GB2390699B - On-the-fly beam path error correction for memory link processing - Google Patents

On-the-fly beam path error correction for memory link processing

Info

Publication number
GB2390699B
GB2390699B GB0318352A GB0318352A GB2390699B GB 2390699 B GB2390699 B GB 2390699B GB 0318352 A GB0318352 A GB 0318352A GB 0318352 A GB0318352 A GB 0318352A GB 2390699 B GB2390699 B GB 2390699B
Authority
GB
United Kingdom
Prior art keywords
error correction
beam path
link processing
path error
memory link
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0318352A
Other versions
GB2390699A (en
GB0318352D0 (en
Inventor
Mark Unrath
Kelly Bruland
Ho Wai Lo
Stephen Swaringen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of GB0318352D0 publication Critical patent/GB0318352D0/en
Publication of GB2390699A publication Critical patent/GB2390699A/en
Application granted granted Critical
Publication of GB2390699B publication Critical patent/GB2390699B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Lasers (AREA)
GB0318352A 2001-02-16 2002-02-15 On-the-fly beam path error correction for memory link processing Expired - Fee Related GB2390699B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US26964601P 2001-02-16 2001-02-16
PCT/US2002/004561 WO2002067180A1 (en) 2001-02-16 2002-02-15 On-the-fly beam path error correction for memory link processing

Publications (3)

Publication Number Publication Date
GB0318352D0 GB0318352D0 (en) 2003-09-10
GB2390699A GB2390699A (en) 2004-01-14
GB2390699B true GB2390699B (en) 2004-10-13

Family

ID=23028100

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0318352A Expired - Fee Related GB2390699B (en) 2001-02-16 2002-02-15 On-the-fly beam path error correction for memory link processing

Country Status (8)

Country Link
JP (3) JP4397163B2 (en)
KR (1) KR100821115B1 (en)
CN (2) CN1317667C (en)
CA (1) CA2438566A1 (en)
DE (1) DE10296339T5 (en)
GB (1) GB2390699B (en)
TW (1) TW535199B (en)
WO (1) WO2002067180A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6706999B1 (en) * 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
US7363180B2 (en) * 2005-02-15 2008-04-22 Electro Scientific Industries, Inc. Method for correcting systematic errors in a laser processing system
US7297972B2 (en) * 2005-08-26 2007-11-20 Electro Scientific Industries, Inc. Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target
US8026158B2 (en) * 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
US8378259B2 (en) * 2008-06-17 2013-02-19 Electro Scientific Industries, Inc. Eliminating head-to-head offsets along common chuck travel direction in multi-head laser machining systems
TWI594828B (en) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 Acousto-optic deflector applications in laser processing of features in a workpiece, and related laser processing method
CN110039173B (en) * 2010-10-22 2021-03-23 伊雷克托科学工业股份有限公司 Laser machining system and method for beam dithering and skiving
CN105121088B (en) * 2013-03-15 2017-03-08 伊雷克托科学工业股份有限公司 Laser processing apparatus and the method processing workpiece via laser tool operation
JP6516722B2 (en) * 2013-03-15 2019-05-22 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド Control based on laser emission of beam positioner
CN111266741A (en) * 2018-11-19 2020-06-12 深圳市圭华智能科技有限公司 Laser processing system and laser processing method
JP7442351B2 (en) 2020-03-12 2024-03-04 株式会社ディスコ laser processing equipment
CN115916450A (en) * 2020-08-18 2023-04-04 株式会社 尼康 Optical device and processing device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5673110A (en) * 1993-01-26 1997-09-30 Phase Metrics, Inc. Multiplexed laser interferometer for non-dispersed spectrum detection in a dynamic flying height tester
US5751585A (en) * 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
US6088107A (en) * 1998-10-20 2000-07-11 Trw Inc. High resolution positioner

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1006938B (en) * 1985-04-01 1990-02-21 索尼公司 Apparatus for reproducing of optical information
JP2942804B2 (en) * 1988-03-03 1999-08-30 株式会社ニコン Laser processing apparatus and laser beam control method for laser processing apparatus
JPH089110B2 (en) * 1988-03-03 1996-01-31 株式会社ニコン Laser beam control method for laser processing apparatus
DE4000166A1 (en) * 1990-01-05 1991-07-11 Hell Rudolf Dr Ing Gmbh METHOD AND DEVICE FOR CORRECTING POSITION ERRORS OF A DEFLECTED LIGHT BEAM
JPH08195461A (en) * 1995-01-18 1996-07-30 Hitachi Constr Mach Co Ltd Method and system for machining dam bar
JPH08316396A (en) * 1995-05-16 1996-11-29 Hitachi Constr Mach Co Ltd Dam bar cutting method and dam bar cutting device
JPH0970679A (en) * 1995-09-07 1997-03-18 Nikon Corp Method for controlling laser beam machine
CN1180221A (en) * 1996-09-30 1998-04-29 大宇电子株式会社 Apparatus and method for controlling tracking balance of optical disk player
JP3769942B2 (en) * 1997-09-02 2006-04-26 セイコーエプソン株式会社 Laser processing method and apparatus, and circuit forming method and apparatus for non-conductive transparent substrate
JPH11267873A (en) * 1998-03-23 1999-10-05 Seiko Epson Corp Scan optical system of laser light and laser processing device
JPH11245061A (en) * 1998-12-15 1999-09-14 Nikon Corp Laser beam control method of laser processing device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5673110A (en) * 1993-01-26 1997-09-30 Phase Metrics, Inc. Multiplexed laser interferometer for non-dispersed spectrum detection in a dynamic flying height tester
US5751585A (en) * 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5798927A (en) * 1995-03-20 1998-08-25 Electro Scientific Industries, Inc. Apparatus and method for coordinating the movements of stages in a multi-stage multi-rate positioner system
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
US6088107A (en) * 1998-10-20 2000-07-11 Trw Inc. High resolution positioner

Also Published As

Publication number Publication date
CN101172319A (en) 2008-05-07
WO2002067180A1 (en) 2002-08-29
JP2011098394A (en) 2011-05-19
JP4833909B2 (en) 2011-12-07
CN1317667C (en) 2007-05-23
CA2438566A1 (en) 2002-08-29
JP4397163B2 (en) 2010-01-13
KR20030091990A (en) 2003-12-03
JP2007203375A (en) 2007-08-16
JP2004527376A (en) 2004-09-09
CN1491398A (en) 2004-04-21
DE10296339T5 (en) 2004-04-15
GB2390699A (en) 2004-01-14
JP5055443B2 (en) 2012-10-24
KR100821115B1 (en) 2008-04-11
GB0318352D0 (en) 2003-09-10
TW535199B (en) 2003-06-01

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20100215