JP5681628B2 - ガラス鉛直処理装置 - Google Patents
ガラス鉛直処理装置 Download PDFInfo
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- 239000011521 glass Substances 0.000 title claims description 181
- 239000007788 liquid Substances 0.000 claims description 54
- 238000001035 drying Methods 0.000 claims description 25
- 239000012530 fluid Substances 0.000 claims description 18
- 238000004891 communication Methods 0.000 claims description 7
- 238000005406 washing Methods 0.000 claims description 4
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 description 29
- 238000000034 method Methods 0.000 description 10
- 239000007789 gas Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- -1 for example Polymers 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920003031 santoprene Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
- C03B35/20—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by gripping tongs or supporting frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/02—Controlled or contamination-free environments or clean space conditions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Surface Treatment Of Glass (AREA)
- Liquid Crystal (AREA)
- Drying Of Solid Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Description
【先行技術文献】
【特許文献】
【特許文献1】特開平10−118583号公報
【特許文献2】特開2006−140509号公報
一態様において、ガラス処理装置10は、洗浄ハウジング20とその中を通る搬送路100とを含む洗浄区域200を備える。ガラスシート30は、ガラスシート30が搬送路100に沿って搬送方向102に移動するとき、実質的に鉛直向きに配向される。
すすぎ区域300は、搬送路100の互いに反対側に配置された第1すすぎノズル310および第2すすぎノズル320を含み、さらに搬送路100の互いに反対側に配置された第1液体軸受340および第2液体軸受330を含む。図4を参照されたい。第1すすぎノズル310および第2すすぎノズル320は、ガラスシート30を損傷させることになり得るような過剰な振動を生じさせずにガラスシート30を支持するような位置に、互いに対してかつ第1液体軸受340および第2液体軸受330に対して設置される。
乾燥区域400は、ガラスシート30の面32、34から液体を除去するように設計されている。一態様において、乾燥区域400は、少なくとも1つの、第1エアナイフ410、第2エアナイフ420、ノズルパイプ430、流体軸受440、450、およびガイドローラ470を含む。エアナイフ410、420により適用される空気の圧力、および、流体軸受440、450間の距離は、ガラスシートの望ましくない振動を防ぐように設計される。
30 ガラスシート
32 第1面
34 第2面
100 搬送路
102 搬送方向
200 洗浄区域
210、220 ブラシ
230 ノズル
300 すすぎ区域
310、320 すすぎノズル
330、340 液体軸受
400 乾燥区域
410、420 エアナイフ
430 ノズルパイプ
440、450 流体軸受
470 ガイドローラ
530、540 駆動ローラ
Claims (5)
- 第1面と、反対側の第2面とを有する平面のガラスシートを処理するためのガラス処理装置であって、該ガラス処理装置が、前記ガラスシートが鉛直平面でその中を移動することができる搬送路と、洗浄区域、すすぎ区域、および乾燥区域とを備え、
前記洗浄区域が、
前記ガラスシートの前記第1面の一部に接触することができるように前記搬送路に隣接して設置された、厚さおよび直径を有する第1駆動ローラと、さらに、
前記ガラスシートの前記第2面の一部に接触することができるように前記搬送路に隣接して設置された、厚さおよび直径を有する第2駆動ローラと、を備え、
前記第1および第2駆動ローラの夫々の前記厚さが1.27cmから5.08cmの範囲であり、かつ前記第1および第2駆動ローラの夫々の前記直径が10.16cm以下であり、
前記すすぎ区域が、
液体を前記ガラスシートの前記第1面に向けることができるように、前記搬送路に隣接してかつ液体源と連通して設置された、第1すすぎノズルと、
前記ガラスシートの前記第2面に面することができるように、かつ水平および鉛直の両方向で前記第1すすぎノズルと直接対向するように前記搬送路に隣接して設置された、第1液体軸受であって、水平方向では前記第1すすぎノズルと前記第1液体軸受の両方が、前記搬送路に沿った同等の位置の両側に設置され、鉛直方向では、少なくとも前記第1すすぎノズルのいくつかは、前記第1液体軸受の上部と下部との間に配置される、第1液体軸受と、
液体を前記ガラスシートの前記第2面に向けることができるように、前記搬送路に隣接してかつ液体源と連通して設置された、第2すすぎノズルと、さらに、
前記ガラスシートの前記第1面に面することができるように、かつ水平および鉛直の両方向で前記第2すすぎノズルと直接対向するように前記搬送路に隣接して設置された、第2液体軸受であって、水平方向では前記第2すすぎノズルと前記第2液体軸受の両方が、前記搬送路に沿った同等の位置の両側に設置され、鉛直方向では、少なくとも前記第2すすぎノズルのいくつかは、前記第2液体軸受の上部と下部との間に配置される、第2液体軸受とを備え、
前記乾燥区域が、
前記搬送路に隣接し、ガス源と連通して設置され、かつガスを第1圧力で前記ガラスシートの前記第1面に向けるよう構成された、第1エアナイフと、
前記搬送路に隣接し、ガス源と連通して設置され、かつガスを第2圧力で前記ガラスシートの前記第2面に向けるよう構成された、前記第1エアナイフに対向して設置されている第2エアナイフと、
前記搬送方向において前記第1および第2エアナイフの上流に設置され、かつ前記平面のガラスシートの前記第1面を支持するよう構成および配置された、第1軸受と、さらに、
前記搬送方向において前記第1および第2エアナイフの下流に設置され、かつ前記平面のガラスシートの前記第1面を支持するよう構成および配置された、第2軸受と、を備え、
前記第1軸受および前記第2軸受が、前記搬送方向において、75mm以下の距離だけ互いに間隔を空けて位置し、
さらに前記第1圧力および前記第2圧力の差の絶対値が1500Pa以下であることを特徴とする装置。 - 前記第1および第2すすぎノズルが、液体を前記ガラスシートの前記第1および第2面にノズル毎に757〜7571ccm(757〜7571cm3/min)の流量で向けるように液体供給源に接続され、かつ前記液体が、前記ガラスシートの前記第1および第2面に68950〜344738N/m2の圧力で向けられることを特徴とする請求項1記載の装置。
- 前記距離が40mm以下であることを特徴とする請求項1記載の装置。
- 前記距離が25mm以下であることを特徴とする請求項1記載の装置。
- 前記第1圧力および前記第2圧力の差の前記絶対値が、300Pa以下であることを特徴とする請求項1、3、または4記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8510308P | 2008-07-31 | 2008-07-31 | |
US61/085,103 | 2008-07-31 | ||
PCT/US2009/004234 WO2010014167A2 (en) | 2008-07-31 | 2009-07-21 | Devices for vertical treatment of glass |
Publications (2)
Publication Number | Publication Date |
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JP2011529439A JP2011529439A (ja) | 2011-12-08 |
JP5681628B2 true JP5681628B2 (ja) | 2015-03-11 |
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Application Number | Title | Priority Date | Filing Date |
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JP2011521110A Expired - Fee Related JP5681628B2 (ja) | 2008-07-31 | 2009-07-21 | ガラス鉛直処理装置 |
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Country | Link |
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JP (1) | JP5681628B2 (ja) |
KR (1) | KR101577850B1 (ja) |
CN (1) | CN102137821B (ja) |
TW (1) | TWI395720B (ja) |
WO (1) | WO2010014167A2 (ja) |
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ITMI20131027A1 (it) * | 2013-06-20 | 2014-12-21 | Gianluca Carini | Apparato e metodo per la pulizia di elementi a pannello |
CN104043628B (zh) * | 2014-06-17 | 2016-06-08 | 中国科学院上海光学精密机械研究所 | 大口径光学玻璃固定清洗架和清洗方法 |
DE102016115297A1 (de) * | 2016-08-17 | 2018-02-22 | Schott Ag | Dünnes Glasprodukt und Verfahren zu seiner Herstellung |
CN106824874B (zh) * | 2017-01-25 | 2023-01-10 | 广东光耀玻璃科技股份有限公司 | 一种玻璃垂直清洗装置 |
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KR200295409Y1 (ko) * | 2002-08-19 | 2002-11-18 | 인창실업 (주) | 수직유리세척기건조부이송장치 |
JP2004174308A (ja) * | 2002-11-25 | 2004-06-24 | Kawaju Plant Kk | 板材の洗浄設備 |
JP2005150266A (ja) * | 2003-11-13 | 2005-06-09 | Pioneer Plasma Display Corp | プラズマディスプレイパネル製造方法,プラズマ表示装置製造方法,及び表示パネル処理装置 |
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KR100732519B1 (ko) * | 2006-03-31 | 2007-06-28 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
KR20080054124A (ko) * | 2006-12-12 | 2008-06-17 | 엘지디스플레이 주식회사 | 평판 표시 소자용 기판 건조 장치 및 방법 |
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2009
- 2009-07-21 JP JP2011521110A patent/JP5681628B2/ja not_active Expired - Fee Related
- 2009-07-21 CN CN200980134641.3A patent/CN102137821B/zh not_active Expired - Fee Related
- 2009-07-21 WO PCT/US2009/004234 patent/WO2010014167A2/en active Application Filing
- 2009-07-21 KR KR1020117004067A patent/KR101577850B1/ko active IP Right Grant
- 2009-07-28 TW TW098125452A patent/TWI395720B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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CN102137821B (zh) | 2014-03-19 |
TWI395720B (zh) | 2013-05-11 |
KR101577850B1 (ko) | 2015-12-15 |
WO2010014167A3 (en) | 2010-04-22 |
WO2010014167A2 (en) | 2010-02-04 |
KR20110055560A (ko) | 2011-05-25 |
CN102137821A (zh) | 2011-07-27 |
JP2011529439A (ja) | 2011-12-08 |
TW201022169A (en) | 2010-06-16 |
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