TW535199B - On-the-fly beam path error correction for memory link processing - Google Patents

On-the-fly beam path error correction for memory link processing Download PDF

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Publication number
TW535199B
TW535199B TW091102701A TW91102701A TW535199B TW 535199 B TW535199 B TW 535199B TW 091102701 A TW091102701 A TW 091102701A TW 91102701 A TW91102701 A TW 91102701A TW 535199 B TW535199 B TW 535199B
Authority
TW
Taiwan
Prior art keywords
mirror
axis
laser beam
workpiece
patent application
Prior art date
Application number
TW091102701A
Other languages
English (en)
Chinese (zh)
Inventor
Mark Unrath
Kelly Bruland
Ho Wai Lo
Stephen Swaringen
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Application granted granted Critical
Publication of TW535199B publication Critical patent/TW535199B/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/49—Adaptable interconnections, e.g. fuses or antifuses
    • H10W20/493—Fuses, i.e. interconnections changeable from conductive to non-conductive
    • H10W20/494—Fuses, i.e. interconnections changeable from conductive to non-conductive changeable by the use of an external beam, e.g. laser beam or ion beam

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Lasers (AREA)
TW091102701A 2001-02-16 2002-02-15 On-the-fly beam path error correction for memory link processing TW535199B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26964601P 2001-02-16 2001-02-16

Publications (1)

Publication Number Publication Date
TW535199B true TW535199B (en) 2003-06-01

Family

ID=23028100

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091102701A TW535199B (en) 2001-02-16 2002-02-15 On-the-fly beam path error correction for memory link processing

Country Status (8)

Country Link
JP (3) JP4397163B2 (https=)
KR (1) KR100821115B1 (https=)
CN (2) CN1317667C (https=)
CA (1) CA2438566A1 (https=)
DE (1) DE10296339T5 (https=)
GB (1) GB2390699B (https=)
TW (1) TW535199B (https=)
WO (1) WO2002067180A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6706999B1 (en) * 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
US7363180B2 (en) * 2005-02-15 2008-04-22 Electro Scientific Industries, Inc. Method for correcting systematic errors in a laser processing system
US7297972B2 (en) * 2005-08-26 2007-11-20 Electro Scientific Industries, Inc. Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target
US8026158B2 (en) * 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
US8378259B2 (en) * 2008-06-17 2013-02-19 Electro Scientific Industries, Inc. Eliminating head-to-head offsets along common chuck travel direction in multi-head laser machining systems
TWI594828B (zh) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
JP6055414B2 (ja) * 2010-10-22 2016-12-27 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームディザリング及びスカイビングのためのレーザ加工システム並びに方法
WO2014152526A1 (en) * 2013-03-15 2014-09-25 Electro Scientific Industries, Inc. Laser systems and methods for aod tool settling for aod travel reduction
JP6516722B2 (ja) * 2013-03-15 2019-05-22 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームポジショナのレーザ出射に基づく制御
CN111266741A (zh) * 2018-11-19 2020-06-12 深圳市圭华智能科技有限公司 激光加工系统及激光加工方法
JP7442351B2 (ja) * 2020-03-12 2024-03-04 株式会社ディスコ レーザー加工装置
JPWO2022038682A1 (https=) * 2020-08-18 2022-02-24

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1006938B (zh) * 1985-04-01 1990-02-21 索尼公司 光信息再现设备
JPH089110B2 (ja) * 1988-03-03 1996-01-31 株式会社ニコン レーザ加工装置のレーザビーム制御方法
JP2942804B2 (ja) * 1988-03-03 1999-08-30 株式会社ニコン レーザ加工装置及びレーザ加工装置のレーザビーム制御方法
DE4000166A1 (de) * 1990-01-05 1991-07-11 Hell Rudolf Dr Ing Gmbh Verfahren und einrichtung zur korrektur von positionsfehlern eines abgelenkten lichtstrahls
US5673110A (en) * 1993-01-26 1997-09-30 Phase Metrics, Inc. Multiplexed laser interferometer for non-dispersed spectrum detection in a dynamic flying height tester
JPH08195461A (ja) * 1995-01-18 1996-07-30 Hitachi Constr Mach Co Ltd ダムバー加工方法及びダムバー加工装置
US5751585A (en) * 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
JPH08316396A (ja) * 1995-05-16 1996-11-29 Hitachi Constr Mach Co Ltd ダムバー切断方法及びダムバー切断装置
JPH0970679A (ja) * 1995-09-07 1997-03-18 Nikon Corp レーザ加工装置の制御方法
CN1180221A (zh) * 1996-09-30 1998-04-29 大宇电子株式会社 控制光盘播放机的跟踪平衡装置和方法
JP3769942B2 (ja) * 1997-09-02 2006-04-26 セイコーエプソン株式会社 レーザー加工方法及び装置、並びに非導電性透明基板の回路形成方法及び装置
JPH11267873A (ja) * 1998-03-23 1999-10-05 Seiko Epson Corp レーザ光の走査光学系及びレーザ加工装置
US6088107A (en) * 1998-10-20 2000-07-11 Trw Inc. High resolution positioner
JPH11245061A (ja) * 1998-12-15 1999-09-14 Nikon Corp レーザ加工装置のレーザビーム制御方法

Also Published As

Publication number Publication date
CN1317667C (zh) 2007-05-23
KR20030091990A (ko) 2003-12-03
JP2004527376A (ja) 2004-09-09
CN101172319A (zh) 2008-05-07
JP2011098394A (ja) 2011-05-19
KR100821115B1 (ko) 2008-04-11
JP5055443B2 (ja) 2012-10-24
WO2002067180A1 (en) 2002-08-29
JP4833909B2 (ja) 2011-12-07
JP4397163B2 (ja) 2010-01-13
CA2438566A1 (en) 2002-08-29
JP2007203375A (ja) 2007-08-16
CN1491398A (zh) 2004-04-21
GB2390699A (en) 2004-01-14
GB2390699B (en) 2004-10-13
GB0318352D0 (en) 2003-09-10
DE10296339T5 (de) 2004-04-15

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