TW553582U - Flexible printed circuit and connected printed circuit structure - Google Patents

Flexible printed circuit and connected printed circuit structure

Info

Publication number
TW553582U
TW553582U TW091216074U TW91216074U TW553582U TW 553582 U TW553582 U TW 553582U TW 091216074 U TW091216074 U TW 091216074U TW 91216074 U TW91216074 U TW 91216074U TW 553582 U TW553582 U TW 553582U
Authority
TW
Taiwan
Prior art keywords
printed circuit
flexible printed
circuit structure
flexible
connected printed
Prior art date
Application number
TW091216074U
Other languages
English (en)
Inventor
Katsuhiko Kishida
Katsunori Tanaka
Toshiya Onodera
Hirofumi Miyamoto
Original Assignee
Fujitsu Display Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Display Tech filed Critical Fujitsu Display Tech
Publication of TW553582U publication Critical patent/TW553582U/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
TW091216074U 1997-03-19 1998-03-19 Flexible printed circuit and connected printed circuit structure TW553582U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9066795A JPH10261849A (ja) 1997-03-19 1997-03-19 フレキシブルプリント基板および接続プリント基板構造

Publications (1)

Publication Number Publication Date
TW553582U true TW553582U (en) 2003-09-11

Family

ID=13326169

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091216074U TW553582U (en) 1997-03-19 1998-03-19 Flexible printed circuit and connected printed circuit structure

Country Status (4)

Country Link
US (1) US6118665A (zh)
JP (1) JPH10261849A (zh)
KR (1) KR100337272B1 (zh)
TW (1) TW553582U (zh)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6510606B2 (en) * 1998-06-15 2003-01-28 Lockheed Martin Corporation Multichip module
US6428641B1 (en) * 1998-08-31 2002-08-06 Amkor Technology, Inc. Method for laminating circuit pattern tape on semiconductor wafer
US6479887B1 (en) 1998-08-31 2002-11-12 Amkor Technology, Inc. Circuit pattern tape for wafer-scale production of chip size semiconductor packages
KR100330584B1 (ko) * 1999-08-30 2002-03-29 윤종용 플렉서블 회로기판 및 그 설계방법
JP2001077501A (ja) * 1999-09-03 2001-03-23 Seiko Epson Corp フレキシブル配線基板、電気光学装置および電子機器
JP2002171063A (ja) * 2000-12-01 2002-06-14 Sony Chem Corp 多層フレキシブル配線板
US7113136B2 (en) * 2000-12-18 2006-09-26 Collins & Aikman Products Co. Integrated dual function circuitry and antenna system
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
US20050269603A1 (en) * 2004-05-14 2005-12-08 Nam-Soo Kang Flexible printed circuit film
US20060204675A1 (en) * 2005-03-08 2006-09-14 Eastman Kodak Company Display device with improved flexibility
JP4628154B2 (ja) * 2005-03-22 2011-02-09 三井金属鉱業株式会社 フレキシブルプリント配線基板、および半導体装置
JP2006319050A (ja) * 2005-05-11 2006-11-24 Toshiba Corp 配線板、コネクタ、および電子機器
JP2007088229A (ja) * 2005-09-22 2007-04-05 Daisho Denshi:Kk フレックスリジッドプリント配線板
CN101346035B (zh) * 2007-07-13 2010-06-02 富葵精密组件(深圳)有限公司 软性电路板
TWI392409B (zh) * 2009-05-26 2013-04-01 Wistron Corp 電子裝置及其軟性電路板
KR20110092545A (ko) * 2010-02-09 2011-08-18 삼성전자주식회사 촬상 장치
JP5818516B2 (ja) * 2011-05-31 2015-11-18 キヤノン株式会社 コネクタ接続部を有するフレキシブルプリント配線基板
JP5798495B2 (ja) * 2012-01-13 2015-10-21 住友理工株式会社 配線体接続構造体
JP6169321B2 (ja) * 2012-03-27 2017-07-26 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法
GB2502305B (en) * 2012-05-22 2015-07-29 Plastic Logic Ltd Electronic reading devices
KR20140000084A (ko) * 2012-06-22 2014-01-02 삼성전기주식회사 터치패널
US9717141B1 (en) * 2013-01-03 2017-07-25 St. Jude Medical, Atrial Fibrillation Division, Inc. Flexible printed circuit with removable testing portion
US9806219B2 (en) 2013-02-14 2017-10-31 Apple Inc. Displays with camera window openings
KR102223784B1 (ko) * 2014-06-03 2021-03-08 삼성디스플레이 주식회사 연성 회로 필름 및 이를 포함하는 표시 장치
TWI592069B (zh) * 2015-06-18 2017-07-11 達方電子股份有限公司 週邊裝置
CN108650780B (zh) * 2018-05-23 2019-07-16 深圳市爱升精密电路科技有限公司 一种柔性印刷电路板
CN108495488B (zh) * 2018-05-23 2019-06-21 深圳市汇芯线路科技有限公司 一种多层印刷线路板的制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
JPH0528784Y2 (zh) * 1988-01-26 1993-07-23
US5418691A (en) * 1990-02-07 1995-05-23 Canon Kabushiki Kaisha Two printed circuit boards superiposed on one another both having position registry marks
JPH07123179B2 (ja) * 1990-10-05 1995-12-25 信越ポリマー株式会社 異方導電接着剤による回路基板の接続構造
JP2875076B2 (ja) * 1990-11-29 1999-03-24 三井化学株式会社 フレキシブル配線基板
JPH0685341B2 (ja) * 1991-09-27 1994-10-26 帝国通信工業株式会社 フレキシブル基板の端子構造
JPH06334279A (ja) * 1993-05-20 1994-12-02 Minolta Camera Co Ltd 多層フレキシブル電装基板

Also Published As

Publication number Publication date
US6118665A (en) 2000-09-12
KR19980080454A (ko) 1998-11-25
KR100337272B1 (ko) 2002-08-22
JPH10261849A (ja) 1998-09-29

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model