JP2002182000A - 電子ビーム処理装置 - Google Patents

電子ビーム処理装置

Info

Publication number
JP2002182000A
JP2002182000A JP2000379679A JP2000379679A JP2002182000A JP 2002182000 A JP2002182000 A JP 2002182000A JP 2000379679 A JP2000379679 A JP 2000379679A JP 2000379679 A JP2000379679 A JP 2000379679A JP 2002182000 A JP2002182000 A JP 2002182000A
Authority
JP
Japan
Prior art keywords
electron beam
processing
tube
beam tube
tubes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000379679A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002182000A5 (enExample
Inventor
Masanori Yamaguchi
真典 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ushio Denki KK
Ushio Inc
Original Assignee
Ushio Denki KK
Ushio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Denki KK, Ushio Inc filed Critical Ushio Denki KK
Priority to JP2000379679A priority Critical patent/JP2002182000A/ja
Priority to TW090124716A priority patent/TW530318B/zh
Priority to KR1020010070988A priority patent/KR20020046928A/ko
Priority to EP01129437A priority patent/EP1215706A3/en
Priority to US10/013,536 priority patent/US6881969B2/en
Publication of JP2002182000A publication Critical patent/JP2002182000A/ja
Publication of JP2002182000A5 publication Critical patent/JP2002182000A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J33/00—Discharge tubes with provision for emergence of electrons or ions from the vessel; Lenard tubes
    • H01J33/02—Details
    • H01J33/04—Windows
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0866—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation
    • B29C2035/0877—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation using electron radiation, e.g. beta-rays

Landscapes

  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
  • Physical Vapour Deposition (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Recrystallisation Techniques (AREA)
JP2000379679A 2000-12-14 2000-12-14 電子ビーム処理装置 Pending JP2002182000A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000379679A JP2002182000A (ja) 2000-12-14 2000-12-14 電子ビーム処理装置
TW090124716A TW530318B (en) 2000-12-14 2001-10-05 Electron beam treatment apparatus
KR1020010070988A KR20020046928A (ko) 2000-12-14 2001-11-15 전자 빔 처리 장치
EP01129437A EP1215706A3 (en) 2000-12-14 2001-12-10 Electron beam treatment device
US10/013,536 US6881969B2 (en) 2000-12-14 2001-12-13 Electron beam treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000379679A JP2002182000A (ja) 2000-12-14 2000-12-14 電子ビーム処理装置

Publications (2)

Publication Number Publication Date
JP2002182000A true JP2002182000A (ja) 2002-06-26
JP2002182000A5 JP2002182000A5 (enExample) 2005-02-24

Family

ID=18847995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000379679A Pending JP2002182000A (ja) 2000-12-14 2000-12-14 電子ビーム処理装置

Country Status (5)

Country Link
US (1) US6881969B2 (enExample)
EP (1) EP1215706A3 (enExample)
JP (1) JP2002182000A (enExample)
KR (1) KR20020046928A (enExample)
TW (1) TW530318B (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7005660B2 (en) 2003-05-06 2006-02-28 Tokyo Electron Limited Surface processing apparatus
JP2006518689A (ja) * 2003-02-25 2006-08-17 グラクソスミスクライン バイオロジカルズ ソシエテ アノニム 容器に薬剤を充填するための装置及び方法
JP2007273619A (ja) * 2006-03-30 2007-10-18 Tokyo Electron Ltd 変化率予測方法、記憶媒体及び基板処理システム
JP2013225490A (ja) * 2012-03-21 2013-10-31 Jfe Engineering Corp アレイ型粒子線照射装置及びその制御方法
JP2016155088A (ja) * 2015-02-20 2016-09-01 国立大学法人東京農工大学 処理装置及び薄膜の製造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW486716B (en) * 2000-05-12 2002-05-11 Ushio Electric Inc Electron beam processing device
WO2003067636A1 (fr) * 2002-01-22 2003-08-14 Tokyo Electron Limited Dispositif et procede de traitement de surface
JP2004253749A (ja) 2002-12-27 2004-09-09 Tokyo Electron Ltd 薄膜処理方法及び薄膜処理システム
JP4372442B2 (ja) * 2003-03-28 2009-11-25 東京エレクトロン株式会社 電子ビーム処理方法及び電子ビーム処理装置
JP2005003564A (ja) * 2003-06-13 2005-01-06 Ushio Inc 電子ビーム管および電子ビーム取り出し用窓
KR100542741B1 (ko) 2003-06-26 2006-01-11 삼성전자주식회사 전자빔 검사 장치 및 이의 동작 상태 검사 방법
JP4786368B2 (ja) * 2006-02-23 2011-10-05 株式会社アドバンテスト マルチコラム用電子ビーム生成装置
JP5329050B2 (ja) * 2007-04-20 2013-10-30 株式会社Ｓｅｎ ビーム処理装置
US9383460B2 (en) 2012-05-14 2016-07-05 Bwxt Nuclear Operations Group, Inc. Beam imaging sensor
US9535100B2 (en) 2012-05-14 2017-01-03 Bwxt Nuclear Operations Group, Inc. Beam imaging sensor and method for using same
DE102014001344B4 (de) * 2014-02-02 2015-08-20 Crosslinking AB Elektronenstrahleinheit mit schräg zur Transportrichtung ausgerichteten Heizkathodendrähten sowie Verfahren zur Bestrahlung
DE102014001342A1 (de) * 2014-02-02 2015-08-06 Crosslinking AB Stützkonstruktion mit schräg verlaufenden Kühlkanälen für ein Elektronenaustrittsfenster
US9981312B2 (en) * 2015-05-11 2018-05-29 Wisconsin Alumni Research Foundation Three-dimension printer with mechanically scanned cathode-comb

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3925670A (en) * 1974-01-16 1975-12-09 Systems Science Software Electron beam irradiation of materials using rapidly pulsed cold cathodes
US5414267A (en) * 1993-05-26 1995-05-09 American International Technologies, Inc. Electron beam array for surface treatment
US5909032A (en) * 1995-01-05 1999-06-01 American International Technologies, Inc. Apparatus and method for a modular electron beam system for the treatment of surfaces
US5968605A (en) * 1997-02-27 1999-10-19 Acushnet Company Electron beam radiation curable inks for game balls, golf balls and the like
DE69816426T2 (de) * 1997-03-18 2004-05-06 Dsm N.V. Verfahren zum härten von optikfaserbeschichtungen und druckfarben mittels elektronenstrahlung niedriger energie
US6140657A (en) * 1999-03-17 2000-10-31 American International Technologies, Inc. Sterilization by low energy electron beam
TW464947B (en) 1999-11-29 2001-11-21 Ushio Electric Inc Measuring apparatus of electron beam quantity and processing apparatus of electron beam irradiation

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006518689A (ja) * 2003-02-25 2006-08-17 グラクソスミスクライン バイオロジカルズ ソシエテ アノニム 容器に薬剤を充填するための装置及び方法
US7005660B2 (en) 2003-05-06 2006-02-28 Tokyo Electron Limited Surface processing apparatus
JP2007273619A (ja) * 2006-03-30 2007-10-18 Tokyo Electron Ltd 変化率予測方法、記憶媒体及び基板処理システム
JP2013225490A (ja) * 2012-03-21 2013-10-31 Jfe Engineering Corp アレイ型粒子線照射装置及びその制御方法
JP2016155088A (ja) * 2015-02-20 2016-09-01 国立大学法人東京農工大学 処理装置及び薄膜の製造方法

Also Published As

Publication number Publication date
US6881969B2 (en) 2005-04-19
TW530318B (en) 2003-05-01
KR20020046928A (ko) 2002-06-21
EP1215706A3 (en) 2005-05-04
US20020074519A1 (en) 2002-06-20
EP1215706A2 (en) 2002-06-19

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