JP3886502B2 - 光学干渉型ディスプレイパネルおよびその製造方法 - Google Patents
光学干渉型ディスプレイパネルおよびその製造方法 Download PDFInfo
- Publication number
- JP3886502B2 JP3886502B2 JP2004102019A JP2004102019A JP3886502B2 JP 3886502 B2 JP3886502 B2 JP 3886502B2 JP 2004102019 A JP2004102019 A JP 2004102019A JP 2004102019 A JP2004102019 A JP 2004102019A JP 3886502 B2 JP3886502 B2 JP 3886502B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- optical interference
- adhesive
- opening
- protective structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
- B81B7/0012—Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion or pin assignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/045—Optical switches
Description
2D=Nλ (1.1)
式中、Nは、自然数である。
一方、製造中に用いられた犠牲層を、保護構造を基板に接着させる前に除去した場合には、前記加工工程により製造された色変化可能な画素は、これらの問題が軽減するが、これらを実質的に回避することはできない。色変化可能な画素が、犠牲層の除去と、保護構造体の接着との間の期間の間に、空気に暴露されると、空気中の水、塵および酸素が、色変化可能な画素に影響し、この表示性能を低下させ得るからである。
本発明の他の目的は、表示性能を高め、信頼性を増大させ、パネルの寿命を延長する、光学干渉型ディスプレイパネルおよび製造方法を提供することにある。
本発明のさらに他の目的は、光学干渉型ディスプレイパネルおよび製造方法を提供することにある。該製造方法においては、基板、保護構造体および接着剤が、開口部を有するチャンバーを形成し、リリースエッチング法を開口部を通して実施して、光学干渉型反射構造体の犠牲層を除去し、これにより空気中の水または酸素が光学干渉型反射構造体に損傷を与える可能性を減少させる。
本発明のこれらのおよび他の特徴、観点および利点は、以下の記載、添付した特許請求の範囲および添付した図面によってより一層理解される。なお:
図1Aは、従来技術のモジュレーターの断面図を示し;
図1Bは、電圧を印加した後の、図1Aにおけるモジュレーターの断面図を示し;
図2Aは、本発明の1つの好ましい態様の断面図を示し;
図2Bは、本発明の他の好ましい態様の断面図を示し;
図3A〜3Cは、本発明の1つの好ましい態様の製造方法を示し;
図4Aは、本発明の他の好ましい態様の三次元図を示し;
図4Bは、本発明の他の好ましい態様の三次元図を示し;
図4Cは、本発明の他の好ましい態様の三次元図を示し;
図5Aは、本発明の他の好ましい態様の三次元図を示し;
図5Bは、本発明の他の好ましい態様の三次元図を示し;および
図5Cは、本発明の他の好ましい態様の三次元図を示す。
102、104 壁
106 ポスト
108 空洞
110、309、402 基板
200a、304、404 平坦な保護構造体
200b、504a、504c U字型保護構造体
202、308、328、406 接着剤
306 支持体
310 第一電極
311 犠牲層
312、320、412、414、416、512、514 開口部
314 第二電極
Claims (5)
- 光学干渉型ディスプレイパネルの製造方法であって:
微細電気機械的構造体を有する基板を提供する工程であって、該微細電気機械的構造体は:
基板上の第一電極;
第一電極上の犠牲層;
犠牲層上の第二電極;および
第一電極と第二電極との間に位置する、複数の支持体
を含む、前記工程;
基板を保護構造体に、第一接着剤で接着させて、微細電気機械的構造体を包囲するための空洞を形成する工程であって、ここで、該空洞の側壁は、少なくとも1つの開口部を有する、前記工程;および
エッチング試薬を用いてリリースエッチング法により、犠牲層を、開口部を通して除去して、光学干渉型反射構造体を形成すること
を含む、前記方法。 - 方法がさらに:
開口部を、リリースエッチング法が完了した後に閉鎖する工程
を含む、請求項1に記載の方法。 - 開口部を、UV接着剤または熱硬化性接着剤を含む、第二接着剤を充填することにより閉鎖する、請求項2に記載の方法。
- 光学干渉型ディスプレイパネルであって:
基板;
基板にほぼ平行に位置する、保護構造体;
第一電極と第二電極との間に犠牲層を有する、微細電気機械的構造体;および
保護構造体を基板に接着させて、前記微細電気機械的構造体を包囲するための、少なくとも1つの空洞を形成するための接着剤を含み、ここで、前記空洞の側壁は、犠牲層を除去し、光学干渉型反射構造体を形成するために用いられるエッチング試薬を投入するための開口部を有する、
前記光学干渉型ディスプレイパネル。 - 保護構造体が、U字型保護構造体であり、開口部が、該U字型保護構造体の側壁上に位置する、請求項4に記載の光学干渉型ディスプレイパネル。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092122676A TW593127B (en) | 2003-08-18 | 2003-08-18 | Interference display plate and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005062815A JP2005062815A (ja) | 2005-03-10 |
JP3886502B2 true JP3886502B2 (ja) | 2007-02-28 |
Family
ID=34076508
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004102019A Expired - Fee Related JP3886502B2 (ja) | 2003-08-18 | 2004-03-31 | 光学干渉型ディスプレイパネルおよびその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7532385B2 (ja) |
JP (1) | JP3886502B2 (ja) |
KR (1) | KR100639173B1 (ja) |
TW (1) | TW593127B (ja) |
Families Citing this family (156)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6674562B1 (en) * | 1994-05-05 | 2004-01-06 | Iridigm Display Corporation | Interferometric modulation of radiation |
US6680792B2 (en) * | 1994-05-05 | 2004-01-20 | Iridigm Display Corporation | Interferometric modulation of radiation |
US7123216B1 (en) * | 1994-05-05 | 2006-10-17 | Idc, Llc | Photonic MEMS and structures |
US7550794B2 (en) * | 2002-09-20 | 2009-06-23 | Idc, Llc | Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer |
US7532377B2 (en) * | 1998-04-08 | 2009-05-12 | Idc, Llc | Movable micro-electromechanical device |
WO1999052006A2 (en) | 1998-04-08 | 1999-10-14 | Etalon, Inc. | Interferometric modulation of radiation |
US8928967B2 (en) | 1998-04-08 | 2015-01-06 | Qualcomm Mems Technologies, Inc. | Method and device for modulating light |
WO2003007049A1 (en) | 1999-10-05 | 2003-01-23 | Iridigm Display Corporation | Photonic mems and structures |
US6794119B2 (en) * | 2002-02-12 | 2004-09-21 | Iridigm Display Corporation | Method for fabricating a structure for a microelectromechanical systems (MEMS) device |
US7781850B2 (en) * | 2002-09-20 | 2010-08-24 | Qualcomm Mems Technologies, Inc. | Controlling electromechanical behavior of structures within a microelectromechanical systems device |
TWI289708B (en) * | 2002-12-25 | 2007-11-11 | Qualcomm Mems Technologies Inc | Optical interference type color display |
TW594360B (en) * | 2003-04-21 | 2004-06-21 | Prime View Int Corp Ltd | A method for fabricating an interference display cell |
TW570896B (en) | 2003-05-26 | 2004-01-11 | Prime View Int Co Ltd | A method for fabricating an interference display cell |
TWI251712B (en) * | 2003-08-15 | 2006-03-21 | Prime View Int Corp Ltd | Interference display plate |
TW200506479A (en) * | 2003-08-15 | 2005-02-16 | Prime View Int Co Ltd | Color changeable pixel for an interference display |
TW593127B (en) * | 2003-08-18 | 2004-06-21 | Prime View Int Co Ltd | Interference display plate and manufacturing method thereof |
TWI231865B (en) * | 2003-08-26 | 2005-05-01 | Prime View Int Co Ltd | An interference display cell and fabrication method thereof |
TWI232333B (en) * | 2003-09-03 | 2005-05-11 | Prime View Int Co Ltd | Display unit using interferometric modulation and manufacturing method thereof |
US7342705B2 (en) | 2004-02-03 | 2008-03-11 | Idc, Llc | Spatial light modulator with integrated optical compensation structure |
US7706050B2 (en) * | 2004-03-05 | 2010-04-27 | Qualcomm Mems Technologies, Inc. | Integrated modulator illumination |
US7855824B2 (en) * | 2004-03-06 | 2010-12-21 | Qualcomm Mems Technologies, Inc. | Method and system for color optimization in a display |
US7476327B2 (en) * | 2004-05-04 | 2009-01-13 | Idc, Llc | Method of manufacture for microelectromechanical devices |
US7256922B2 (en) * | 2004-07-02 | 2007-08-14 | Idc, Llc | Interferometric modulators with thin film transistors |
TWI233916B (en) * | 2004-07-09 | 2005-06-11 | Prime View Int Co Ltd | A structure of a micro electro mechanical system |
KR101354520B1 (ko) * | 2004-07-29 | 2014-01-21 | 퀄컴 엠이엠에스 테크놀로지스, 인크. | 간섭 변조기의 미소기전 동작을 위한 시스템 및 방법 |
US7573547B2 (en) * | 2004-09-27 | 2009-08-11 | Idc, Llc | System and method for protecting micro-structure of display array using spacers in gap within display device |
US7936497B2 (en) * | 2004-09-27 | 2011-05-03 | Qualcomm Mems Technologies, Inc. | MEMS device having deformable membrane characterized by mechanical persistence |
US7920135B2 (en) * | 2004-09-27 | 2011-04-05 | Qualcomm Mems Technologies, Inc. | Method and system for driving a bi-stable display |
US20060065366A1 (en) * | 2004-09-27 | 2006-03-30 | Cummings William J | Portable etch chamber |
US7417735B2 (en) * | 2004-09-27 | 2008-08-26 | Idc, Llc | Systems and methods for measuring color and contrast in specular reflective devices |
US7893919B2 (en) | 2004-09-27 | 2011-02-22 | Qualcomm Mems Technologies, Inc. | Display region architectures |
US8514169B2 (en) * | 2004-09-27 | 2013-08-20 | Qualcomm Mems Technologies, Inc. | Apparatus and system for writing data to electromechanical display elements |
US7259449B2 (en) * | 2004-09-27 | 2007-08-21 | Idc, Llc | Method and system for sealing a substrate |
US7586484B2 (en) * | 2004-09-27 | 2009-09-08 | Idc, Llc | Controller and driver features for bi-stable display |
US7807488B2 (en) * | 2004-09-27 | 2010-10-05 | Qualcomm Mems Technologies, Inc. | Display element having filter material diffused in a substrate of the display element |
US7372613B2 (en) * | 2004-09-27 | 2008-05-13 | Idc, Llc | Method and device for multistate interferometric light modulation |
US20060076634A1 (en) * | 2004-09-27 | 2006-04-13 | Lauren Palmateer | Method and system for packaging MEMS devices with incorporated getter |
US7405861B2 (en) | 2004-09-27 | 2008-07-29 | Idc, Llc | Method and device for protecting interferometric modulators from electrostatic discharge |
US7349136B2 (en) * | 2004-09-27 | 2008-03-25 | Idc, Llc | Method and device for a display having transparent components integrated therein |
US7369294B2 (en) * | 2004-09-27 | 2008-05-06 | Idc, Llc | Ornamental display device |
US8310441B2 (en) * | 2004-09-27 | 2012-11-13 | Qualcomm Mems Technologies, Inc. | Method and system for writing data to MEMS display elements |
US7420725B2 (en) | 2004-09-27 | 2008-09-02 | Idc, Llc | Device having a conductive light absorbing mask and method for fabricating same |
US7359066B2 (en) * | 2004-09-27 | 2008-04-15 | Idc, Llc | Electro-optical measurement of hysteresis in interferometric modulators |
US7130104B2 (en) * | 2004-09-27 | 2006-10-31 | Idc, Llc | Methods and devices for inhibiting tilting of a mirror in an interferometric modulator |
US7583429B2 (en) | 2004-09-27 | 2009-09-01 | Idc, Llc | Ornamental display device |
US20060176241A1 (en) * | 2004-09-27 | 2006-08-10 | Sampsell Jeffrey B | System and method of transmitting video data |
US7304784B2 (en) * | 2004-09-27 | 2007-12-04 | Idc, Llc | Reflective display device having viewable display on both sides |
US20060066932A1 (en) * | 2004-09-27 | 2006-03-30 | Clarence Chui | Method of selective etching using etch stop layer |
US7317568B2 (en) * | 2004-09-27 | 2008-01-08 | Idc, Llc | System and method of implementation of interferometric modulators for display mirrors |
US7710632B2 (en) * | 2004-09-27 | 2010-05-04 | Qualcomm Mems Technologies, Inc. | Display device having an array of spatial light modulators with integrated color filters |
US7302157B2 (en) * | 2004-09-27 | 2007-11-27 | Idc, Llc | System and method for multi-level brightness in interferometric modulation |
US7928928B2 (en) * | 2004-09-27 | 2011-04-19 | Qualcomm Mems Technologies, Inc. | Apparatus and method for reducing perceived color shift |
US20060066596A1 (en) * | 2004-09-27 | 2006-03-30 | Sampsell Jeffrey B | System and method of transmitting video data |
US7535466B2 (en) * | 2004-09-27 | 2009-05-19 | Idc, Llc | System with server based control of client device display features |
US8362987B2 (en) * | 2004-09-27 | 2013-01-29 | Qualcomm Mems Technologies, Inc. | Method and device for manipulating color in a display |
US7911428B2 (en) * | 2004-09-27 | 2011-03-22 | Qualcomm Mems Technologies, Inc. | Method and device for manipulating color in a display |
US20060076631A1 (en) * | 2004-09-27 | 2006-04-13 | Lauren Palmateer | Method and system for providing MEMS device package with secondary seal |
US7653371B2 (en) * | 2004-09-27 | 2010-01-26 | Qualcomm Mems Technologies, Inc. | Selectable capacitance circuit |
US7460246B2 (en) * | 2004-09-27 | 2008-12-02 | Idc, Llc | Method and system for sensing light using interferometric elements |
US7898521B2 (en) * | 2004-09-27 | 2011-03-01 | Qualcomm Mems Technologies, Inc. | Device and method for wavelength filtering |
US7184202B2 (en) * | 2004-09-27 | 2007-02-27 | Idc, Llc | Method and system for packaging a MEMS device |
US7554714B2 (en) * | 2004-09-27 | 2009-06-30 | Idc, Llc | Device and method for manipulation of thermal response in a modulator |
US7343080B2 (en) * | 2004-09-27 | 2008-03-11 | Idc, Llc | System and method of testing humidity in a sealed MEMS device |
US8124434B2 (en) * | 2004-09-27 | 2012-02-28 | Qualcomm Mems Technologies, Inc. | Method and system for packaging a display |
US7289259B2 (en) * | 2004-09-27 | 2007-10-30 | Idc, Llc | Conductive bus structure for interferometric modulator array |
US7369296B2 (en) * | 2004-09-27 | 2008-05-06 | Idc, Llc | Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator |
US7527995B2 (en) * | 2004-09-27 | 2009-05-05 | Qualcomm Mems Technologies, Inc. | Method of making prestructure for MEMS systems |
US7668415B2 (en) * | 2004-09-27 | 2010-02-23 | Qualcomm Mems Technologies, Inc. | Method and device for providing electronic circuitry on a backplate |
US7808703B2 (en) * | 2004-09-27 | 2010-10-05 | Qualcomm Mems Technologies, Inc. | System and method for implementation of interferometric modulator displays |
US7321456B2 (en) * | 2004-09-27 | 2008-01-22 | Idc, Llc | Method and device for corner interferometric modulation |
US20060067650A1 (en) * | 2004-09-27 | 2006-03-30 | Clarence Chui | Method of making a reflective display device using thin film transistor production techniques |
US7299681B2 (en) * | 2004-09-27 | 2007-11-27 | Idc, Llc | Method and system for detecting leak in electronic devices |
US7355780B2 (en) | 2004-09-27 | 2008-04-08 | Idc, Llc | System and method of illuminating interferometric modulators using backlighting |
US7289256B2 (en) * | 2004-09-27 | 2007-10-30 | Idc, Llc | Electrical characterization of interferometric modulators |
US7719500B2 (en) * | 2004-09-27 | 2010-05-18 | Qualcomm Mems Technologies, Inc. | Reflective display pixels arranged in non-rectangular arrays |
US7417783B2 (en) * | 2004-09-27 | 2008-08-26 | Idc, Llc | Mirror and mirror layer for optical modulator and method |
US7405924B2 (en) * | 2004-09-27 | 2008-07-29 | Idc, Llc | System and method for protecting microelectromechanical systems array using structurally reinforced back-plate |
US20060176487A1 (en) * | 2004-09-27 | 2006-08-10 | William Cummings | Process control monitors for interferometric modulators |
US7424198B2 (en) | 2004-09-27 | 2008-09-09 | Idc, Llc | Method and device for packaging a substrate |
US8008736B2 (en) * | 2004-09-27 | 2011-08-30 | Qualcomm Mems Technologies, Inc. | Analog interferometric modulator device |
US7446926B2 (en) * | 2004-09-27 | 2008-11-04 | Idc, Llc | System and method of providing a regenerating protective coating in a MEMS device |
US7492502B2 (en) * | 2004-09-27 | 2009-02-17 | Idc, Llc | Method of fabricating a free-standing microstructure |
US7415186B2 (en) * | 2004-09-27 | 2008-08-19 | Idc, Llc | Methods for visually inspecting interferometric modulators for defects |
US7684104B2 (en) * | 2004-09-27 | 2010-03-23 | Idc, Llc | MEMS using filler material and method |
US7373026B2 (en) * | 2004-09-27 | 2008-05-13 | Idc, Llc | MEMS device fabricated on a pre-patterned substrate |
US20060065622A1 (en) * | 2004-09-27 | 2006-03-30 | Floyd Philip D | Method and system for xenon fluoride etching with enhanced efficiency |
US7701631B2 (en) * | 2004-09-27 | 2010-04-20 | Qualcomm Mems Technologies, Inc. | Device having patterned spacers for backplates and method of making the same |
US7630119B2 (en) * | 2004-09-27 | 2009-12-08 | Qualcomm Mems Technologies, Inc. | Apparatus and method for reducing slippage between structures in an interferometric modulator |
US7553684B2 (en) * | 2004-09-27 | 2009-06-30 | Idc, Llc | Method of fabricating interferometric devices using lift-off processing techniques |
US7420728B2 (en) * | 2004-09-27 | 2008-09-02 | Idc, Llc | Methods of fabricating interferometric modulators by selectively removing a material |
US7944599B2 (en) | 2004-09-27 | 2011-05-17 | Qualcomm Mems Technologies, Inc. | Electromechanical device with optical function separated from mechanical and electrical function |
US20060066557A1 (en) * | 2004-09-27 | 2006-03-30 | Floyd Philip D | Method and device for reflective display with time sequential color illumination |
US7368803B2 (en) * | 2004-09-27 | 2008-05-06 | Idc, Llc | System and method for protecting microelectromechanical systems array using back-plate with non-flat portion |
US7564612B2 (en) * | 2004-09-27 | 2009-07-21 | Idc, Llc | Photonic MEMS and structures |
US20060103643A1 (en) * | 2004-09-27 | 2006-05-18 | Mithran Mathew | Measuring and modeling power consumption in displays |
US7813026B2 (en) | 2004-09-27 | 2010-10-12 | Qualcomm Mems Technologies, Inc. | System and method of reducing color shift in a display |
TW200628877A (en) * | 2005-02-04 | 2006-08-16 | Prime View Int Co Ltd | Method of manufacturing optical interference type color display |
US20060277486A1 (en) * | 2005-06-02 | 2006-12-07 | Skinner David N | File or user interface element marking system |
US7460292B2 (en) | 2005-06-03 | 2008-12-02 | Qualcomm Mems Technologies, Inc. | Interferometric modulator with internal polarization and drive method |
JP2009503564A (ja) * | 2005-07-22 | 2009-01-29 | クアルコム,インコーポレイテッド | Memsデバイスのための支持構造、およびその方法 |
US7630114B2 (en) * | 2005-10-28 | 2009-12-08 | Idc, Llc | Diffusion barrier layer for MEMS devices |
US7561334B2 (en) * | 2005-12-20 | 2009-07-14 | Qualcomm Mems Technologies, Inc. | Method and apparatus for reducing back-glass deflection in an interferometric modulator display device |
US7795061B2 (en) | 2005-12-29 | 2010-09-14 | Qualcomm Mems Technologies, Inc. | Method of creating MEMS device cavities by a non-etching process |
US7916980B2 (en) | 2006-01-13 | 2011-03-29 | Qualcomm Mems Technologies, Inc. | Interconnect structure for MEMS device |
US7382515B2 (en) * | 2006-01-18 | 2008-06-03 | Qualcomm Mems Technologies, Inc. | Silicon-rich silicon nitrides as etch stops in MEMS manufacture |
US7652814B2 (en) | 2006-01-27 | 2010-01-26 | Qualcomm Mems Technologies, Inc. | MEMS device with integrated optical element |
US7582952B2 (en) * | 2006-02-21 | 2009-09-01 | Qualcomm Mems Technologies, Inc. | Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof |
US7547568B2 (en) * | 2006-02-22 | 2009-06-16 | Qualcomm Mems Technologies, Inc. | Electrical conditioning of MEMS device and insulating layer thereof |
US7550810B2 (en) * | 2006-02-23 | 2009-06-23 | Qualcomm Mems Technologies, Inc. | MEMS device having a layer movable at asymmetric rates |
US7450295B2 (en) * | 2006-03-02 | 2008-11-11 | Qualcomm Mems Technologies, Inc. | Methods for producing MEMS with protective coatings using multi-component sacrificial layers |
WO2007120887A2 (en) * | 2006-04-13 | 2007-10-25 | Qualcomm Mems Technologies, Inc | Packaging a mems device using a frame |
US7903047B2 (en) * | 2006-04-17 | 2011-03-08 | Qualcomm Mems Technologies, Inc. | Mode indicator for interferometric modulator displays |
US7711239B2 (en) | 2006-04-19 | 2010-05-04 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device and method utilizing nanoparticles |
US7527996B2 (en) * | 2006-04-19 | 2009-05-05 | Qualcomm Mems Technologies, Inc. | Non-planar surface structures and process for microelectromechanical systems |
US20070249078A1 (en) * | 2006-04-19 | 2007-10-25 | Ming-Hau Tung | Non-planar surface structures and process for microelectromechanical systems |
US7417784B2 (en) * | 2006-04-19 | 2008-08-26 | Qualcomm Mems Technologies, Inc. | Microelectromechanical device and method utilizing a porous surface |
US7623287B2 (en) * | 2006-04-19 | 2009-11-24 | Qualcomm Mems Technologies, Inc. | Non-planar surface structures and process for microelectromechanical systems |
US8004743B2 (en) * | 2006-04-21 | 2011-08-23 | Qualcomm Mems Technologies, Inc. | Method and apparatus for providing brightness control in an interferometric modulator (IMOD) display |
US7369292B2 (en) * | 2006-05-03 | 2008-05-06 | Qualcomm Mems Technologies, Inc. | Electrode and interconnect materials for MEMS devices |
US7649671B2 (en) * | 2006-06-01 | 2010-01-19 | Qualcomm Mems Technologies, Inc. | Analog interferometric modulator device with electrostatic actuation and release |
US7405863B2 (en) * | 2006-06-01 | 2008-07-29 | Qualcomm Mems Technologies, Inc. | Patterning of mechanical layer in MEMS to reduce stresses at supports |
WO2007149475A2 (en) * | 2006-06-21 | 2007-12-27 | Qualcomm Mems Technologies, Inc. | Method for packaging an optical mems device |
US7835061B2 (en) * | 2006-06-28 | 2010-11-16 | Qualcomm Mems Technologies, Inc. | Support structures for free-standing electromechanical devices |
US7385744B2 (en) * | 2006-06-28 | 2008-06-10 | Qualcomm Mems Technologies, Inc. | Support structure for free-standing MEMS device and methods for forming the same |
US7527998B2 (en) * | 2006-06-30 | 2009-05-05 | Qualcomm Mems Technologies, Inc. | Method of manufacturing MEMS devices providing air gap control |
US7388704B2 (en) * | 2006-06-30 | 2008-06-17 | Qualcomm Mems Technologies, Inc. | Determination of interferometric modulator mirror curvature and airgap variation using digital photographs |
US7763546B2 (en) | 2006-08-02 | 2010-07-27 | Qualcomm Mems Technologies, Inc. | Methods for reducing surface charges during the manufacture of microelectromechanical systems devices |
US7566664B2 (en) * | 2006-08-02 | 2009-07-28 | Qualcomm Mems Technologies, Inc. | Selective etching of MEMS using gaseous halides and reactive co-etchants |
US20080043315A1 (en) * | 2006-08-15 | 2008-02-21 | Cummings William J | High profile contacts for microelectromechanical systems |
US8872085B2 (en) | 2006-10-06 | 2014-10-28 | Qualcomm Mems Technologies, Inc. | Display device having front illuminator with turning features |
CN101600901A (zh) | 2006-10-06 | 2009-12-09 | 高通Mems科技公司 | 集成于显示器的照明设备中的光学损失结构 |
US7706042B2 (en) | 2006-12-20 | 2010-04-27 | Qualcomm Mems Technologies, Inc. | MEMS device and interconnects for same |
CN101652317B (zh) * | 2007-04-04 | 2012-12-12 | 高通Mems科技公司 | 通过牺牲层中的界面修改来消除释放蚀刻侵蚀 |
US7719752B2 (en) | 2007-05-11 | 2010-05-18 | Qualcomm Mems Technologies, Inc. | MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same |
US7570415B2 (en) * | 2007-08-07 | 2009-08-04 | Qualcomm Mems Technologies, Inc. | MEMS device and interconnects for same |
KR101415566B1 (ko) | 2007-10-29 | 2014-07-04 | 삼성디스플레이 주식회사 | 표시 장치 |
US8068710B2 (en) | 2007-12-07 | 2011-11-29 | Qualcomm Mems Technologies, Inc. | Decoupled holographic film and diffuser |
US20090323170A1 (en) * | 2008-06-30 | 2009-12-31 | Qualcomm Mems Technologies, Inc. | Groove on cover plate or substrate |
US20100020382A1 (en) * | 2008-07-22 | 2010-01-28 | Qualcomm Mems Technologies, Inc. | Spacer for mems device |
US20100245370A1 (en) * | 2009-03-25 | 2010-09-30 | Qualcomm Mems Technologies, Inc. | Em shielding for display devices |
US8736590B2 (en) | 2009-03-27 | 2014-05-27 | Qualcomm Mems Technologies, Inc. | Low voltage driver scheme for interferometric modulators |
US7864403B2 (en) * | 2009-03-27 | 2011-01-04 | Qualcomm Mems Technologies, Inc. | Post-release adjustment of interferometric modulator reflectivity |
US8405649B2 (en) * | 2009-03-27 | 2013-03-26 | Qualcomm Mems Technologies, Inc. | Low voltage driver scheme for interferometric modulators |
US8379392B2 (en) | 2009-10-23 | 2013-02-19 | Qualcomm Mems Technologies, Inc. | Light-based sealing and device packaging |
JP2013524287A (ja) | 2010-04-09 | 2013-06-17 | クォルコム・メムズ・テクノロジーズ・インコーポレーテッド | 電気機械デバイスの機械層及びその形成方法 |
US9110200B2 (en) | 2010-04-16 | 2015-08-18 | Flex Lighting Ii, Llc | Illumination device comprising a film-based lightguide |
BR112012026329A2 (pt) | 2010-04-16 | 2019-09-24 | Flex Lighting Ii Llc | sinal compreendendo um guia de luz baseado em película |
US8848294B2 (en) | 2010-05-20 | 2014-09-30 | Qualcomm Mems Technologies, Inc. | Method and structure capable of changing color saturation |
US9134527B2 (en) | 2011-04-04 | 2015-09-15 | Qualcomm Mems Technologies, Inc. | Pixel via and methods of forming the same |
US8963159B2 (en) | 2011-04-04 | 2015-02-24 | Qualcomm Mems Technologies, Inc. | Pixel via and methods of forming the same |
US8921165B2 (en) * | 2011-08-03 | 2014-12-30 | Cavendish Kinetics, Inc. | Elimination of silicon residues from MEMS cavity floor |
CN103765485B (zh) * | 2011-12-02 | 2015-09-30 | 阿塞桑电子莎娜依和提卡瑞特有限公司 | 光学屏蔽系统 |
JP5966405B2 (ja) * | 2012-02-14 | 2016-08-10 | セイコーエプソン株式会社 | 光学フィルターデバイス、及び光学フィルターデバイスの製造方法 |
KR101941165B1 (ko) * | 2012-06-07 | 2019-04-12 | 삼성전자주식회사 | 광 스위칭 소자, 이를 포함한 영상 표시 장치 및 그 제조 방법 |
KR101941167B1 (ko) * | 2012-11-13 | 2019-01-22 | 삼성전자주식회사 | 광 스위칭 소자, 이를 포함한 영상 표시 장치 및 그 제조 방법 |
KR101717541B1 (ko) * | 2015-04-15 | 2017-03-17 | 한국생산기술연구원 | 하이브리드 표시 장치 |
Family Cites Families (125)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US665355A (en) * | 1899-05-25 | 1901-01-01 | Cons Machine Specialty Company | Speed-changing mechanism. |
US4074480A (en) | 1976-02-12 | 1978-02-21 | Burton Henry W G | Kit for converting single-glazed window to double-glazed window |
DE2802728C2 (de) | 1977-01-24 | 1984-03-15 | Sharp K.K., Osaka | Elektrochrome Anzeigezelle |
NL8001281A (nl) | 1980-03-04 | 1981-10-01 | Philips Nv | Weergeefinrichting. |
CH633902A5 (fr) | 1980-03-11 | 1982-12-31 | Centre Electron Horloger | Dispositif de modulation de lumiere. |
US5835255A (en) | 1986-04-23 | 1998-11-10 | Etalon, Inc. | Visible spectrum modulator arrays |
US4956619A (en) | 1988-02-19 | 1990-09-11 | Texas Instruments Incorporated | Spatial light modulator |
US5216537A (en) | 1990-06-29 | 1993-06-01 | Texas Instruments Incorporated | Architecture and process for integrating DMD with control circuit substrates |
US5018256A (en) | 1990-06-29 | 1991-05-28 | Texas Instruments Incorporated | Architecture and process for integrating DMD with control circuit substrates |
US5099353A (en) | 1990-06-29 | 1992-03-24 | Texas Instruments Incorporated | Architecture and process for integrating DMD with control circuit substrates |
US5331454A (en) | 1990-11-13 | 1994-07-19 | Texas Instruments Incorporated | Low reset voltage process for DMD |
US5233459A (en) | 1991-03-06 | 1993-08-03 | Massachusetts Institute Of Technology | Electric display device |
US5268533A (en) | 1991-05-03 | 1993-12-07 | Hughes Aircraft Company | Pre-stressed laminated lid for electronic circuit package |
US5244707A (en) | 1992-01-10 | 1993-09-14 | Shores A Andrew | Enclosure for electronic devices |
WO1993021663A1 (en) | 1992-04-08 | 1993-10-28 | Georgia Tech Research Corporation | Process for lift-off of thin film materials from a growth substrate |
US5324888A (en) | 1992-10-13 | 1994-06-28 | Olin Corporation | Metal electronic package with reduced seal width |
US5322161A (en) | 1992-11-30 | 1994-06-21 | United States Surgical Corporation | Clear package for bioabsorbable articles |
US6674562B1 (en) | 1994-05-05 | 2004-01-06 | Iridigm Display Corporation | Interferometric modulation of radiation |
DE4317274A1 (de) * | 1993-05-25 | 1994-12-01 | Bosch Gmbh Robert | Verfahren zur Herstellung oberflächen-mikromechanischer Strukturen |
US7123216B1 (en) | 1994-05-05 | 2006-10-17 | Idc, Llc | Photonic MEMS and structures |
US7460291B2 (en) | 1994-05-05 | 2008-12-02 | Idc, Llc | Separable modulator |
US20010003487A1 (en) | 1996-11-05 | 2001-06-14 | Mark W. Miles | Visible spectrum modulator arrays |
US6040937A (en) | 1994-05-05 | 2000-03-21 | Etalon, Inc. | Interferometric modulation |
US6680792B2 (en) | 1994-05-05 | 2004-01-20 | Iridigm Display Corporation | Interferometric modulation of radiation |
US5636052A (en) | 1994-07-29 | 1997-06-03 | Lucent Technologies Inc. | Direct view display based on a micromechanical modulation |
US5650881A (en) | 1994-11-02 | 1997-07-22 | Texas Instruments Incorporated | Support post architecture for micromechanical devices |
TW378276B (en) | 1995-01-13 | 2000-01-01 | Seiko Epson Corp | Liquid crystal display device and its fabrication method |
JPH08263208A (ja) | 1995-02-24 | 1996-10-11 | Whitaker Corp:The | 弾性波タッチパネル及びその製造方法 |
US6969635B2 (en) | 2000-12-07 | 2005-11-29 | Reflectivity, Inc. | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
US6046840A (en) | 1995-06-19 | 2000-04-04 | Reflectivity, Inc. | Double substrate reflective spatial light modulator with self-limiting micro-mechanical elements |
US5837562A (en) | 1995-07-07 | 1998-11-17 | The Charles Stark Draper Laboratory, Inc. | Process for bonding a shell to a substrate for packaging a semiconductor |
US7907319B2 (en) | 1995-11-06 | 2011-03-15 | Qualcomm Mems Technologies, Inc. | Method and device for modulating light with optical compensation |
US5999306A (en) | 1995-12-01 | 1999-12-07 | Seiko Epson Corporation | Method of manufacturing spatial light modulator and electronic device employing it |
US5771321A (en) * | 1996-01-04 | 1998-06-23 | Massachusetts Institute Of Technology | Micromechanical optical switch and flat panel display |
US5784166A (en) | 1996-04-03 | 1998-07-21 | Nikon Corporation | Position resolution of an interferometrially controlled moving stage by regression analysis |
US5939785A (en) | 1996-04-12 | 1999-08-17 | Texas Instruments Incorporated | Micromechanical device including time-release passivant |
US5936758A (en) | 1996-04-12 | 1999-08-10 | Texas Instruments Incorporated | Method of passivating a micromechanical device within a hermetic package |
US5853662A (en) | 1996-04-17 | 1998-12-29 | Mitsubishi Gas Chemical Company, Inc. | Method for preserving polished inorganic glass and method for preserving article obtained by using the same |
US5789848A (en) | 1996-08-02 | 1998-08-04 | Motorola, Inc. | Field emission display having a cathode reinforcement member |
GB9724077D0 (en) | 1997-11-15 | 1998-01-14 | Dow Corning Sa | Insulating glass units |
JP2876530B1 (ja) | 1998-02-24 | 1999-03-31 | 東京工業大学長 | 固着した可動部の修復手段を具える超小型素子およびその製造方法 |
US6195196B1 (en) | 1998-03-13 | 2001-02-27 | Fuji Photo Film Co., Ltd. | Array-type exposing device and flat type display incorporating light modulator and driving method thereof |
EP0951068A1 (en) | 1998-04-17 | 1999-10-20 | Interuniversitair Micro-Elektronica Centrum Vzw | Method of fabrication of a microstructure having an inside cavity |
US6303986B1 (en) | 1998-07-29 | 2001-10-16 | Silicon Light Machines | Method of and apparatus for sealing an hermetic lid to a semiconductor die |
US6365229B1 (en) | 1998-09-30 | 2002-04-02 | Texas Instruments Incorporated | Surface treatment material deposition and recapture |
US6843936B1 (en) | 1998-10-22 | 2005-01-18 | Texas Instruments Incorporated | Getter for enhanced micromechanical device performance |
US6004179A (en) | 1998-10-26 | 1999-12-21 | Micron Technology, Inc. | Methods of fabricating flat panel evacuated displays |
GB9827965D0 (en) | 1998-12-19 | 1999-02-10 | Secr Defence | Assembly of cells having spaced opposed substrates |
GB9827900D0 (en) | 1998-12-19 | 1999-02-10 | Secr Defence | Spacers for cells having spaced opposed substrates |
US6245194B1 (en) * | 1998-12-21 | 2001-06-12 | Sikorsky Aircraft Corporation | Processed fiber for emission of energy into a medium and method therefor |
KR20000071852A (ko) | 1999-04-30 | 2000-11-25 | 모리시타 요이찌 | 액정표시소자 및 그 제조방법 |
US6833668B1 (en) | 1999-09-29 | 2004-12-21 | Sanyo Electric Co., Ltd. | Electroluminescence display device having a desiccant |
WO2003007049A1 (en) | 1999-10-05 | 2003-01-23 | Iridigm Display Corporation | Photonic mems and structures |
US6472739B1 (en) | 1999-11-15 | 2002-10-29 | Jds Uniphase Corporation | Encapsulated microelectromechanical (MEMS) devices |
DE69933380T2 (de) | 1999-12-15 | 2007-08-02 | Asulab S.A. | Verfahren zum hermetischen Einkapseln von Mikrosystemen vor Ort |
US6583921B2 (en) | 1999-12-28 | 2003-06-24 | Texas Instruments Incorporated | Micromechanical device and method for non-contacting edge-coupled operation |
DE10004964B4 (de) | 2000-02-04 | 2010-07-29 | Robert Bosch Gmbh | Mikromechanische Kappenstruktur |
GB2359216B (en) | 2000-02-11 | 2003-10-29 | Purple Voice Ltd | A method of synchronising the replay of audio data in a network of computers |
US6661084B1 (en) | 2000-05-16 | 2003-12-09 | Sandia Corporation | Single level microelectronic device package with an integral window |
US6384473B1 (en) | 2000-05-16 | 2002-05-07 | Sandia Corporation | Microelectronic device package with an integral window |
US6379988B1 (en) | 2000-05-16 | 2002-04-30 | Sandia Corporation | Pre-release plastic packaging of MEMS and IMEMS devices |
US6686653B2 (en) | 2000-06-28 | 2004-02-03 | Institut National D'optique | Miniature microdevice package and process for making thereof |
EP1720347B1 (en) | 2000-07-03 | 2010-06-23 | Sony Corporation | Optical multilayer structure, optical switching device, and image display |
US6466354B1 (en) | 2000-09-19 | 2002-10-15 | Silicon Light Machines | Method and apparatus for interferometric modulation of light |
US6426461B1 (en) | 2000-09-21 | 2002-07-30 | Delphi Technologies, Inc. | Enclosure for electronic components |
DE10049288B4 (de) | 2000-10-04 | 2004-07-15 | Infineon Technologies Ag | Elektronische Bauteile und eine Folienband zum Verpacken von Bonddrahtverbindungen elektronischer Bauteile sowie deren Herstellungsverfahren |
BR0114836A (pt) | 2000-10-20 | 2003-07-01 | Pfizer Prod Inc | Agonistas de receptores beta-3 adrenérgicos e suas aplicações |
US7178927B2 (en) | 2000-11-14 | 2007-02-20 | Semiconductor Energy Laboratory Co., Ltd. | Electroluminescent device having drying agent |
US6664779B2 (en) | 2000-11-16 | 2003-12-16 | Texas Instruments Incorporated | Package with environmental control material carrier |
US6762868B2 (en) | 2000-11-16 | 2004-07-13 | Texas Instruments Incorporated | Electro-optical package with drop-in aperture |
US20020075551A1 (en) | 2000-11-29 | 2002-06-20 | Onix Microsystems, Inc | Enclosure for MEMS apparatus and method of using the same |
US6906847B2 (en) | 2000-12-07 | 2005-06-14 | Reflectivity, Inc | Spatial light modulators with light blocking/absorbing areas |
US7307775B2 (en) * | 2000-12-07 | 2007-12-11 | Texas Instruments Incorporated | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
US6455927B1 (en) | 2001-03-12 | 2002-09-24 | Amkor Technology, Inc. | Micromirror device package |
JP2002311843A (ja) | 2001-04-17 | 2002-10-25 | Dainippon Printing Co Ltd | 電磁波遮蔽用部材及びディスプレイ |
KR100387239B1 (ko) | 2001-04-26 | 2003-06-12 | 삼성전자주식회사 | Mems 릴레이 및 그 제조방법 |
US6465355B1 (en) | 2001-04-27 | 2002-10-15 | Hewlett-Packard Company | Method of fabricating suspended microstructures |
US6706316B2 (en) | 2001-05-08 | 2004-03-16 | Eastman Kodak Company | Ultrasonically sealing the cover plate to provide a hermetic enclosure for OLED displays |
US6558820B2 (en) | 2001-05-10 | 2003-05-06 | Eastman Kodak Company | High contrast light-emitting diode devices |
US6589625B1 (en) | 2001-08-01 | 2003-07-08 | Iridigm Display Corporation | Hermetic seal and method to create the same |
US6778046B2 (en) * | 2001-09-17 | 2004-08-17 | Magfusion Inc. | Latching micro magnetic relay packages and methods of packaging |
US6590157B2 (en) | 2001-09-21 | 2003-07-08 | Eastman Kodak Company | Sealing structure for highly moisture-sensitive electronic device element and method for fabrication |
US6893574B2 (en) | 2001-10-23 | 2005-05-17 | Analog Devices Inc | MEMS capping method and apparatus |
US6776538B2 (en) | 2001-12-12 | 2004-08-17 | Axsun Technologies, Inc. | MEMS tunable optical filter system with moisture getter for frequency stability |
US7050835B2 (en) | 2001-12-12 | 2006-05-23 | Universal Display Corporation | Intelligent multi-media display communication system |
JP2003185496A (ja) | 2001-12-13 | 2003-07-03 | Mitsubishi Electric Corp | 赤外線検出アレイおよびその製造方法 |
JP3755460B2 (ja) | 2001-12-26 | 2006-03-15 | ソニー株式会社 | 静電駆動型mems素子とその製造方法、光学mems素子、光変調素子、glvデバイス、レーザディスプレイ、及びmems装置 |
JP4168757B2 (ja) | 2002-02-01 | 2008-10-22 | 松下電器産業株式会社 | フィルタ |
US6794119B2 (en) | 2002-02-12 | 2004-09-21 | Iridigm Display Corporation | Method for fabricating a structure for a microelectromechanical systems (MEMS) device |
US6603182B1 (en) | 2002-03-12 | 2003-08-05 | Lucent Technologies Inc. | Packaging micromechanical devices |
US7046374B1 (en) | 2002-03-14 | 2006-05-16 | Avanex Corporation | Interferometers for optical communications utilizing photo-sensitive materials |
US6962834B2 (en) | 2002-03-22 | 2005-11-08 | Stark David H | Wafer-level hermetic micro-device packages |
US6707351B2 (en) | 2002-03-27 | 2004-03-16 | Motorola, Inc. | Tunable MEMS resonator and method for tuning |
US20030183916A1 (en) | 2002-03-27 | 2003-10-02 | John Heck | Packaging microelectromechanical systems |
TW589915B (en) | 2002-05-24 | 2004-06-01 | Sanyo Electric Co | Electroluminescence display device |
US7034984B2 (en) | 2002-06-19 | 2006-04-25 | Miradia Inc. | Fabrication of a high fill ratio reflective spatial light modulator with hidden hinge |
FR2841380A1 (fr) | 2002-06-25 | 2003-12-26 | Commissariat Energie Atomique | Procede d'encapsulation d'un objet sous atmosphere controlee |
ITTO20020551A1 (it) | 2002-06-26 | 2003-12-29 | Vhit Spa | Macchina fluidica a cilindrata variabile in funzione della pressione |
JP3758622B2 (ja) | 2002-08-08 | 2006-03-22 | セイコーエプソン株式会社 | 光学装置、光学ユニット、および、プロジェクタ |
AU2003286572A1 (en) | 2002-10-23 | 2004-05-13 | Rutgers, The State University Of New Jersey | Processes for hermetically packaging wafer level microscopic structures |
KR100474455B1 (ko) | 2002-11-08 | 2005-03-11 | 삼성전자주식회사 | 기판단위 mems 진공실장방법 및 장치 |
JP4342174B2 (ja) | 2002-12-27 | 2009-10-14 | 新光電気工業株式会社 | 電子デバイス及びその製造方法 |
US20040140557A1 (en) | 2003-01-21 | 2004-07-22 | United Test & Assembly Center Limited | Wl-bga for MEMS/MOEMS devices |
US7492019B2 (en) | 2003-03-07 | 2009-02-17 | Ic Mechanics, Inc. | Micromachined assembly with a multi-layer cap defining a cavity |
JP4156946B2 (ja) | 2003-02-26 | 2008-09-24 | 三菱電機株式会社 | 加速度センサ |
US20040166606A1 (en) | 2003-02-26 | 2004-08-26 | David Forehand | Low temperature wafer-level micro-encapsulation |
TW591778B (en) * | 2003-03-18 | 2004-06-11 | Advanced Semiconductor Eng | Package structure for a microsystem |
US7015885B2 (en) | 2003-03-22 | 2006-03-21 | Active Optical Networks, Inc. | MEMS devices monolithically integrated with drive and control circuitry |
US6779260B1 (en) | 2003-03-28 | 2004-08-24 | Delphi Technologies, Inc. | Overmolded electronic package including circuit-carrying substrate |
TW567355B (en) | 2003-04-21 | 2003-12-21 | Prime View Int Co Ltd | An interference display cell and fabrication method thereof |
TWI226504B (en) | 2003-04-21 | 2005-01-11 | Prime View Int Co Ltd | A structure of an interference display cell |
US7153016B2 (en) | 2003-04-24 | 2006-12-26 | Waltop International Corp. | Package for the display module with the electromagnetic module |
US7072093B2 (en) | 2003-04-30 | 2006-07-04 | Hewlett-Packard Development Company, L.P. | Optical interference pixel display with charge control |
CN1220621C (zh) | 2003-04-30 | 2005-09-28 | 华中科技大学 | 微机电系统后封装工艺 |
US20050012197A1 (en) * | 2003-07-15 | 2005-01-20 | Smith Mark A. | Fluidic MEMS device |
TWI251712B (en) | 2003-08-15 | 2006-03-21 | Prime View Int Corp Ltd | Interference display plate |
TWI305599B (en) | 2003-08-15 | 2009-01-21 | Qualcomm Mems Technologies Inc | Interference display panel and method thereof |
TW593127B (en) | 2003-08-18 | 2004-06-21 | Prime View Int Co Ltd | Interference display plate and manufacturing method thereof |
US6977391B2 (en) | 2003-09-25 | 2005-12-20 | Osram Semiconductors Gmbh | Transport balancing diffusion layer for rate limited scavenging systems |
US20050093134A1 (en) * | 2003-10-30 | 2005-05-05 | Terry Tarn | Device packages with low stress assembly process |
TW200530669A (en) * | 2004-03-05 | 2005-09-16 | Prime View Int Co Ltd | Interference display plate and manufacturing method thereof |
US20050253283A1 (en) * | 2004-05-13 | 2005-11-17 | Dcamp Jon B | Getter deposition for vacuum packaging |
US7126741B2 (en) | 2004-08-12 | 2006-10-24 | Hewlett-Packard Development Company, L.P. | Light modulator assembly |
US7668415B2 (en) | 2004-09-27 | 2010-02-23 | Qualcomm Mems Technologies, Inc. | Method and device for providing electronic circuitry on a backplate |
WO2007120887A2 (en) | 2006-04-13 | 2007-10-25 | Qualcomm Mems Technologies, Inc | Packaging a mems device using a frame |
-
2003
- 2003-08-18 TW TW092122676A patent/TW593127B/zh not_active IP Right Cessation
-
2004
- 2004-03-24 US US10/807,128 patent/US7532385B2/en active Active
- 2004-03-31 JP JP2004102019A patent/JP3886502B2/ja not_active Expired - Fee Related
- 2004-06-12 KR KR1020040043323A patent/KR100639173B1/ko not_active IP Right Cessation
-
2009
- 2009-05-08 US US12/463,312 patent/US8004736B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20090219605A1 (en) | 2009-09-03 |
US20050042117A1 (en) | 2005-02-24 |
JP2005062815A (ja) | 2005-03-10 |
KR100639173B1 (ko) | 2006-10-30 |
KR20050020582A (ko) | 2005-03-04 |
TW593127B (en) | 2004-06-21 |
US7532385B2 (en) | 2009-05-12 |
US8004736B2 (en) | 2011-08-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3886502B2 (ja) | 光学干渉型ディスプレイパネルおよびその製造方法 | |
US6999225B2 (en) | Optical interference display panel | |
TWI251712B (en) | Interference display plate | |
JP2005250437A (ja) | 干渉ディスプレイプレートおよびその製造方法 | |
JP3962028B2 (ja) | 干渉式変調ピクセル及びその製造法 | |
US7816710B2 (en) | Packaging for an interferometric modulator with a curved back plate | |
JP3923953B2 (ja) | 干渉変調画素とその製造方法 | |
KR100672911B1 (ko) | 마이크로 전자 기계적 시스템 및 그 제조 방법 | |
JP4563892B2 (ja) | 非平坦部を持つバックプレートを用いた微小電気機械システムを防護する為のシステム及び方法 | |
KR101162592B1 (ko) | 기판을 패키징하는 방법 및 기기 | |
JP2010524010A (ja) | Memsキャビティ被覆層および方法 | |
TW200841040A (en) | Improved MEMS processing | |
TW201636296A (zh) | 使用一虛設腔之裝置囊封 | |
CN100367080C (zh) | 光干涉式显示面板以及其制造方法 | |
KR20050016540A (ko) | 웨이퍼 기판 상에 마이크로-전기기계식 장치를 적층,현출, 및 패키지하는 방법 | |
TW201643502A (zh) | 機電系統元件之預釋放封裝 | |
CN1591094A (zh) | 光干涉式显示面板及其制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20060428 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20061011 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20061024 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20061121 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 3886502 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101201 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111201 Year of fee payment: 5 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121201 Year of fee payment: 6 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121201 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131201 Year of fee payment: 7 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |