GB2390699A - On-the-fly beam path error correction for memory link processing - Google Patents
On-the-fly beam path error correction for memory link processing Download PDFInfo
- Publication number
- GB2390699A GB2390699A GB0318352A GB0318352A GB2390699A GB 2390699 A GB2390699 A GB 2390699A GB 0318352 A GB0318352 A GB 0318352A GB 0318352 A GB0318352 A GB 0318352A GB 2390699 A GB2390699 A GB 2390699A
- Authority
- GB
- United Kingdom
- Prior art keywords
- positioner
- axis
- mirror
- steering mirror
- error correction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012937 correction Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
- H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Lasers (AREA)
Abstract
Laser beam positioners (Figure 12, 340, 236, 260, 262, 302, 304, 310, 312, 316, 318, 320, 322, 324, 326, 328, 330, 336, 342) employ a steering mirror that performs small-angle deflection of a laser beam to compensate for cross-axis setting errors of a positioner stage. A two-axis mirror is preferred because either axis of the positioner stages may be used for performing work. In one embodiment, the steering mirror is used for error correction only without necessarily requiring coordination with the positioner stage position commands. A fast steering mirror employing a flexure mechanism and piezoelectric actuators to tip and tilt the mirror is preferred in semiconductor link processing ("SLP") applications. This invention compensates for cross-axis settling time, resulting in increased SLP system throughput and accurately while simplifying complexity of the positioner stages because the steering mirror corrections relax the positioner stage servo driving requirements.
Description
GB 2390699 A continuation (74) Agent and/or Address for Service: Forrester
Ketley & Co Forrester House, 52 Bounds Green Road, LONDON, N11 2EY, United Kingdom
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US26964601P | 2001-02-16 | 2001-02-16 | |
PCT/US2002/004561 WO2002067180A1 (en) | 2001-02-16 | 2002-02-15 | On-the-fly beam path error correction for memory link processing |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0318352D0 GB0318352D0 (en) | 2003-09-10 |
GB2390699A true GB2390699A (en) | 2004-01-14 |
GB2390699B GB2390699B (en) | 2004-10-13 |
Family
ID=23028100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0318352A Expired - Fee Related GB2390699B (en) | 2001-02-16 | 2002-02-15 | On-the-fly beam path error correction for memory link processing |
Country Status (8)
Country | Link |
---|---|
JP (3) | JP4397163B2 (en) |
KR (1) | KR100821115B1 (en) |
CN (2) | CN1317667C (en) |
CA (1) | CA2438566A1 (en) |
DE (1) | DE10296339T5 (en) |
GB (1) | GB2390699B (en) |
TW (1) | TW535199B (en) |
WO (1) | WO2002067180A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6706999B1 (en) * | 2003-02-24 | 2004-03-16 | Electro Scientific Industries, Inc. | Laser beam tertiary positioner apparatus and method |
US7363180B2 (en) * | 2005-02-15 | 2008-04-22 | Electro Scientific Industries, Inc. | Method for correcting systematic errors in a laser processing system |
US7297972B2 (en) * | 2005-08-26 | 2007-11-20 | Electro Scientific Industries, Inc. | Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target |
US8026158B2 (en) * | 2007-06-01 | 2011-09-27 | Electro Scientific Industries, Inc. | Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window |
US8378259B2 (en) * | 2008-06-17 | 2013-02-19 | Electro Scientific Industries, Inc. | Eliminating head-to-head offsets along common chuck travel direction in multi-head laser machining systems |
TWI523720B (en) | 2009-05-28 | 2016-03-01 | 伊雷克托科學工業股份有限公司 | Acousto-optic deflector applications in laser processing of features in a workpiece, and related laser processing method |
KR20220046706A (en) * | 2010-10-22 | 2022-04-14 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | Laser processing systems and methods for beam dithering and skiving |
CN105121088B (en) * | 2013-03-15 | 2017-03-08 | 伊雷克托科学工业股份有限公司 | Laser processing apparatus and the method processing workpiece via laser tool operation |
KR102166134B1 (en) | 2013-03-15 | 2020-10-16 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | Laser emission-based control of beam positioner |
CN111266741A (en) * | 2018-11-19 | 2020-06-12 | 深圳市圭华智能科技有限公司 | Laser processing system and laser processing method |
JP7442351B2 (en) * | 2020-03-12 | 2024-03-04 | 株式会社ディスコ | laser processing equipment |
EP4201577A4 (en) * | 2020-08-18 | 2024-05-29 | Nikon Corporation | Optical device and processing device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5673110A (en) * | 1993-01-26 | 1997-09-30 | Phase Metrics, Inc. | Multiplexed laser interferometer for non-dispersed spectrum detection in a dynamic flying height tester |
US5751585A (en) * | 1995-03-20 | 1998-05-12 | Electro Scientific Industries, Inc. | High speed, high accuracy multi-stage tool positioning system |
US5847960A (en) * | 1995-03-20 | 1998-12-08 | Electro Scientific Industries, Inc. | Multi-tool positioning system |
US6088107A (en) * | 1998-10-20 | 2000-07-11 | Trw Inc. | High resolution positioner |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1006938B (en) * | 1985-04-01 | 1990-02-21 | 索尼公司 | Apparatus for reproducing of optical information |
JPH089110B2 (en) * | 1988-03-03 | 1996-01-31 | 株式会社ニコン | Laser beam control method for laser processing apparatus |
JP2942804B2 (en) * | 1988-03-03 | 1999-08-30 | 株式会社ニコン | Laser processing apparatus and laser beam control method for laser processing apparatus |
DE4000166A1 (en) * | 1990-01-05 | 1991-07-11 | Hell Rudolf Dr Ing Gmbh | METHOD AND DEVICE FOR CORRECTING POSITION ERRORS OF A DEFLECTED LIGHT BEAM |
JPH08195461A (en) * | 1995-01-18 | 1996-07-30 | Hitachi Constr Mach Co Ltd | Method and system for machining dam bar |
JPH08316396A (en) * | 1995-05-16 | 1996-11-29 | Hitachi Constr Mach Co Ltd | Dam bar cutting method and dam bar cutting device |
JPH0970679A (en) * | 1995-09-07 | 1997-03-18 | Nikon Corp | Method for controlling laser beam machine |
CN1180221A (en) * | 1996-09-30 | 1998-04-29 | 大宇电子株式会社 | Apparatus and method for controlling tracking balance of optical disk player |
JP3769942B2 (en) * | 1997-09-02 | 2006-04-26 | セイコーエプソン株式会社 | Laser processing method and apparatus, and circuit forming method and apparatus for non-conductive transparent substrate |
JPH11267873A (en) * | 1998-03-23 | 1999-10-05 | Seiko Epson Corp | Scan optical system of laser light and laser processing device |
JPH11245061A (en) * | 1998-12-15 | 1999-09-14 | Nikon Corp | Laser beam control method of laser processing device |
-
2002
- 2002-02-15 DE DE10296339T patent/DE10296339T5/en not_active Withdrawn
- 2002-02-15 KR KR1020037010793A patent/KR100821115B1/en active IP Right Grant
- 2002-02-15 JP JP2002566426A patent/JP4397163B2/en not_active Expired - Lifetime
- 2002-02-15 TW TW091102701A patent/TW535199B/en not_active IP Right Cessation
- 2002-02-15 CN CNB028046862A patent/CN1317667C/en not_active Expired - Lifetime
- 2002-02-15 WO PCT/US2002/004561 patent/WO2002067180A1/en active Application Filing
- 2002-02-15 GB GB0318352A patent/GB2390699B/en not_active Expired - Fee Related
- 2002-02-15 CN CNA2007100915231A patent/CN101172319A/en active Pending
- 2002-02-15 CA CA002438566A patent/CA2438566A1/en not_active Abandoned
-
2007
- 2007-04-24 JP JP2007114770A patent/JP4833909B2/en not_active Expired - Fee Related
-
2011
- 2011-02-07 JP JP2011024232A patent/JP5055443B2/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5673110A (en) * | 1993-01-26 | 1997-09-30 | Phase Metrics, Inc. | Multiplexed laser interferometer for non-dispersed spectrum detection in a dynamic flying height tester |
US5751585A (en) * | 1995-03-20 | 1998-05-12 | Electro Scientific Industries, Inc. | High speed, high accuracy multi-stage tool positioning system |
US5798927A (en) * | 1995-03-20 | 1998-08-25 | Electro Scientific Industries, Inc. | Apparatus and method for coordinating the movements of stages in a multi-stage multi-rate positioner system |
US5847960A (en) * | 1995-03-20 | 1998-12-08 | Electro Scientific Industries, Inc. | Multi-tool positioning system |
US6088107A (en) * | 1998-10-20 | 2000-07-11 | Trw Inc. | High resolution positioner |
Also Published As
Publication number | Publication date |
---|---|
WO2002067180A1 (en) | 2002-08-29 |
JP5055443B2 (en) | 2012-10-24 |
KR100821115B1 (en) | 2008-04-11 |
CN101172319A (en) | 2008-05-07 |
JP4833909B2 (en) | 2011-12-07 |
JP2011098394A (en) | 2011-05-19 |
TW535199B (en) | 2003-06-01 |
CN1491398A (en) | 2004-04-21 |
CA2438566A1 (en) | 2002-08-29 |
KR20030091990A (en) | 2003-12-03 |
JP2004527376A (en) | 2004-09-09 |
JP4397163B2 (en) | 2010-01-13 |
GB0318352D0 (en) | 2003-09-10 |
CN1317667C (en) | 2007-05-23 |
JP2007203375A (en) | 2007-08-16 |
GB2390699B (en) | 2004-10-13 |
DE10296339T5 (en) | 2004-04-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20100215 |