TW546235B - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

Info

Publication number
TW546235B
TW546235B TW091119368A TW91119368A TW546235B TW 546235 B TW546235 B TW 546235B TW 091119368 A TW091119368 A TW 091119368A TW 91119368 A TW91119368 A TW 91119368A TW 546235 B TW546235 B TW 546235B
Authority
TW
Taiwan
Prior art keywords
substrate
roller
conveying
rollers
pressing
Prior art date
Application number
TW091119368A
Other languages
English (en)
Chinese (zh)
Inventor
Mitsuaki Yoshitani
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Application granted granted Critical
Publication of TW546235B publication Critical patent/TW546235B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Robotics (AREA)
  • Cleaning In General (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW091119368A 2001-09-14 2002-08-27 Substrate processing apparatus TW546235B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001279200A JP3926593B2 (ja) 2001-09-14 2001-09-14 基板処理装置

Publications (1)

Publication Number Publication Date
TW546235B true TW546235B (en) 2003-08-11

Family

ID=19103436

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091119368A TW546235B (en) 2001-09-14 2002-08-27 Substrate processing apparatus

Country Status (3)

Country Link
JP (1) JP3926593B2 (ko)
KR (1) KR100484061B1 (ko)
TW (1) TW546235B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI386354B (zh) * 2003-10-17 2013-02-21 Olympus Corp 基板搬送裝置
CN110312374A (zh) * 2018-03-20 2019-10-08 奥宝科技股份有限公司 碎屑移除系统、光学处理系统、空气刀及移除碎屑的方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10358149B3 (de) * 2003-12-10 2005-05-12 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zum berührungslosen Behandeln von ebenem Gut in Durchlaufanlagen
DE10358147C5 (de) * 2003-12-10 2007-11-22 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zum Behandeln von ebenem Gut in Durchlaufanlagen
JP4789446B2 (ja) * 2004-09-27 2011-10-12 芝浦メカトロニクス株式会社 基板の処理装置
JP5110367B2 (ja) * 2007-12-27 2012-12-26 日立化成工業株式会社 水平搬送型表面処理装置
TWI462215B (zh) * 2010-03-29 2014-11-21 Dainippon Screen Mfg 基板處理裝置、轉換方法、及轉移方法
US10098269B2 (en) 2010-04-29 2018-10-09 Fuji Machine Mfg. Co., Ltd. Manufacture work machine for controlling a plurality of work-element performing apparatuses by central control device
JP5750235B2 (ja) 2010-04-29 2015-07-15 富士機械製造株式会社 製造作業機
KR101707929B1 (ko) * 2012-10-04 2017-02-17 히라따기꼬오 가부시키가이샤 반송 시스템 및 제어 방법
JP6315547B2 (ja) * 2013-12-17 2018-04-25 芝浦メカトロニクス株式会社 基板処理装置
JP5833172B2 (ja) * 2014-04-15 2015-12-16 富士機械製造株式会社 製造作業機
JP7198039B2 (ja) * 2018-10-22 2022-12-28 株式会社Ｓｃｒｅｅｎフェバックス 基板搬送装置およびこの基板搬送装置を備えた基板処理装置
JP2024034527A (ja) * 2022-08-31 2024-03-13 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
CN115535519A (zh) * 2022-09-21 2022-12-30 漳州市百事得家具有限公司 一种应用于定制家具生产的智能柔性封边生产线

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232268A (ja) * 1996-02-19 1997-09-05 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3388988B2 (ja) * 1996-03-18 2003-03-24 大日本スクリーン製造株式会社 基板処理装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI386354B (zh) * 2003-10-17 2013-02-21 Olympus Corp 基板搬送裝置
CN110312374A (zh) * 2018-03-20 2019-10-08 奥宝科技股份有限公司 碎屑移除系统、光学处理系统、空气刀及移除碎屑的方法
CN110312374B (zh) * 2018-03-20 2024-05-14 奥宝科技有限公司 碎屑移除系统、光学处理系统、空气刀及移除碎屑的方法

Also Published As

Publication number Publication date
KR20030023475A (ko) 2003-03-19
KR100484061B1 (ko) 2005-04-19
JP3926593B2 (ja) 2007-06-06
JP2003086654A (ja) 2003-03-20

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