CN1516996A - 散热片 - Google Patents

散热片 Download PDF

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Publication number
CN1516996A
CN1516996A CNA028066901A CN02806690A CN1516996A CN 1516996 A CN1516996 A CN 1516996A CN A028066901 A CNA028066901 A CN A028066901A CN 02806690 A CN02806690 A CN 02806690A CN 1516996 A CN1516996 A CN 1516996A
Authority
CN
China
Prior art keywords
mentioned
fin
weldment
lamellar body
mount pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA028066901A
Other languages
English (en)
Chinese (zh)
Inventor
弗朗西斯・E・费希尔
弗朗西斯·E·费希尔
・鲍尔斯
拉塞尔·鲍尔斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermalloy LLC
Original Assignee
Aavid Thermalloy LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB0106547.3A external-priority patent/GB0106547D0/en
Application filed by Aavid Thermalloy LLC filed Critical Aavid Thermalloy LLC
Publication of CN1516996A publication Critical patent/CN1516996A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CNA028066901A 2001-03-16 2002-03-14 散热片 Pending CN1516996A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB0106547.3 2001-03-16
GBGB0106547.3A GB0106547D0 (en) 2001-03-16 2001-03-16 Heat sinks
US09/939,356 2001-08-24
US09/939,356 US20020131238A1 (en) 2001-03-16 2001-08-24 Heat sink

Publications (1)

Publication Number Publication Date
CN1516996A true CN1516996A (zh) 2004-07-28

Family

ID=26245838

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA028066901A Pending CN1516996A (zh) 2001-03-16 2002-03-14 散热片

Country Status (5)

Country Link
EP (1) EP1374654A4 (ja)
JP (1) JP2004523921A (ja)
CN (1) CN1516996A (ja)
TW (1) TW526697B (ja)
WO (1) WO2002076166A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103632822A (zh) * 2012-08-21 2014-03-12 博格华纳贝鲁系统有限公司 火花点火发动机的点火装置
CN104602489A (zh) * 2015-01-14 2015-05-06 南京亚派科技股份有限公司 一种高散热效率的模块电源组合式散热器

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10249331B4 (de) * 2002-10-22 2007-08-23 Schneider-Clauss Gmbh & Co. Kg Metallwarenfabrikation Kühlvorrichtung
US7537151B2 (en) 2004-01-21 2009-05-26 Delphi Technologies, Inc. Method of making high performance heat sinks
JP4860800B2 (ja) * 2008-10-06 2012-01-25 三菱電機株式会社 パワー回路配線構造の製造方法
DE102009039394A1 (de) * 2009-08-31 2011-03-03 Behr Gmbh & Co. Kg Kühlblech für eine galvanische Zelle und Verfahren zum Anbinden eines Kühlblechs
CN103846366A (zh) * 2012-11-30 2014-06-11 象水国际股份有限公司 均温板及其制造方法
CN104006689A (zh) * 2013-02-27 2014-08-27 象水国际股份有限公司 板式热管及其制造方法
JP5823451B2 (ja) * 2013-07-16 2015-11-25 稔之 新井 機器
US20200373224A1 (en) * 2019-05-21 2020-11-26 Microsoft Technology Licensing, Llc Through-silicon vias and decoupling capacitance
US11710726B2 (en) 2019-06-25 2023-07-25 Microsoft Technology Licensing, Llc Through-board power control arrangements for integrated circuit devices

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4544942A (en) * 1982-02-22 1985-10-01 Aavid Engineering, Inc. Heat sinks with staked solderable studs
US4625260A (en) * 1984-08-24 1986-11-25 Thermalloy Incorporated Fasteners for surface mounting of printed circuit board components
CA2096983C (en) * 1992-05-29 1996-08-13 Naoya Taki Radiator assembly for substrate
US5365399A (en) * 1992-08-03 1994-11-15 Motorola, Inc. Heat sinking apparatus for surface mountable power devices
US5323294A (en) * 1993-03-31 1994-06-21 Unisys Corporation Liquid metal heat conducting member and integrated circuit package incorporating same
IT1285396B1 (it) * 1996-06-04 1998-06-03 Magneti Marelli Spa Dispositivo dissipatore per circuiti integrati.
US6260610B1 (en) * 1998-03-06 2001-07-17 Thermal Form & Function Convoluted fin heat sinks with base topography for thermal enhancement
JPH11354700A (ja) * 1998-06-09 1999-12-24 Minebea Co Ltd ヒートシンク
TW444158B (en) * 1998-07-08 2001-07-01 Hon Hai Prec Ind Co Ltd Heat sink device and its manufacture method
TW376171U (en) * 1998-11-24 1999-12-01 Foxconn Prec Components Co Ltd Radiating device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103632822A (zh) * 2012-08-21 2014-03-12 博格华纳贝鲁系统有限公司 火花点火发动机的点火装置
US9518553B2 (en) 2012-08-21 2016-12-13 Borgwarner Ludwigsburg Gmbh Ignition device for spark ignition engines
CN103632822B (zh) * 2012-08-21 2017-06-06 博格华纳贝鲁系统有限公司 火花点火发动机的点火装置
CN104602489A (zh) * 2015-01-14 2015-05-06 南京亚派科技股份有限公司 一种高散热效率的模块电源组合式散热器

Also Published As

Publication number Publication date
EP1374654A1 (en) 2004-01-02
WO2002076166A1 (en) 2002-09-26
JP2004523921A (ja) 2004-08-05
EP1374654A4 (en) 2004-10-20
TW526697B (en) 2003-04-01
WO2002076166A9 (en) 2003-01-30

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication