TW526697B - Heat sink - Google Patents

Heat sink Download PDF

Info

Publication number
TW526697B
TW526697B TW091104930A TW91104930A TW526697B TW 526697 B TW526697 B TW 526697B TW 091104930 A TW091104930 A TW 091104930A TW 91104930 A TW91104930 A TW 91104930A TW 526697 B TW526697 B TW 526697B
Authority
TW
Taiwan
Prior art keywords
heat sink
solderable
fin
patent application
heat
Prior art date
Application number
TW091104930A
Other languages
English (en)
Chinese (zh)
Inventor
Francis Edward Fisher
Russell Bowles
Original Assignee
Aavid Thermalloy Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB0106547.3A external-priority patent/GB0106547D0/en
Application filed by Aavid Thermalloy Llc filed Critical Aavid Thermalloy Llc
Application granted granted Critical
Publication of TW526697B publication Critical patent/TW526697B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW091104930A 2001-03-16 2002-03-15 Heat sink TW526697B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0106547.3A GB0106547D0 (en) 2001-03-16 2001-03-16 Heat sinks
US09/939,356 US20020131238A1 (en) 2001-03-16 2001-08-24 Heat sink

Publications (1)

Publication Number Publication Date
TW526697B true TW526697B (en) 2003-04-01

Family

ID=26245838

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091104930A TW526697B (en) 2001-03-16 2002-03-15 Heat sink

Country Status (5)

Country Link
EP (1) EP1374654A4 (ja)
JP (1) JP2004523921A (ja)
CN (1) CN1516996A (ja)
TW (1) TW526697B (ja)
WO (1) WO2002076166A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103846366A (zh) * 2012-11-30 2014-06-11 象水国际股份有限公司 均温板及其制造方法
CN104006689A (zh) * 2013-02-27 2014-08-27 象水国际股份有限公司 板式热管及其制造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10249331B4 (de) * 2002-10-22 2007-08-23 Schneider-Clauss Gmbh & Co. Kg Metallwarenfabrikation Kühlvorrichtung
US7537151B2 (en) 2004-01-21 2009-05-26 Delphi Technologies, Inc. Method of making high performance heat sinks
JP4860800B2 (ja) * 2008-10-06 2012-01-25 三菱電機株式会社 パワー回路配線構造の製造方法
DE102009039394A1 (de) * 2009-08-31 2011-03-03 Behr Gmbh & Co. Kg Kühlblech für eine galvanische Zelle und Verfahren zum Anbinden eines Kühlblechs
DE102013107563B4 (de) * 2012-08-21 2017-04-27 Borgwarner Ludwigsburg Gmbh Zündgerät für Ottomotoren
JP5823451B2 (ja) * 2013-07-16 2015-11-25 稔之 新井 機器
CN104602489A (zh) * 2015-01-14 2015-05-06 南京亚派科技股份有限公司 一种高散热效率的模块电源组合式散热器
US20200373224A1 (en) * 2019-05-21 2020-11-26 Microsoft Technology Licensing, Llc Through-silicon vias and decoupling capacitance
US11710726B2 (en) 2019-06-25 2023-07-25 Microsoft Technology Licensing, Llc Through-board power control arrangements for integrated circuit devices

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4544942A (en) * 1982-02-22 1985-10-01 Aavid Engineering, Inc. Heat sinks with staked solderable studs
US4625260A (en) * 1984-08-24 1986-11-25 Thermalloy Incorporated Fasteners for surface mounting of printed circuit board components
CA2096983C (en) * 1992-05-29 1996-08-13 Naoya Taki Radiator assembly for substrate
US5365399A (en) * 1992-08-03 1994-11-15 Motorola, Inc. Heat sinking apparatus for surface mountable power devices
US5323294A (en) * 1993-03-31 1994-06-21 Unisys Corporation Liquid metal heat conducting member and integrated circuit package incorporating same
IT1285396B1 (it) * 1996-06-04 1998-06-03 Magneti Marelli Spa Dispositivo dissipatore per circuiti integrati.
US6260610B1 (en) * 1998-03-06 2001-07-17 Thermal Form & Function Convoluted fin heat sinks with base topography for thermal enhancement
JPH11354700A (ja) * 1998-06-09 1999-12-24 Minebea Co Ltd ヒートシンク
TW444158B (en) * 1998-07-08 2001-07-01 Hon Hai Prec Ind Co Ltd Heat sink device and its manufacture method
TW376171U (en) * 1998-11-24 1999-12-01 Foxconn Prec Components Co Ltd Radiating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103846366A (zh) * 2012-11-30 2014-06-11 象水国际股份有限公司 均温板及其制造方法
CN104006689A (zh) * 2013-02-27 2014-08-27 象水国际股份有限公司 板式热管及其制造方法

Also Published As

Publication number Publication date
CN1516996A (zh) 2004-07-28
EP1374654A1 (en) 2004-01-02
WO2002076166A1 (en) 2002-09-26
JP2004523921A (ja) 2004-08-05
EP1374654A4 (en) 2004-10-20
WO2002076166A9 (en) 2003-01-30

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees