護結構4〇4之一邊,如第4c圖中所示之 開口 416。在利用黏合結構4〇6黏合基板4〇2與平板保護 結構404日夺,預留其中一邊作為開口 416,以供後來的結 構釋放蝕刻製程通入餘刻劑之用。 此開口的形成方式可先利用黏合結構將基板與保護 結構之間完全封閉1後再㈣切割或其他方法形成此開 口。或是在-開始利用黏合結構封閉時,即先預留開口亦 17 593127 可。 本發明中用於進行結構釋放蝕刻製程之開口,除了如 上述之實施例中所示係位於接合結構之外,依照本發明之 另一較佳實施例,當保護結構為门字型保護結構時,此開 口亦可位於此门字型保護結構之側壁之上。 第5A圖至第5C圖係繪示本發明之數個實施例之側 面示意圖,用以說明當開口位於门字型保護結構時的情 形。如第5A圖所示,本發明中之開口 5丨2係位於门字型 保護結構504a之側壁之上,门字型保護結構5〇4a係利用 黏合結構506與基板502黏合,並形成一腔體以容納光干 涉式反射結構(圖中未表示)於其中。本發明之開口的位置 並不限定,而且,當開口越大時,則結構釋放蝕刻製程之 钱刻效率越好。 此開口 5 12可為任何形狀,例如在第5a圖中,開口 512之側邊未封閉,會與黏合結構5〇2接觸。而在第 圖中,開口 5 14係位於门字型保護結構5〇4b之側壁,且 其側邊封閉,因此並不與黏合結構502接觸。 再者’本發明之開口的數目可不止為一個。如第5c 圖所不,门字型保護結構504c之側邊具有兩個開口 514。 開口的數目越多,則結構釋放蝕刻製程之蝕刻效率也越 好。而且,開口的位置若能均勻分散於门字型保護結構之 上’則可提升整體蝕刻製程之均勻性。 本發明係在進行結構釋放蝕刻製程以移除犧牲層之 18 593127 前,利用一接合結構先黏合保護結構與基板,以形成一腔 體將微機電結構包覆於其中,且此腔體之側壁上預留至少 一開口,以供進行後續之結構釋放蝕刻製程。如此可避免 在製造過程中,產品為了進行不同製程而暴露於大氣之 中,使得空氣中之水分子、灰塵或氧氣有機會影響光干涉 式反射結構,並傷害到光干涉式反射結構。 再者’保護結構與基板黏合,將微機電結構包覆於其 中,如此可以避免因外力直接碰觸而破壞光干涉式反射結 構。再者,最後並利用黏合結構將光干涉式反射結構密封 於基板以及保濩結構之中,可有效地避免外在環境,例如 空氣中的水分子、灰塵或氧氣,接觸到光干涉式反射結構 而產生靜電吸引力或氧化其金屬薄膜,而破壞其光學或電
所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其
的、特徵、和優點能更明 ’並配合所附圖式,作詳 19 593127 細說明如下: 第1A圖係繪示習知可變色畫素單元的剖面示意圖; 第1B圖係繪示第1A圖中之可變色晝素單元1〇〇在 加上電壓後的剖面示意圖; ~ 第2A圖係繪示本發明之一較佳實施例之剖面示意 - 圖, 第2Β圖係繪示本發明之另一較佳實施例之剖面示音 籲 圖; …。 第3Α圖至第3C圖係繪示依照本發明之一較 例之製造方法。 貝 第4A圖係緣示本發明之另一較佳實施例之側面示意 圖, 第4B圖係繪示本發明之另—較佳實施例之側面示意 圖, 第4C圖係綠示本發明 — 々奴乃心力季父佳實施例之側面示意 _ 圖。 第5 A圖係输不本發明之另一較佳實施例之側面示意 圖, 第5B圖係缘不本發明之另一較佳實施例之側面示意 圖;以及 < 第5C圖係綠示本發明之另一較佳實施例之側面示意 20 593127 【元件代表符號簡單說明】 100 : 可變色畫素單元 102 : 牆 104 : 牆 106 : 支撐物 108 : 腔室 110 : 基板 200a :平板保護結構 200b ••门字型保護結構 202 : 黏合結構 304 : 平板保護結構 306 : 支撐物 309 : 基板 308 : 黏合結構 310 : 電極 311 : 犧牲層 312 : 開口 314 : 電極 320 ·· 開口 328 : 黏合結構 402 :基板 593127 404 :平板保護結構 406 :黏合結構 41 2、41 4、41 6 ··開口 502 :基板 5 04a、5 04b、5 04c : Π字型保護結構 506 :黏合結構 5 12、5 14 :開口

Claims (1)

  1. 第 3·如申請專利範圍第丨項所述之製造方法,其中該 黏合結構之材質包含一紫外線膠或一熱固膠。 該 4. ^中請專利範圍帛i項所述之製造方法,豆中 Ik方法更包含: 封閉該開 在心成該結構釋放#刻製程之後, 封閉=^請專利範圍第4項所述之製造方法,其中該 才-口之步驟係利用一第二黏.合結構填充封閉該開口。 第 【如申請專利範圍帛5項所述之製造方法,其中 黏合結構之材f包含—紫外線膠或—熱固膠。 該 保護:士 ::請專利範圍第1項所述之製造方法,其中該 、。褥為一平板結構或一门字型結構。 保護專:範圍第1項所述之製造方法,其中該 之側壁。、^子型結構’且該開口係位於該门字型結構 9.- 下步驟: 種光干涉式顯示面板之製造方 法,至少包含以 提供一基板; 24 W3127 形成一微機電結構於該基板之上,至少包含以下步 聚: 形成一第一電極於該基板之上; 形成一犧牲層於該第一電極之上; 形成複數個第一開口於該犧牲層以及該第一電 極之内; 形成複數個支撐物於每一該些第一開口之中;以 及 升> 成一第二電極於該犧牲層及該些支撐物之上; 利用一第一黏合結構黏合一保護結構與該基板,以形 成腔體供容納該微機電結構,其中該腔體之側壁具有至 少一第二開口; 以一結構釋放蝕刻製程經由該第二開口蝕刻移除該 认機電結構之該犧牲層,以形成一光干涉式反射結構丨以 及 利用一第二黏合結構填充封閉該第二開口。 10·如申請專利範圍第9項所述之製造方法,其中該 第一黏合結構之材質包含一間隙物,利用該間隙物使該保 護結構與戎基板之間保持一預定距離,以避免該保護結構 接觸傷害該光干涉反射結構。 11 ·如申睛專利範圍第9項所述之製造方法,其中該 25 593127 第一黏合結構之材質包含一紫外線膠或一熱固膠。 12.如申請專利範圍第9項所述之製造方法,其中今 第二黏合結構之材質包含一紫外線膠或一熱固膠。 1 3 ·如申請專利範圍第9項所述之製造方法,其中談 保護結構為一平板結構或一门字型結構。 14·如申請專利範圍第9項所述之製造方法,其中該 保護結構為一门字型結構,其中該第二開口係位於該门字 型結構之側壁。 i5·如申請專利範圍第9項所述之製造方法,其中該 犧牲層之材質為介電材質、金屬材質或矽材質。 16· —種光干涉式顯示面板,至少包含: 一基板; 一保護結構’與該基板約成平行排列; 一微機電結構,具有一犧牲層位於該微機電結構的第 一電極及第二電極之間;以及 一黏合結構,黏合該保護結構與該基板,以形成一腔 體供容納該微機電結構,其中該腔體之側壁具有至少一開 口,藉由该開口流通一蝕刻劑以蝕刻移除該犧牲層,以形 26 593127 成一光干涉式反射結構。 17·如申請專利範圍第16項所述之光干涉式顯示面 板,其中該微機電結構更包含: 複數個支撐物,位於該犧牲層中,用以支撐該第一電 極與該第二電極。 18·如申請專利範圍第16項所述之光干涉式顯示面 板,其中该保護結構為一平板結構或一门字型結構。 19·如申請專利範圍第16項所述之光干涉式顯示面 板,其中該保護結構為一门字型結構,且該第二開口係位 於該门字型結構之側壁。 2〇·如申請專利範圍第16項所述之光干涉式顯示面 板’其中該黏合結構之材質包含—間隙物,利用該間隙物 使該保護結構與該基板之間保持—預定距離,以避免該保 護結構接觸傷害到該光干涉反射結構。 21.如申請專利範圍第16項所述之光干涉式顯示面 板’其中該黏合結構之材質包含―紫外線膠或一熱固膠。 27
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JP2004102019A JP3886502B2 (ja) 2003-08-18 2004-03-31 光学干渉型ディスプレイパネルおよびその製造方法
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