486716 A7 B7 五、發明説明C| ) 【發明所屬之技術領域】 (請先閲讀背面之注意事項再填寫本頁)486716 A7 B7 V. Description of the invention C |) [Technical field to which the invention belongs] (Please read the notes on the back before filling in this page)
本發明係關於以電子束對處理物加以照射，並進行各 種處理的電子束處理裝置，例如：關於晶圓上稱作S〇G (Spin On Glass )的半導體裝置上的層間絕緣膜的硬化與 其他處理物的薄膜形成的電子束處理裝置。 【先前技術】 第1 0圖顯示了先前技術的電子束處理裝置之一例。 電子束發射管1連接著圖中並未顯示的高壓電源，以 電子束照射在置於處理室2內部的處理物6。電子束發射 管1具有蓋部3與窗部4，蓋部3是以覆蓋住電子束發射 管1的開口之方式來加以設置，例如：由矽元素來加以作 成的。蓋部3具有讓電子束通過的開口部3 1 ，而電子束 是從電子束發射管1朝向處理室2內部發射出。 經濟部智慧財產局8工消費合作社印製 爲了能夠讓電子束通過，覆蓋住開口部3 1的窗部4 是由複數個開口所組成。如此的窗部4，例如：由矽元素 所組成的窗部，是以數// m厚的薄膜來組成的。在此，電 子束發射管的照射部是由蓋部3與窗部4來形成的。 此外，處理物6是載置於加熱座5上面。 藉由這樣的電子束處理裝置，從電子束發射管1發射 出來，照射在處理物6的電子束能夠於短時間內以有效率 的方式來處理。此外，藉由加熱座5將處理物6加熱，亦 能達到更有效率的處理。 -4 - 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 486716 A7 -------B7 五、發明説明（2 .) 【發明所欲解決之課題】 (請先閲讀背面之注意事項再填寫本頁) 然而，先前的電子束處理裝置具有污染物質附著於窗 部4，以及窗部4高溫化的問題。 具體而言’若將電子束照射於做爲處理物的電阻等有 機膜上的話，從有機膜上會產生出揮發性的污染物質，此 污染物質會附著於電子束發射管1的照射部，尤其是窗部 4。若是這樣的污染物質附著於窗部4的話，窗部4會氧 化或碳化，其機械性強度變弱，並邁向毀損。 此外，若是污染物質附著於窗部4的話，將發生通過 窗部4之電子束的能量被污染物質吸收，使得窗部4溫度 上昇而變得更容易損壞的問題。 再者，雖然圖內沒有顯示，若是在進行處理之際提供 了氯氣（C 1 )，氟氣（F )等處理氣體的狀況時，構成 窗部4的矽元素將會被這些氣體腐蝕。由此，窗部4的機 械性強度將變弱並變得容易損壞。 經濟部智慧財產局員工消費合作社印製 •此外，伴隨著窗部4，蓋部3若一同被加熱的話，氣 體將從配置於電子束發射管1內的各種零件中釋出，例如 :從產生電子束所設置的金屬材料，.以及構成電子束發射 管外圍的玻璃體。氣體釋出後，電子束發射管1內的氣壓 變高，電子束發射管1內的各個零件之間發生放電，使得 電子束無法達到所需的能量輸出。 本發明的目的在於，鑑於上述的幾個問題點的發生’ 提供防止污染物質附著於顯露在電子束發射管的處理室內 部之照射部，尤其是窗部’並且能夠抑制照射部的溫度上 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 486716 經濟部智慧財產局員工消費合作社印製 A7 ___B7五、發明説明（3 ) 升之電子束處理裝置。 【用以解決課題之手段】 爲了解決上述的課題，本發明採用以下的手段。 第1種手段：一種電子束處理裝置，係就具備有：將 電子束發射管的照射部配置於處理室內部並使其顯露出， 並對配置於處理室內的處理物以電子束加以照射之電子束 處理裝置，其特徵爲：上述的照射部是由具有可讓電子束 通過之開口部的蓋部，以及覆蓋住開口部並具有電子束透 適部之窗部所構成，再者，在此照射部之中，除了電子束 透過部之外的部分，均配置冷卻隔體並使其與透過部之外 的部分緊密接觸。 第2種手段其特徵爲：除了第1種手段之外，再加上 將冷卻氣體吹向上述窗部的手段。 第3種手段：一種電子束處理裝置，係就具備有：將 電子束發射管的照射部配置於處理室內部並使其顯露出， 並對載置於處理室內的處理物以電子束加以照射之電子束 處理裝置，.其特徵爲：於上述照射部的鄰近處設置將非活 性氣體吹向該照射部之非活性氣體吹出部以及此非活性氣 體的排出口。 第4種手段：一種電子束處理裝置’係就具備有：將 電子束發射管的照射部配置於處理室內部並使其顯露出， 並對載置於處理室內的處理物以電子束加以照射之電子束 處理裝置，其特徵爲：上述的處理室是由’收納了上述電 本&張尺度適用中國國家標準（CNS ) A4規格(210X297公釐1 ""—" (請先閱讀背面之注意事項再填寫本頁) 486716 A7 B7 五、發明説明Q ) (請先閲讀背面之注意事項再填寫本頁) 子束發射管的照射部並具有非活性氣體流入口的第1處理 室，以及收納了上述被載置的處理物並具有上述非活性氣 體的氣體排出口的第2處理室，以及具有上述電子束和上 述非活性氣體的開口部之上述第1處理室與上述第2處理 室之間的隔離板所構成的。 第5種手段其特徵爲：上述非活性氣體通過上述電子 束發射管的照射部附近之後，於其所到達之上述處理室內 部的下游，設置了讓處理上述處理物所需之處理氣體能夠 流入之氣體流入口。 【發明之實施形態】 首先，佐以第1圖至第3圖說明本發明之電子束處理 裝置之第1實施形態。 第1圖顯示本發明之電子束處理裝置之構成的正面剖 面圖，第2圖顯示電子束發射管的照射部附近之放大圖， 第3·圖顯示電子束發射管的底面圖。 經濟部智慧財產局8工消費合作社印製 於這些圖當中，窗部4是由電子束透過部4 1與非透 過部4 2所形成的。爲了讓電子束通過，以薄膜形成的電 子束透過部4 1被設置了多數個。 在此，雖然如同上述所言是藉由蓋部3與窗部4來形 成照射物，.但是冷卻隔體7是以覆蓋電子束透過部4 1以 外的部分之方式與照射部接觸而加以設置。於冷卻隔體7 的內部，設置了讓水等等的冷卻用流體流動之冷卻管7 1 ，以及從冷卻隔體7外部導入非活性氣體等等的冷卻氣體 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） _ 7 _ 486716 A7 B7 五、發明説明（g ) ，並於窗部4附近將冷卻氣體吹出的冷卻管7 2。 於冷卻管7 2上設置了多數個小孔部7 2 1 ，由此將 (請先閲讀背面之注意事項再填寫本頁) 冷卻氣體向窗部4吹出。冷卻氣體經由冷卻氣體流入管8 流入，經由冷卻氣體流出管9排出。 此外，與第1 〇圖所示之圖號相同者具有同樣的構成 。因此省略其說明。 在此實施例之電子束照射裝置中，藉由設置於冷卻隔 體7之冷卻管7 1 ，蓋部3以及窗部4，亦即照射部能夠 得到良好的冷卻效果。藉此，亦可防止蓋部3以及窗部4 之溫度上昇。 此外，在此實施例中，於窗部4附近，從多數個小孔 部7 2 1吹出的冷卻氣體吹向窗部4的表面。因此，不僅 可以更有效率的冷卻窗部4，亦可防止於處理室2產生之 污染物質附著於窗部4。 再者，雖然僅在電子束透過部4 1之一端設置一條冷 卻管7 2，但是亦可以以夾住透過部4 1的方式於另一端 追加設置另一條冷卻管。 經濟部智慧財產局員工消費合作社印製 其次，.關於本發明的其他實施例，佐以第4圖至第6 圖加以說明。 第4圖顯示本發明之電子束處理裝置之構成的正面剖 面圖，第5.圖顯示第4圖所示之電子束發射管1之照射部 附近的放大圖，第6圖顯示電子束處理裝置之構成的底面 圖。 此實施例與上述實施例不同的點在於與冷卻氣體有關 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐) 7Τ] 486716 A7 B7 五、發明説明（e ) 之構造。冷卻隔體1 0具有冷卻管1 0 2 ，其特徵如下： 從外部導入非活性氣體等的冷卻氣體，並從顯露於冷卻隔 體1 0與蓋部3之間的開口部將冷卻氣體吹出。 在此，第5圖所示之位置a 、b對應於第6圖所示之 冷卻隔體1 0之虛線位置a'、b。 此外，與上述說明相同之圖號者具有同樣的構成，因 此省略其說明。 在此實施例中，在由冷卻隔體1 0與蓋部3與窗部4 所形成之空間部分當中，冷卻氣體從冷卻管1 0 2的開口 部釋出，能夠冷卻蓋部3以及窗部4。因此可以防止蓋部 3與窗部4的高溫化。 尙且，於上述實施例中，並不必然得於冷卻隔體1〇 之中設置冷卻管1 0 1 ，視情況亦可將之拆下。在這樣的 情況下，隔體1 0不再是冷卻隔體，而僅是做爲隔體發揮 其功效。此外，即使在這樣的情況下，可藉由冷卻氣體來 有效的防止污染物質附著於窗部，並且，亦可藉由冷卻氣 體來冷卻照射部。 第7圖顯示本發明之其他實施例的電子束處理裝置之 正面剖面圖。 於第7圖中，處理室2是由第1處理室與第2處理室 所構成的。於第1處理室2 1中，收納了電子束發射管1 之照射部的同時，還具有導入非活性氣體之氣體流入管 1 1。而在第2處理室2 2，收納了載置於處理座之處理 物的同時，還具有將包含非活性氣體在內的氣體排出的氣 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ΐ衣-- (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 486716 經濟部智慧財產局員工消費合作社印製 A7 ____ B7五、發明説明（7 ) 體排出管9。. 並且，在第1處理室2 1與第2處理室2 2之間具有 將兩者區隔開的隔離板1 2。於此隔離板1 2中，具有可 讓電子束與非活性氣體通過的開口部1 2 1。 此外，本圖中與上述諸圖相同之圖號者具有同樣的構 成，因此省略其說明。 在此實施例的電子束照射裝置當中，從氣體流入管 1 1流入第1處理室2 1之非活性氣體，在流過電子束發 射管1的照射部，尤其是窗部4附近之後，與電子束照射 時所產生的污染物質等一同經由開口部1 2 1從氣體排出 管9排出。這是因爲處理室2維持在減壓後之一定的氣壓 狀態之下。 ’ 因此，可以防止電子束照射時所產生的污染物質附著 於窗部4之電~子束透過部4 1等等。 更進一步的，第8圖顯示本發明之其他實施例的電子 束處理裝置之正面剖面圖。 於該圖中，關於處理物6的電子束照射處理，是於處 理室2當中設置了供給包含氯（C 1 )、氟（F )等處理 氣體之處理氣體流入管1 3。 此外，本圖中與上述諸圖相同之圖號者具有同樣的構 成，因此省略其說明。 根據此實施例，從處理氣體流入管1 3流入處理室2 之處理氣體當中，剩餘的處理氣體是與電子束照射時所產 生的污染物質一同從氣體排出管9排出。其理由與上述相 (請先閲讀背面之注意事項再填寫本頁) 一裝. 訂 L# • 1Ί I J— 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -10- 486716 A 7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（s ) 同，均是因爲處理室2維持在減壓後之一定的氣壓狀態之 下。並且，藉由非活性氣體之流向，可以防止處理氣體流 向電子束發射管1的照射部。因此，便可以有效防止因處 理氣體與窗部4接觸而引起腐蝕所導致之窗部4的機械性 強度變弱並進而毀損的問題。 ' 再者，第8圖所示之具有處理氣體流入管之構造，亦 適用於第7圖所示之備有第1處理室與第2處理室構造之 處理裝置，在此情形下當然能夠達成上述兩個實施例所說 明之作用效果。 第9圖顯示本發明之電子束處理裝置的其他實施例。 第9圖（a )顯示電子束處理裝置之構成之正面剖面 圖，第9圖（b )顯示了第9圖（a )所示之處理氣體供 給隔體的組成之平面圖。 於該圖中，第2處理室2 2具有處理氣體供給隔體 1 5。從此處理氣體供給隔體1 5當中，供給了對處理物 6的處理所需之包含氯（C1)、氟（F)等處理氣體。 並且，處理氣體供給隔體1 5具有處理氣體放出孔1 5 1 ，其設置於將處理氣體發射至處理物6的位置上。 此外，本圖中與上述諸圖相同之圖號者具有同樣的構 成，因此省略其說明。 在此實施例中，非活性氣體亦是與電子束照射時所產 生的污染物質等一同經由開口部1 2 1從排出管9向外排 出，可防止電子束照射時所產生的污染物質附著於窗部4 。因此，與上述實施例相同，可以有效防止因處理氣體所 — ^---7^^批衣-- (請先閱讀背面之注意事項再填寫本頁) 訂 .JT— I 11 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐,) -11 - 486716 A7 B7 五、發明説明（9 ) 導致之窗部4的機械性強度變弱並進而毀損的問題。 在此貫施例之電子束處理裝置當中，雖是採取將電子 束發射管配置於處理室的上部，將處理物配置於下部的構 造，但並不見得一定要限定於如此形態。亦即，將電子束 發射管配置於處理室的一邊，將處理物配置於另一邊亦是 可行的。 【發明之效果】 如上所述，根據申請專利範圍之第1請求項所記載之 電子束照射裝置，因爲冷卻隔體是以接觸照射部的狀態來 配置，因此可以藉由冷卻隔體來冷卻照射部，並可防止照 射部的蓋部與窗部之溫度上昇。 其結果爲：可以抑制因照射部高溫化所導致之電子束 發射管管內的金屬材料與構成外圍的玻璃體之氣體釋出， 以及防止電子束發射管管內的異常放電等之發生。 此外，根據申請專利範圍之第2請求項所記載之電子 束照射裝置，因爲冷卻氣體被吹向窗部4，不僅可以有效 率的冷卻窗部，亦能防止在處理室內產生之污染物質、副 產物附著於窗部。並且，亦可防止因污染物質、副產物附 著，使得窗部發生氧化或碳化，其機械性強度變弱並進而 損壞的問題發生。 此外，根據申請專利範圍之第3請求項所記載之電子 束照射裝置，因爲非活性氣體是由氣體吹出部吹至電子束 發射管之照射部，因此可以防止電子束照射時所產生之污 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） _ 12 _ (請先閲讀背面之注意事項再填寫本頁) 項再填{ί 經濟部智慧財產局員工消費合作社印製 486716 A7 B7 五、發明説明（1〇 ) (請先閲讀背面之注意事項再填寫本頁) 染物質附著於照射部上，並可防止因污染物質的附著使得 照射部的部分發生氧化或碳化，進而防止其機械性強度變 弱並損壞的問題發生。 此外，根據申請專利範圍之第4請求項所記載之電子 束照射裝置，可以將電子束照射時所產生之污染物質隨著 非活性氣體的流向有效的排出，並可防止污染物質附著於 電子束發射管的照射部上。 此外，根據申請專利範圍之第5、6請求項所記載之 電子束照射裝置，因爲是將處理氣體灌入處理室的下游方 向’這些處理氣體會隨著電子束照射時所產生之污染物質 等一同由氣體排出口排出。因此，因處理氣體對照射部的 一部分所造成腐蝕等作用而使其機械性強度變弱並進而毀 損的問題可加以防止。 【圖面之簡單說明】 第1圖係顯示本發明之第1實施形態的電子束處理裝 置的構成之正面剖面圖。 經濟部智慧財產局員工消費合作社印製 第2圖係顯示第1圖所示之電子束發射管1的照射部 附近之擴大圖。 第3圖係顯示本發明之第1實施形態的電子束處理裝 置的構成之底面圖。 第4圖係顯示本發明之第2實施形態的電子束處理裝 置的構成之正面剖面圖。 第5斷係顯示第4圖所示之電子束發射管1的照射部 -13- 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐.) 486716 A7 _______B7 五、發明説明（H ) 附近之擴大圖。 第6圖係顯示本發明之第2實施形態的電子束處理裝 置的構成之底面圖。 第7圖係顯示本發明之第3實施形態的電子束處理裝 置的構成之正面剖面圖。 第8圖係顯示本發明之第4實施形態的電子束處理裝 置的構成之正面剖面圖。 第9圖係顯示本發明之第5實施形態的電子束處理裝 置的構成之正面剖面圖。 第1 〇圖係顯示先前技術之電子束處理裝置的構成之 正面剖面圖。 【圖號說明】 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 1 電 子 束 發 射 管 2 處 理 室 2 1 上 部 處 理 室 2 2 下 部 處 理 室 3 蓋 部 3 1 開 P 部 4 窗 部 4 1 電 子 束 透 過 部 4 2 電 子 束 非 透 過部 5 處 理 座 6 處 理 物 -14- 本紙張尺度適用中國國家標準（CNS ) A4規格（210父297公釐,) 486716 A7 B7五、發明説明（12 ) 7，1 0 非活性氣體供給隔體 7 1 ，1 0 1 非活性氣體噴出管 7 1 1 ，1〇1 1 噴出孔 8，1 1 氣體流入管 9 氣體排出管 12 隔離板 12 1 隔離板開口部 1 3，1 4 處理氣體流入管 15 處理氣體供給隔體 1 5 1 處理氣體放出孔 16 處理物支持部 (請先閲讀背面之注意事項再填寫本頁) 裝· 、訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐,) -15-The present invention relates to an electron beam processing apparatus that irradiates a processed object with an electron beam and performs various processes. For example, the present invention relates to the curing and curing of an interlayer insulation film on a semiconductor device called SGO (Spin On Glass) on a wafer. Electron beam processing device for forming thin films of other processed objects. [Prior Art] Fig. 10 shows an example of a prior art electron beam processing apparatus. The electron beam emission tube 1 is connected to a high-voltage power source not shown in the figure, and irradiates the treatment object 6 placed inside the processing chamber 2 with an electron beam. The electron beam emission tube 1 includes a cover portion 3 and a window portion 4. The cover portion 3 is provided so as to cover the opening of the electron beam emission tube 1, and is made of, for example, a silicon element. The cover portion 3 has an opening portion 3 1 through which an electron beam passes, and the electron beam is emitted from the electron beam emission tube 1 toward the inside of the processing chamber 2. Printed by the Intellectual Property Office of the Ministry of Economic Affairs and the Industrial Cooperative Cooperative. In order to allow the electron beam to pass through, the window portion 4 covering the opening portion 31 is composed of a plurality of openings. Such a window portion 4, for example, a window portion composed of a silicon element is composed of a thin film having a thickness of several meters. Here, the irradiation portion of the electron beam emission tube is formed by the cover portion 3 and the window portion 4. The treatment object 6 is placed on the heating base 5. With such an electron beam processing device, an electron beam emitted from the electron beam emission tube 1 and irradiated on the treatment object 6 can be processed in an efficient manner in a short time. In addition, more efficient processing can be achieved by heating the processed object 6 by the heating base 5. -4-This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210X297 mm) 486716 A7 ------- B7 V. Description of the invention (2.) [Questions to be solved by the invention] (Please read first (Notes on the back page, please fill in this page again) However, the conventional electron beam processing apparatus has a problem that pollutants adhere to the window portion 4 and the window portion 4 becomes hot. Specifically, if an electron beam is irradiated on an organic film such as a resistor as a treatment object, a volatile pollutant will be generated from the organic film, and this pollutant will adhere to the irradiation portion of the electron beam emission tube 1, Especially the window 4. If such a pollutant adheres to the window part 4, the window part 4 will be oxidized or carbonized, and its mechanical strength will become weak and it will be damaged. In addition, if the pollutants adhere to the window portion 4, the energy of the electron beam passing through the window portion 4 is absorbed by the pollutants, which causes the temperature of the window portion 4 to rise and become more easily damaged. In addition, although not shown in the figure, if a process gas such as chlorine gas (C 1), fluorine gas (F) is supplied during the process, the silicon element constituting the window portion 4 will be corroded by these gases. As a result, the mechanical strength of the window portion 4 becomes weak and easily damaged. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs • In addition, if the lid portion 3 is heated together with the window portion 4, the gas will be released from various parts arranged in the electron beam emission tube 1, such as: The metal material provided by the electron beam and the glass body constituting the periphery of the electron beam emission tube. After the gas is released, the air pressure in the electron beam emission tube 1 becomes high, and discharge occurs between various parts in the electron beam emission tube 1, so that the electron beam cannot reach the required energy output. In view of the occurrence of the above-mentioned problems, an object of the present invention is to provide a prevention part that prevents contamination from adhering to an irradiation part, particularly a window part, exposed inside a processing chamber of an electron beam emission tube, and can suppress the temperature of the irradiation part. Paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 486716 Printed by A7 _B7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (3) E-beam processing device. [Means for Solving the Problems] In order to solve the problems described above, the present invention adopts the following measures. First means: An electron beam processing apparatus comprising: arranging and exposing an irradiation portion of an electron beam emission tube inside a processing chamber; and irradiating a processed object disposed in the processing chamber with an electron beam. The electron beam processing apparatus is characterized in that the above-mentioned irradiating portion is composed of a cover portion having an opening portion through which an electron beam can pass, and a window portion covering the opening portion and having an electron beam transmitting portion. Of the irradiated portion, a portion other than the electron beam transmitting portion is provided with a cooling spacer and brought into close contact with the portion other than the transmitting portion. The second means is characterized in that in addition to the first means, a means for blowing cooling gas to the window portion is added. The third method: an electron beam processing apparatus comprising: arranging and exposing an irradiation portion of an electron beam emission tube inside a processing chamber; and irradiating a processed object placed in the processing chamber with an electron beam The electron beam processing device is characterized in that an inert gas blowing portion that blows an inert gas toward the irradiating portion and a discharge port of the inactive gas are provided near the irradiating portion. Fourth means: An electron beam processing apparatus is provided with: an irradiation part of an electron beam emission tube is arranged inside the processing chamber to be exposed, and a treatment object placed in the processing chamber is irradiated with an electron beam The electron beam processing device is characterized in that the above processing chamber is made up of the above-mentioned electric books & Zhang scales applicable to China National Standard (CNS) A4 specifications (210X297 mm 1 " " — " (Please first Read the precautions on the back and fill in this page) 486716 A7 B7 V. Invention description Q) (Please read the precautions on the back before filling out this page) The first treatment of the irradiation part of the sub-beam emission tube with inactive gas inlet A second processing chamber having a gas discharge port for the inert gas, and a first processing chamber including the electron beam and an opening for the inert gas; It is composed of 2 isolation plates between the processing chambers. The fifth method is characterized in that, after the inert gas passes near the irradiation part of the electron beam emission tube, downstream of the interior of the processing chamber where it reaches, a processing gas required for processing the processing object is provided to flow in Gas inlet. [Embodiment of the invention] First, the first embodiment of the electron beam processing apparatus of the present invention will be described with reference to Figs. 1 to 3. Fig. 1 shows a front sectional view of the configuration of the electron beam processing apparatus of the present invention, Fig. 2 shows an enlarged view near the irradiation portion of the electron beam emission tube, and Fig. 3 · shows a bottom view of the electron beam emission tube. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and the Industrial Cooperative Cooperative in these figures, the window portion 4 is formed by the electron beam transmitting portion 41 and the non-transmitting portion 42. In order to allow the electron beam to pass through, a plurality of electron beam transmitting portions 41 formed in a thin film are provided. Here, although the irradiated object is formed by the cover portion 3 and the window portion 4 as described above, the cooling spacer 7 is provided in contact with the irradiated portion so as to cover a portion other than the electron beam transmitting portion 41. . Inside the cooling spacer 7, there are cooling pipes 7 1 for cooling fluid such as water to flow, and cooling gas introduced from the outside of the cooling spacer 7 with inert gas and the like. The paper dimensions apply to Chinese national standards (CNS ) A4 specification (210X297mm) _ 7 _ 486716 A7 B7 V. Description of the invention (g) and cooling pipe 7 2 that blows out cooling gas near the window 4. A plurality of small holes 7 2 1 are provided in the cooling pipe 7 2, so that (please read the precautions on the back before filling in this page) the cooling gas is blown out to the window 4. The cooling gas flows in through the cooling gas inflow pipe 8 and is discharged through the cooling gas outflow pipe 9. In addition, those having the same figure as that shown in FIG. 10 have the same configuration. Therefore, its description is omitted. In the electron beam irradiation device of this embodiment, a good cooling effect can be obtained by the cooling pipe 7 1, the cover portion 3, and the window portion 4 provided in the cooling partition 7, that is, the irradiation portion. This also prevents the temperature of the cover portion 3 and the window portion 4 from rising. Further, in this embodiment, the cooling gas blown out from the plurality of small hole portions 7 2 1 near the window portion 4 is blown toward the surface of the window portion 4. Therefore, not only the window portion 4 can be cooled more efficiently, but also pollutants generated in the processing chamber 2 can be prevented from adhering to the window portion 4. Furthermore, although one cooling tube 7 2 is provided only at one end of the electron beam transmitting portion 41, another cooling tube may be additionally provided at the other end by sandwiching the transmitting portion 41. Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Next, other embodiments of the present invention will be described with reference to FIGS. 4 to 6. FIG. 4 shows a front sectional view of the configuration of the electron beam processing apparatus of the present invention, FIG. 5 shows an enlarged view of the vicinity of the irradiation portion of the electron beam emission tube 1 shown in FIG. 4, and FIG. 6 shows the electron beam processing apparatus The bottom view of the composition. This embodiment is different from the above embodiment in that it is related to the cooling gas. The paper size applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) 7T] 486716 A7 B7 5. The structure of the invention description (e). The cooling spacer 10 has a cooling pipe 10 2 and is characterized in that a cooling gas such as an inert gas is introduced from the outside, and the cooling gas is blown out from an opening portion exposed between the cooling spacer 10 and the cover 3. Here, the positions a and b shown in FIG. 5 correspond to the dotted line positions a ′ and b of the cooling spacer 10 shown in FIG. 6. In addition, the same reference numerals as those in the above description have the same configuration, and thus the description is omitted. In this embodiment, in the space portion formed by the cooling partition 10, the cover portion 3, and the window portion 4, the cooling gas is released from the opening portion of the cooling pipe 102, and the cover portion 3 and the window portion can be cooled. 4. Therefore, the cover portion 3 and the window portion 4 can be prevented from becoming hot. Moreover, in the above-mentioned embodiment, it is not necessary to provide a cooling pipe 10 1 in the cooling spacer 10, and it may be removed as appropriate. In such a case, the spacer 10 is no longer a cooling spacer, but only functions as a spacer. In addition, even in such a case, the cooling gas can effectively prevent the contamination from adhering to the window portion, and the cooling portion can also be used to cool the irradiation portion. Fig. 7 is a front sectional view of an electron beam processing apparatus according to another embodiment of the present invention. In Fig. 7, the processing chamber 2 is composed of a first processing chamber and a second processing chamber. In the first processing chamber 21, the irradiation part of the electron beam emission tube 1 is housed, and a gas inflow tube 11 for introducing an inert gas is also provided. In the second processing chamber 22, the processing object placed in the processing base is stored, and the gas containing the inert gas is discharged. The paper size is in accordance with Chinese National Standard (CNS) A4 (210X297). Mm) ΐ 衣-(Please read the notes on the back before filling out this page) Order printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by the Consumer Cooperative 486716 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, printed by the Consumer Cooperative of A7 ____ B7 7) Body discharge tube 9. A partition plate 12 is provided between the first processing chamber 21 and the second processing chamber 22 to separate the two. The separator 12 has an opening 1 2 1 through which an electron beam and an inert gas can pass. In this figure, the same reference numerals as those in the above figures have the same structure, so the description is omitted. In the electron beam irradiation apparatus of this embodiment, the inactive gas flowing from the gas inflow pipe 11 into the first processing chamber 21 is passed through the irradiation portion of the electron beam emission pipe 1, particularly near the window portion 4, and The pollutants and the like generated during the electron beam irradiation are discharged from the gas exhaust pipe 9 through the openings 1 2 1 together. This is because the processing chamber 2 is maintained under a certain pressure state after the decompression. Therefore, it is possible to prevent pollutants generated during the irradiation of the electron beam from adhering to the electricity of the window section 4-the sub-beam transmitting section 41 and the like. Furthermore, Fig. 8 shows a front sectional view of an electron beam processing apparatus according to another embodiment of the present invention. In the figure, with respect to the electron beam irradiation treatment of the treatment object 6, a treatment gas inflow pipe 13 for supplying a treatment gas containing chlorine (C1), fluorine (F), and the like is provided in the treatment chamber 2. In this figure, the same reference numerals as those in the above figures have the same structure, so the description is omitted. According to this embodiment, among the processing gas flowing from the processing gas inflow pipe 13 to the processing chamber 2, the remaining processing gas is discharged from the gas discharge pipe 9 together with the pollutants generated when the electron beam is irradiated. The reason is the same as the above (please read the precautions on the back before filling out this page). Pack L # • 1Ί IJ— This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -10- 486716 A 7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. The invention description (s) is the same because the processing chamber 2 is maintained under a certain pressure state after decompression. In addition, the flow of the inert gas can prevent the processing gas from flowing to the irradiation portion of the electron beam emission tube 1. Therefore, it is possible to effectively prevent the problem that the mechanical strength of the window portion 4 is weakened due to the corrosion caused by the contact of the processing gas with the window portion 4 and then damaged. '' Furthermore, the structure with a process gas inflow pipe shown in FIG. 8 is also applicable to a processing apparatus having a structure of a first processing chamber and a second processing chamber shown in FIG. 7. Of course, it can be achieved in this case. The effects described in the above two embodiments. Fig. 9 shows another embodiment of the electron beam processing apparatus of the present invention. Fig. 9 (a) is a front sectional view showing the configuration of the electron beam processing apparatus, and Fig. 9 (b) is a plan view showing the composition of the processing gas supply spacer shown in Fig. 9 (a). In the figure, the second processing chamber 22 has a processing gas supply spacer 15. From this process gas supply spacer 15, a process gas including chlorine (C1), fluorine (F), and the like, which are necessary for the treatment of the treatment object 6, is supplied. In addition, the processing gas supply spacer 15 has a processing gas discharge hole 1 5 1 provided at a position where the processing gas is emitted to the processing object 6. In this figure, the same reference numerals as those in the above figures have the same structure, so the description is omitted. In this embodiment, the inert gas is also discharged from the discharge pipe 9 through the opening 1 2 1 together with the pollutants generated during the irradiation of the electron beam, which can prevent the pollutants generated during the irradiation of the electron beam from adhering to Window section 4. Therefore, it is the same as the above embodiment, which can effectively prevent the treatment of gas — ^ --- 7 ^^ batch of clothes-(Please read the precautions on the back before filling this page) Order. JT—I 11 This paper size applies China National Standard (CNS) A4 specification (210X297 mm,) -11-486716 A7 B7 V. Description of the invention (9) The problem that the mechanical strength of the window portion 4 is weakened and then damaged. In the electron beam processing apparatus of this embodiment, although the structure in which the electron beam emission tube is arranged at the upper part of the processing chamber and the processed object is arranged at the lower part is adopted, it is not necessarily limited to such a configuration. That is, it is also possible to arrange the electron beam emission tube on one side of the processing chamber and the processed object on the other side. [Effects of the Invention] As described above, according to the electron beam irradiation device described in the first claim of the scope of the patent application, the cooling spacer is arranged in a state of contacting the irradiating part, so the cooling spacer can be used for cooling and irradiation. It is possible to prevent the temperature of the lid portion and the window portion of the irradiation portion from rising. As a result, it is possible to suppress the release of the metal material in the electron beam emission tube tube and the gas constituting the periphery of the glass body due to the high temperature of the irradiated portion, and prevent the occurrence of abnormal discharge in the electron beam emission tube tube. In addition, according to the electron beam irradiation device described in the second claim of the scope of the patent application, because the cooling gas is blown to the window portion 4, not only the window portion can be efficiently cooled, but also the pollutants and auxiliary substances generated in the processing chamber can be prevented. The product is attached to the window. In addition, it is possible to prevent the problem that the window portion is oxidized or carbonized due to the adhesion of pollutants and by-products, and the mechanical strength is weakened and damaged. In addition, according to the electron beam irradiation device described in claim 3 of the scope of the patent application, since the inert gas is blown from the gas blowing section to the irradiation section of the electron beam emission tube, the pollution caused by the electron beam irradiation can be prevented. The paper size applies the Chinese National Standard (CNS) Α4 specification (210X297 mm) _ 12 _ (Please read the precautions on the back before filling out this page) Item and then fill in {ί Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives 486716 A7 B7 V. Description of the invention (10) (Please read the precautions on the back before filling out this page) Dyeing substances are attached to the irradiation part, and can prevent oxidation or carbonization of the irradiation part due to the adhesion of pollutants, and thus prevent it A problem that the mechanical strength becomes weak and damaged occurs. In addition, according to the electron beam irradiation device described in claim 4 of the scope of the patent application, the pollutants generated during the irradiation of the electron beam can be effectively discharged with the flow of the inactive gas, and the pollutants can be prevented from adhering to the electron beam. On the irradiation part of the launch tube. In addition, according to the electron beam irradiation devices described in claims 5 and 6 of the scope of the patent application, because the processing gas is poured into the downstream of the processing chamber, 'these processing gases will be polluted by the electron beam irradiation, etc. It is discharged from the gas exhaust port together. Therefore, the problem that the mechanical strength is weakened due to the effects of the processing gas on the part of the irradiated portion and the like, and the damage is prevented can be prevented. [Brief description of the drawing] Fig. 1 is a front cross-sectional view showing the configuration of an electron beam processing apparatus according to a first embodiment of the present invention. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 2 is an enlarged view showing the vicinity of the irradiation section of the electron beam emission tube 1 shown in Figure 1. Fig. 3 is a bottom view showing the configuration of the electron beam processing apparatus according to the first embodiment of the present invention. Fig. 4 is a front sectional view showing the structure of an electron beam processing apparatus according to a second embodiment of the present invention. The fifth fault line shows the irradiating part of the electron beam emission tube 1 shown in Figure 4. 13- This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm.) 486716 A7 _______B7 V. Description of the invention (H ) Nearby enlarged view. Fig. 6 is a bottom view showing the configuration of an electron beam processing apparatus according to a second embodiment of the present invention. Fig. 7 is a front sectional view showing the structure of an electron beam processing apparatus according to a third embodiment of the present invention. Fig. 8 is a front sectional view showing the configuration of an electron beam processing apparatus according to a fourth embodiment of the present invention. Fig. 9 is a front sectional view showing the structure of an electron beam processing apparatus according to a fifth embodiment of the present invention. Fig. 10 is a front sectional view showing the structure of a prior art electron beam processing apparatus. [Illustration of drawing number] (Please read the notes on the back before filling this page) Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 1 Electron beam emission tube 2 Processing chamber 2 1 Upper processing chamber 2 2 Lower processing chamber 3 Cover 3 1 Open P Section 4 Window Section 4 Electron Beam Transmitting Section 4 2 Electron Beam Non-Transmitting Section 5 Processing Block 6 Processing Object -14- This paper size applies to China National Standard (CNS) A4 specification (210 mm, 297 mm,) 486716 A7 B7 V. Description of the invention (12) 7, 10 Inactive gas supply spacer 7 1, 1 0 1 Inert gas ejection pipe 7 1 1, 10 1 1 Ejection hole 8, 1 1 Gas inflow pipe 9 Gas exhaust Tube 12 Isolation plate 12 1 Isolation plate opening 1 3, 1 4 Process gas inflow pipe 15 Process gas supply spacer 1 5 1 Process gas discharge hole 16 Process object support (please read the precautions on the back before filling this page) Packing, ordering and printing of paper printed by employees' cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, applicable to China National Standard (CNS) A4 (210X297 mm,) -15-