TW530318B - Electron beam treatment apparatus - Google Patents
Electron beam treatment apparatus Download PDFInfo
- Publication number
- TW530318B TW530318B TW090124716A TW90124716A TW530318B TW 530318 B TW530318 B TW 530318B TW 090124716 A TW090124716 A TW 090124716A TW 90124716 A TW90124716 A TW 90124716A TW 530318 B TW530318 B TW 530318B
- Authority
- TW
- Taiwan
- Prior art keywords
- electron beam
- processing
- exit window
- tubes
- tube
- Prior art date
Links
- 238000010894 electron beam technology Methods 0.000 title claims abstract description 297
- 238000012545 processing Methods 0.000 claims abstract description 94
- 238000010521 absorption reaction Methods 0.000 claims abstract description 24
- 238000009826 distribution Methods 0.000 claims abstract description 8
- 230000004907 flux Effects 0.000 claims description 32
- 238000000926 separation method Methods 0.000 claims description 17
- 230000007246 mechanism Effects 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 abstract description 14
- 239000010408 film Substances 0.000 description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 15
- 238000002955 isolation Methods 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 15
- 239000010703 silicon Substances 0.000 description 15
- 239000007789 gas Substances 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 9
- 229910001873 dinitrogen Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 102100025490 Slit homolog 1 protein Human genes 0.000 description 4
- 101710123186 Slit homolog 1 protein Proteins 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 230000002079 cooperative effect Effects 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J33/00—Discharge tubes with provision for emergence of electrons or ions from the vessel; Lenard tubes
- H01J33/02—Details
- H01J33/04—Windows
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0866—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation
- B29C2035/0877—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation using electron radiation, e.g. beta-rays
Landscapes
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Formation Of Insulating Films (AREA)
- Physical Vapour Deposition (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000379679A JP2002182000A (ja) | 2000-12-14 | 2000-12-14 | 電子ビーム処理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW530318B true TW530318B (en) | 2003-05-01 |
Family
ID=18847995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090124716A TW530318B (en) | 2000-12-14 | 2001-10-05 | Electron beam treatment apparatus |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6881969B2 (enExample) |
| EP (1) | EP1215706A3 (enExample) |
| JP (1) | JP2002182000A (enExample) |
| KR (1) | KR20020046928A (enExample) |
| TW (1) | TW530318B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI466157B (zh) * | 2007-04-20 | 2014-12-21 | Sen Corp | 射束處理裝置 |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW486716B (en) * | 2000-05-12 | 2002-05-11 | Ushio Electric Inc | Electron beam processing device |
| WO2003067636A1 (fr) * | 2002-01-22 | 2003-08-14 | Tokyo Electron Limited | Dispositif et procede de traitement de surface |
| JP2004253749A (ja) | 2002-12-27 | 2004-09-09 | Tokyo Electron Ltd | 薄膜処理方法及び薄膜処理システム |
| GB0304386D0 (en) * | 2003-02-25 | 2003-04-02 | Glaxosmithkline Biolog Sa | Novel process |
| JP4372442B2 (ja) * | 2003-03-28 | 2009-11-25 | 東京エレクトロン株式会社 | 電子ビーム処理方法及び電子ビーム処理装置 |
| JP2004335667A (ja) * | 2003-05-06 | 2004-11-25 | Tokyo Electron Ltd | 表面処理装置 |
| JP2005003564A (ja) * | 2003-06-13 | 2005-01-06 | Ushio Inc | 電子ビーム管および電子ビーム取り出し用窓 |
| KR100542741B1 (ko) | 2003-06-26 | 2006-01-11 | 삼성전자주식회사 | 전자빔 검사 장치 및 이의 동작 상태 검사 방법 |
| JP4786368B2 (ja) * | 2006-02-23 | 2011-10-05 | 株式会社アドバンテスト | マルチコラム用電子ビーム生成装置 |
| JP4544475B2 (ja) * | 2006-03-30 | 2010-09-15 | 東京エレクトロン株式会社 | 変化率予測方法、記憶媒体及び基板処理システム |
| JP6024500B2 (ja) * | 2012-03-21 | 2016-11-16 | Ｊｆｅエンジニアリング株式会社 | アレイ型粒子線照射装置及びその制御方法 |
| US9383460B2 (en) | 2012-05-14 | 2016-07-05 | Bwxt Nuclear Operations Group, Inc. | Beam imaging sensor |
| US9535100B2 (en) | 2012-05-14 | 2017-01-03 | Bwxt Nuclear Operations Group, Inc. | Beam imaging sensor and method for using same |
| DE102014001344B4 (de) * | 2014-02-02 | 2015-08-20 | Crosslinking AB | Elektronenstrahleinheit mit schräg zur Transportrichtung ausgerichteten Heizkathodendrähten sowie Verfahren zur Bestrahlung |
| DE102014001342A1 (de) * | 2014-02-02 | 2015-08-06 | Crosslinking AB | Stützkonstruktion mit schräg verlaufenden Kühlkanälen für ein Elektronenaustrittsfenster |
| JP6532033B2 (ja) * | 2015-02-20 | 2019-06-19 | 国立大学法人東京農工大学 | 処理装置及び薄膜の製造方法 |
| US9981312B2 (en) * | 2015-05-11 | 2018-05-29 | Wisconsin Alumni Research Foundation | Three-dimension printer with mechanically scanned cathode-comb |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3925670A (en) * | 1974-01-16 | 1975-12-09 | Systems Science Software | Electron beam irradiation of materials using rapidly pulsed cold cathodes |
| US5414267A (en) * | 1993-05-26 | 1995-05-09 | American International Technologies, Inc. | Electron beam array for surface treatment |
| US5909032A (en) * | 1995-01-05 | 1999-06-01 | American International Technologies, Inc. | Apparatus and method for a modular electron beam system for the treatment of surfaces |
| US5968605A (en) * | 1997-02-27 | 1999-10-19 | Acushnet Company | Electron beam radiation curable inks for game balls, golf balls and the like |
| DE69816426T2 (de) * | 1997-03-18 | 2004-05-06 | Dsm N.V. | Verfahren zum härten von optikfaserbeschichtungen und druckfarben mittels elektronenstrahlung niedriger energie |
| US6140657A (en) * | 1999-03-17 | 2000-10-31 | American International Technologies, Inc. | Sterilization by low energy electron beam |
| TW464947B (en) | 1999-11-29 | 2001-11-21 | Ushio Electric Inc | Measuring apparatus of electron beam quantity and processing apparatus of electron beam irradiation |
-
2000
- 2000-12-14 JP JP2000379679A patent/JP2002182000A/ja active Pending
-
2001
- 2001-10-05 TW TW090124716A patent/TW530318B/zh not_active IP Right Cessation
- 2001-11-15 KR KR1020010070988A patent/KR20020046928A/ko not_active Abandoned
- 2001-12-10 EP EP01129437A patent/EP1215706A3/en not_active Withdrawn
- 2001-12-13 US US10/013,536 patent/US6881969B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI466157B (zh) * | 2007-04-20 | 2014-12-21 | Sen Corp | 射束處理裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US6881969B2 (en) | 2005-04-19 |
| KR20020046928A (ko) | 2002-06-21 |
| EP1215706A3 (en) | 2005-05-04 |
| JP2002182000A (ja) | 2002-06-26 |
| US20020074519A1 (en) | 2002-06-20 |
| EP1215706A2 (en) | 2002-06-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100269911B1 (ko) | 표면처리를 위한 전자빔 어레이 | |
| JP4073174B2 (ja) | 中性粒子ビーム処理装置 | |
| CN105706213B (zh) | 等离子体产生设备 | |
| US6657212B2 (en) | Electron beam measurement method and electron beam irradiation processing device | |
| US5750011A (en) | Apparatus and method for producing gaseous ions by use of x-rays, and various apparatuses and structures using them | |
| JP2002182000A (ja) | 電子ビーム処理装置 | |
| JP7038728B2 (ja) | 加速電子発生装置 | |
| JP2022501795A (ja) | 電極アレイ | |
| US20150068681A1 (en) | Plasma processing apparatus | |
| JP7209318B2 (ja) | フラットパネルディスプレイ製造装置 | |
| JP2728986B2 (ja) | 放射線モニタ | |
| KR20050028028A (ko) | 에어로졸 입자 하전장치 | |
| JP2002341100A (ja) | 電子線照射装置 | |
| JPH07318698A (ja) | 電子線照射装置 | |
| US2762941A (en) | Positive ion electrostatic accelerator | |
| JP3904380B2 (ja) | 電子線量の測定方法および電子線照射処理装置 | |
| JP2006294602A (ja) | 除電方法、除電装置、ガラス基板の帯電防止方法およびガラス基板の帯電防止装置 | |
| JP3309435B2 (ja) | イオンビームデポジション装置 | |
| JPH02216500A (ja) | 荷電粒子照射方法および荷電粒子照射装置 | |
| JP5285998B2 (ja) | イオン照射装置 | |
| JP3407360B2 (ja) | パルス電子ビーム伝搬装置 | |
| JP2004211123A (ja) | 荷電粒子照射装置 | |
| JPH033225A (ja) | 荷電粒子ビーム露光装置 | |
| JPH02142042A (ja) | 電子線照射装置 | |
| JP2010062056A (ja) | イオン照射装置、真空処理装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |