TW526697B - Heat sink - Google Patents

Abstract

A composite heat sink device includes a heat sink body formed of aluminum, the body having a pair of coplanar surfaces, and a thermally conductive solderable element, for example of copper, mechanically fixed to each of the coplanar surfaces. Each of the solderable elements has a first surface which is contiguous with one of the coplanar surfaces, and a second surface which is soldered to a printed circuit board.

Description

1. Field of the Invention _ The present invention relates to a funeral ^. P ^ 9 φ uses a heat sink to cool electronic devices, where the moonlight hot film is surface mounted i, ^ is located near the device where the device is to be cooled. In detail, the present invention relates to 4 tablets with Lou Jie. The heat dissipation of the plate-shaped fins or plastic body of the life-boiled plate type 2. -In the computer, Zhongzhuo approved, 丨 σσ Tun L 夬 control, memory device, control device, power amplifier cry, etc. < ° . In the electronic equipment of Letong board, it is necessary to have a heat sink. 'Because it is usually used in the field, the electronic device generates heat under normal use. Moreover, i /, and the suspension system have An optimal operating temperature range, the operating performance of the device outside -degree dry range may be damaged due to heat loss = degree load. Because i basically, here-the device needs k for the heat transfer AL AL L-... Or it is superimposed on the device in a very close manner, to conduct the volume of the device to the ambient air β I and staggered flow and M to dissipate heat even in a single state—devices, such as—transistors, etc.) 'under normal operating conditions may still govern heat emission, and-generally believed that with the The increase in the complexity of electronic products, and the requirements for small size and volume), the heat density generated in the products is extremely high. This problem becomes more severe as the processing power generated increases. In a typical use, 'such as a motherboard assembly for a personal computer, there are a large number of electronic devices adjacent to a printed circuit board with copper connection parts and solder spring areas 050'. More complex board systems Must handle more I-4-526697 A7 B7

V. Description of the invention (2 To transfer heat from the device

Thermal load 'and usually the board itself is removed including the thermal conductor and the connection circuit. This type of board is usually a layered body, and it has a membership; (: single-pull and pull out the board. The heat sink can also have a solder terminal to be inserted into a perforation (groove in a substrate (pcB)) Installation), and held in the perforation by welding through the "through-board connection," this heat sink is usually in direct contact with the device to be protected, and will be held by the device and the board body on which it is installed The conducted heat is dissipated. In another design, the heat sink is installed above the electronic device and partially surrounds the electronic device, so that the heat sink can conduct heat through the part connected to the board, and Heat convection and radiation into the surrounding air to dissipate. In some programs, 'the heat sink is fixed to the device with a thermally conductive metal block using solder paste. About the conventional heat sink and its configuration or For detailed information about PCBs and other components, refer to earlier patent documents. Therefore, you can refer to US Patent Nos. 6,085,833; 5,779,134; 5,771,966; 5,396 No. 403; No. 5,339,5 19; No. 5,311,928; No. 5,172,301; No. 4,403,102 and No. 5,93 0,1 14. See also International Patent No. WO 99/18762; W〇-5- This paper size applies to China National Standard (CNS) A4 specification (210X297 public attack) 526697 A7 B7 V. Description of invention (3

97/43783; WO 96/36994; WO 96/36995; and EP 026 931. The heat sink is generally called a "heat sink" and is a passive device made of a metal such as aluminum, copper, or a metal alloy with good thermal conductivity such as copper and tungsten. The heat sink and the electronic device to be protected are soldered together by using a solder or solder paste containing a lead-tin alloy. Although Ming is a good material that can be used as a heat sink, for example, it is lighter and cheaper than copper or copper alloys. However, due to its oxide layer, it is less easy to solder. Therefore, the quality heat sink is usually provided with a solderable non-plugging terminal so that it can be seated in the groove of the board. Therefore, a more compact electronic package is obtained. For the surface mounting of the device, it is not equal to 7 / main weight. Wu Guo Patent No. 5,779,134 discloses a method for applying watch technology to a heat sink. Currently, copper is used for surface-mounting loose pieces of Western Gold, which is an alloy that is compatible with a solderable compound or solder paste. ❹Combined with ―wrong / tin solder composition‖, these surface-mount heat sinks are popular in the market, and the size is blackened ... alloys are composed of alloys; due to their cost and poor heat dissipation performance, ' , I, a replaceable heat sink. ', Xi Jing can seek disclosure of US Patent No. 5,93〇, 114 — a mounting and connection part of solderable material such as copper: IS, which includes and the heat sink has a paper size of _standard (CNS) .6 -k extension, and can be fixed to the installation and connection part by agricultural φ # 丁丹, the locking mechanism in the "quote" only provides limited thermal contact between the two parts. It is an object of the present invention to provide a Yu% i = + thermal management film, which can be surface-mounted to a substrate by using ordinary J 'dry. This purpose can be achieved by forming a bulk body of H ^ hot sheet, wherein the main system of the ant cooked sheet is composed of a thermally conductive metal sheet, and a "Si sheet", especially an aluminum or aluminum alloy and Provides heat sinks and surface-mounted faces on government films, and provides:-Faces to provide at least-thermally conductive solderable elements. The order of steps for contouring, and by-machine / 成 i 田 可 惶 拉 _ Meiji fixed It is used to connect each conductive T-connector 7M cow to an individual face ... way and ancient &, depending on the choice of mechanical fixation.… 'The main body of the film can also be appropriate by extrusion. The mechanical fixing method includes an interference fitting part # 二 Λ. Gong Jing is to partially cut or half-cut a surface of the surface P to provide a side inserting a handle or a notch or storage or storage. AMJ Modi VII, a corresponding person or key transport. The face is facing the element so that the corresponding part. And formed between the plunger and the notch-dry,-is a phase to remove treasure | ^ 1, and 3 interference fit In a short time it is possible to make the surface of the wheat. 'The combination of the material required for sheet formation / material t and the face can be achieved by tapping ^ The corresponding surface that can be fixed by the right person is willow joint, especially the "self-willing" technique, which One main worker, one of the two surfaces, and one surface of the nail on a predetermined position on the surface of the nail. The surface of the wound can be removed by punching 5 or 5. Description of the invention (pressing tools or t-like tools to remove them respectively) To open the mouth, the opening M points are extended to the section or the opening towel. On the corresponding surface of 1-the corresponding recess. Therefore, according to the it assembly, and the 雊 成 # 用 、; * Risk of thermal overload caused by aluminum :: Two or two, mechanically connected to the loose I sheet Γ The thermally conductive solderable element is machine-soldered and surface-mounted on her B // can be achieved by a heat sink The surface mount is like a PCB, instead of the substrate on the substrate, which is conductive to the heat sink and the thermal system can be lined with thermally conductive steel. The mount is usually a metal foil on the substrate. Or a plate heat sink, a heat sink made of thermal conductivity The extrusion point of ^ χ is used to open or close the point $ ^ or by the conventional method, monitoring i; forming heat dissipation fins, and L, i shoulders ^ ^ ^ ° Provide a kind of clothes that can support the main body # 烕 叮 on the surface An F. The legs are equipped with the face of the K clothing © women's clothing and thermally connected to it, so that the ^ ^ system is installed And the mechanical, surface, Qiu, ... are adjacent to each other, and fully cross the sparse surface, in an appropriate manner by a welding ^ installation. The surface of the metal sheet is bent, used for cutting and / or stamping. The part of the face of the main body of the sheet is preferably subjected to a hole treatment to make the metal sheet. The main system of the heat sink is selectively formed in a curved or similar action. In detail, the sheet can be formed as a heat-dissipating system by stamping or partial reduction or half X 297 mm.

A protrusion Λ — a large one is formed on the plane, and this can be done. Properly define the part that can be soldered ^ »Weldable components. The shape of the body that can accommodate the lunar hypothermia can be phased out. The beans use a plurality of generally parallel fields /-α foldable portions in the direction to provide a bend in each direction. The latter one is a leather-like baffle, which can be used as a surface-mounting surface adjacent to the #% ^ heat-dissipating fins; The surface extends obliquely. In use,. The surface of the surface of the surface is conducted to the heat-dissipating body via the solderable pile & Du & In general, the heat sink body is generally surrounded by a central surface 矣 ... 々 The predetermined surface area is fixed with electronic equipment to be loaded. Xi Zhuangyi, Xianyou overheated the negative so that the amount of power generated by the device can be ...: the surface of the device is rich ..., the inside is ..., the work is cool by the main body of the heat sink, and the shape is provided by Leg or wall type saluting device: In use, it is installed by the “埶, 都 都 你 ——,…… the surface stands upright” and the leg or soil opening [M system is wounded. ^ ^ ^ ^ ^ ^ A bridged heat sink main part is connected to the remote board ^ and the straw is connected as-Cen Jizhi & Jin, and the bridged part can also be a political surface, such as , A flat piece 7 ° pieces. It should be understood that: the thermal conductivity of the heat sink body through i 'and the heat radiation from the surface of the heat sink in the air can be excluded. For example, this, the heat sink is an embodiment of the heat sink, the main system is made of-metal (profile or by extrusion), at Η, 0, τ, roughly thousands of 仃Supporting elements extending from the surface of the surface to the cooling fins can provide a surface far away from the main surface area of the fins.

Line -9- 526697

526697

2. Description of the invention (The end portion or the upright portion can be placed on one surface of the supporting element and fastened to it by using a rivet or similar surface penetrating fastener. According to another aspect of the present invention The problem of using solder paste to connect the heat sink body to a substrate such as pCB by surface mounting technology can be solved by preparing a substrate that can house the heat sink body, which is achieved by At least in a predetermined position, a solderable element is welded on the surface of the substrate. The heat conducting part of the heat sink is installed, and the solderable element is used to store a heat sink body and to hold it by mechanical fixing. In place. Individual weldable elements can be located on one surface of the support element, and the stalks are fastened together using rivets or similar surface-penetrating fasteners. According to the invention The "other-like" surface-mounting design used to connect the heat sink to the appropriate surface of the PCB includes a -clamping member, a clamping device made of elastic heat-conducting material So that the opposing surface and the common base portion have a solder-compatible surface. The opposing surface portion can be elastically shifted toward the other surface, but has sufficient flexibility to make -The part of the main body of the heat sink can be inserted between two opposite surfaces', and the offset surface is used to provide a curved portion, and the corresponding recessed portion in the part of the main body of the thermal pad is matched. On this surface In the t-shirt, 'the clamp is provided-a weldable element. On the surface of the position where the clamp is correctly positioned' to use the welded base position to fix the lost component into Approximately upright posture, so that-part of the body of the heat sink will be forced into the center material-

526697

After that, it will be fixed on the position by the interference of the “test” curved part and the concave part in the relevant part of the heat sink. The elasticity of the clamping member is sufficient to maintain the interference fit. The key is that unless the main body of the heat sink is improperly and forcedly displayed due to the pull force, the system can help to assemble the heat sink on a proper PCB ', and it can also be used when necessary. Removed. The main system of the heat sink to be connected to the solderable element has a supporting member that depends on it. The supporting member has at least-edges, or-the surface is in continuous contact with the solderable element, so as to have a complete assembly. A heat conduction path. Other objects and features of the present invention can be obtained from the following detailed description and the accompanying drawings for further understanding. It should be understood, however, that the design shown in the drawings is for illustration purposes only and is not intended to have a limiting meaning to the present invention. The scope of the present invention is defined by the accompanying patent application. It is understood step by step that the schema is not made in the proportion of f. 'Unless there is a special statement, it is only used to conceptually describe the structure and procedures described in this book and the book. Also 1-4 ^ Brief description-Figure 1 (a) is a three-dimensional view showing a heat sink for surface mounting

Figure 1 (b) is a partial wearing view of the heat sink shown in Figure 1, which shows the structural parts P used to achieve mechanical integration in the assembly. Figure 2 (a) -2 (c) Figure 3 outlines the three steps of a typical "remelting" procedure, where the procedure is used to attach components to a prepared surface; Figure 3 shows a surface suitable for a heat sink (not fully shown) Installation -12- ^ This paper size Tongcai @ 国 * 标准 (CNS) A4 specifications (21. Qiao 7 public love) binding line 526697 A7 B7 V. Description of the invention (set; Figure 4 is shown for _

^. Month ..., one of the main body (not fully shown): Du MS A surface mounting configuration; Figure 5 of the element shows another surface mounting configuration for the main component of the heat sink; heart)- Edge mounting Figure 6 is shown by _ the other table of the spring clip-the main body of the heat sink, ... by two :: set; and on the solder paste pad. /, The fault is located on the surface of the welding by the details of the embodiment of the welding Figure 1 shows the state according to the present invention. A yangyang + force n 'called Wenyi Qiaozheng hot film assembly %% and black-plated aluminum sheet series of old hot film 1 series have a certificate of freedom · ~ Zhengzheng hot film 1, this scattered one', by The extended radiating fins 2 are arranged on any surface of a flat part 3, wherein the flat part 3 is used to protect the electrons from being overloaded by heat during use (not shown) on. The heat sink ... P is provided with a surface mounting surface 4 ', which is intended to be soldered to the -substrate by lifting the soldering element 5 in accordance with the industry's conventional soldering ... f White husband's 4-connect technology (for example, soldering and remelting square wire 〆) . These solderable elements 5 are adjacent to the surface of the mounting surface 4 and extend on the mounting surface 4 'and are fixed in position by a mechanical fixing two (Fig. Ub)). This ―mechanical fixing system can be provided by partially cutting the mounting portion or a half-t hole 'to form a protrusion--a plunger 6 (pictured, the plunger 6 series can be inserted to-- It is formed in the corresponding notch 7 in the solderable element 5 'and the interference fit is strengthened by standing the solderable element 5 on the mounting surface 4. It can be understood that the anvil operation is best Before the aluminum sheet is formed with the appropriate fin profile as shown in Figure -13-

526697 V. Description of the invention (11 rows. The heat sink is formed by anodized black aluminum plate, and the bend line and the point of partial cut or half-bite hole in the part to be bent are reserved in it. On the board The necessary partial reduction step performed on the chip is performed by a conventional method to provide the required plunger 6 at the position of the mounting position for the rod-connectable element 5. In his embodiment (not shown) The inscription can be extruded to provide or enhance the required surface characteristics by other means of dyeing, coloring, or tinting. Similarly, any color can achieve a predetermined effect, so in some In application, it can also be white. And the & adapter 5 series has a generally flat rectangular shape, the subscription plunger ... is distributed at the desired position, the installation part is "positioned" and added When Shi Zhan hits to fix it in the embodiment shown, the heat sink is facing the surface mounting surface, so that ::: 广: any surface that protects the device from heat overload ^ inclined surface 3 series positioning on the device (not shown ) Above. As is known in the industry, the individual areas of the plate-^ Jitian. Thermal surface (for example, the contact of the base ^) is arranged between the face 4 and the elements, with == the heat conduction 'and By combining the convective effect with the surrounding air, the combined effect of the heat radiation by the main thermal management director Zhao is achieved to achieve heat dissipation. Therefore, during normal use, the heat sink is surface-mounted on a substrate, X 297 mm) -14

Claims (1)

526697 A8 B8 The composite heat sink is provided with a device comprising: a main body of a political heat sheet, which is basically composed of aluminum, and includes a mounting surface having a substantially flat surface; and Λ " Thermally conductive solderable components, which are mechanically fixed to ^, each component has-a first flat surface, the flat torsion watch: installed at least one copy of the heat sink body; 1 +-surface system J flute- ⑥ The surfaces of Qiantan are adjacent to each other and have a phase oblique surface, which is used for soldering to the circuit board. According to the scope of application patent No. ljf, the composite heat sink device = the system has two Mounting the face and its roughly flat table :: 3 'Β 百 士' Female-Mounting face to Bugu * and has-a curved portion, which stands upright through the intermediary.-The face between the pieces is up j According to the application The complex curved part of the third item of the patent has a flat part, saying that the clothes are placed in parallel, and the standing part is above the surface. Electronic device on the board] 4. I = = Compound heat sink device around item 1 … The main limb is made of aluminum. 6. The main system of the composite heat sink according to item 5 of the scope of patent application is anodized aluminum sheet. 7. The compound heat sink according to item 6 of the patent application Tablet device where the scattered inside the scattered inside the yang-19- Hold ^ 26697 Scope of patent application The extremely electroplated aluminum sheet is a black-coated film device, in which the powder is the first one according to the scope of patent application! The composite of the item 9. The hot film main system is formed by pressure. …. According to the first patent application scope, the composite heat sink strong piece is provided with at least one protrusion and clothing on the face, wherein the element is to the face, and two components are provided in each element. Fix each 2? From #, Tu Xi a notch, and insert the large extension 邛 into the individual at least one recess π by interference fit. 〇10. According to the compound of the scope of the patent application No. 9 A heat sink device, wherein the element is hit on the face by an anvil. -20- This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) 526697 Patent Application No. 091104930 Chinese Specification Replacement Page (January 1992) V. Description of Invention (12) A7 B7 U > / q Such as a PCB, the substrate is formed by a general masking technology so that a surface area at a predetermined position for accommodating a child device can be exposed. Near this position, the solder paste is applied to a thermally conductive surface such as a copper pad, and the main body of the heat sink is appropriately positioned and placed on the solder paste so that the solderable soldering thereon can be performed. The components are exposed. As shown schematically in Fig. 2, it is a conventional solder remelting technique that is used to mount the surface of the heat sink to a position on the substrate. In this process, the solder is screen printed on a predetermined copper pad of a printed circuit board (PCB). The heat sink of the present invention is appropriately positioned ', and then heat is supplied to the component so that the solder melts (remelts) and is connected to the solderable element $. After cooling, the heat sink can be fixed in position. This can be done in a heating furnace, for example, an infrared heating furnace. Other technologies, such as corrugated welding, are also commonly used in the industry, but in terms of beauty, it is best to use remelting technology. Further: In the present invention, “a modification type, other heat sink devices 硏 can be connected by solderable elements 5 designed in different shapes. FIG. 3 shows another design suitable for other heat sinks, in which a fin-shaped heat sink mounting wall 31 and a cold material fin 32 are shown, and a weldable element 35 with a contour is formed by a surface-penetrating fastener ( It is called here, and "33" is connected to the wall body. The attachable element is made of a light heat-conducting material with a coating or tin alloy coating applied to the wall for welding. To the base, the surface is 34 JL. The thermal sheet is made of anodized, colored aluminum. The riveting technology provides a very reliable mechanical fixing, which has good strength. The wall of the sheet can provide the paper size applicable t_g_ (CNS) Weige__ ------- 526697 No. 091104930 Patent Application Chinese Specification Replacement Page (January 1992) 5. Description of the Invention (13) Good thermal contact, and the above can be achieved by properly positioning the solderable component on the solder paste pad of the PCB, Then the surface mount performance achieved by remelting welding technology. FIG. 4 shows a similar design with different types of heat sink bodies. The heat sink main system has only a single fin 41 and a bottom edge 44 of the lower surface area. The contact between the overlapping upright edges can still maintain thermal conductivity, wherein this contact is maintained by the surface through-hole fastener of the so-called rivet 48 here. FIG. 5 shows a fin wall body 51 of a similar heat sink, which has a weldable element 55 mounted at the edge (54), which is fastened by a surface-through fastener of the so-called rivet 58 here Close to the wall. This method is particularly suitable for applications where space is at a premium. FIG. 6 shows a surface mounting design of a fin 61 of a heat sink, wherein the fin provides an opening 67 and has a retaining clip 64 having a weldable base 65, which can be welded by welding. The surface is mounted on a substrate S. The heat sink is then pressed into an installation position and secured in that position by providing a pawl 68 that extends into the opening 67 to provide a simple but effective mechanical fixation. In another variation of the present invention, the PCB substrate is completely prepared for the operating relationship between the surface mounting of the heat sink and the heat generating device that is to be protected from thermal overload, and is formed by having an L-shape or a V-shape. The solderable element with the upright edge of the U-shaped or U-shaped contour element is positioned on the conductive mounting portion of the surface S of the substrate S with solder paste, and then fixed by a remelting soldering technique. This allows the heat sink to be properly positioned in the future, and is mechanically -16- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) Device% 526697 Patent Application No. 091104930 Patent Application Replacement Sheet (January 1992) A7 B7 5. Description of the invention (15) The assembly method can be easily recycled, so it has advantages in surface-mount applications compared to tin-clad copper plate heat sinks. Therefore, although the basic novel features of the present invention have been illustrated and described for the preferred embodiment, it can be understood that those skilled in the art can still use the embodiment without departing from the spirit of the present invention. Various deletions and replacements, as well as changes in shape and detailed structure of the device shown in the figure, and changes in the way they operate. For example, all combinations and / or step methods of these elements that can achieve the same effect in the same way and thus have the same results are encompassed within the scope of the present invention. Furthermore, it should be understood that the structures and / or elements and / or method steps shown in the drawings, and / or any type or embodiment disclosed in the present invention, or a suggested type or embodiment, are Choose for general design. Therefore, the scope of the present invention is only defined by the scope of the attached patent application. Description of component reference symbols 1 heat sink 35 solderable component 64 holding 2 cooler. Fin S base plate 65 solderable base 3 flat portion 41 single fin 67 opening 4 surface mounting surface 44 bottom edge 68 pawl 5 solderable component 45 Weldable element 70 Device 6 Plunger 48 Rivet 71 Heat sink body 7 Notch 51 Fin wall 74 Surface 31 Mounting wall 54 Edge 79 Gasket 32 Cooling fin 55 Weldable element 33 Rivet 58 Rivet 34 Surface of substrate 61 Fin-18-This paper size applies to China National Standard (CNS) A4 (210X.297 mm)