JP2002286380A - Heat pipe type cooling device - Google Patents
Heat pipe type cooling deviceInfo
- Publication number
- JP2002286380A JP2002286380A JP2001092145A JP2001092145A JP2002286380A JP 2002286380 A JP2002286380 A JP 2002286380A JP 2001092145 A JP2001092145 A JP 2001092145A JP 2001092145 A JP2001092145 A JP 2001092145A JP 2002286380 A JP2002286380 A JP 2002286380A
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- heat
- cooling device
- fitting groove
- peripheral surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えばノート型パ
ーソナルコンピュータ、モバイル型電子機器等の携帯型
電子機器における中央処理装置（ＣＰＵ）の冷却システ
ム等に好適に採用されるヒートパイプ式冷却装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat pipe type cooling device suitably used for a cooling system of a central processing unit (CPU) in portable electronic devices such as notebook personal computers and mobile electronic devices. .
【０００２】[0002]
【従来の技術】ノート型パソコン等のＣＰＵ冷却システ
ムとしては、十分な冷却性能に加えて、小型軽量化が強
く要求されるが、この要求に満足するものとして、ヒー
トパイプを用いた冷却装置が注目されている。2. Description of the Related Art A CPU cooling system for a notebook computer or the like is required to be compact and lightweight in addition to sufficient cooling performance. Attention has been paid.
【０００３】ヒートパイプ式冷却装置は、ヒートパイプ
の吸熱側端部（蒸発側端部）が、ＣＰＵ等の熱源側に固
定されるとともに、放熱側端部（凝縮側端部）がヒート
シンク等の放熱手段に固定され、ＣＰＵから発生する熱
をヒートパイプによってヒートシンクに伝達して放熱す
るものである。In the heat pipe type cooling device, the heat absorbing side end (evaporating side end) of the heat pipe is fixed to a heat source side such as a CPU, and the heat radiating side end (condensing side end) is connected to a heat sink or the like. The heat generated by the CPU is fixed to the heat radiating means and transmitted to the heat sink by the heat pipe to radiate the heat.
【０００４】従来、上記冷却装置のヒートパイプとして
は、断面円形のものが一般に採用されており、例えばヒ
ートシンクに設けられた断面矩形状の取付溝内に、ヒー
トパイプの放熱側端部を収容した状態で、取付溝内に充
填された接着剤によりヒートパイプを取付溝内に固定し
たり、あるいは取付溝内にヒートパイプの放熱側端部を
収容した状態で、取付溝周縁部に形成された係止爪を加
締めてヒートパイプに圧接することにより、ヒートパイ
プを取付溝内に固定するようにしていた。またヒートパ
イプの吸熱側端部は、ＣＰＵとの間の接触性（伝熱性）
を考慮して、ヒートスプレッダを介してＣＰＵに固定す
るようにしていた。Conventionally, a heat pipe of the above-described cooling device is generally of a circular cross section. For example, a heat radiation side end of the heat pipe is housed in a mounting groove of a rectangular cross section provided in a heat sink. In this state, the heat pipe was fixed in the mounting groove with the adhesive filled in the mounting groove, or formed on the peripheral edge of the mounting groove in a state where the heat radiation side end of the heat pipe was housed in the mounting groove. The heat pipe is fixed in the mounting groove by caulking the locking claw and pressing the heat pipe against the heat pipe. The heat-absorbing end of the heat pipe is in contact with the CPU (heat conductivity).
In consideration of the above, the CPU is fixed to the CPU via a heat spreader.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記従
来の冷却装置においては、断面円形のヒートパイプを加
締め処理や接着剤処理によって、ヒートシンクの取付溝
内に固定するものであるため、ヒートパイプ外周面と取
付溝内周面との間の接合面積や、その間の伝熱性を十分
に確保することが困難となり、十分な冷却性能を得るこ
とが困難であるという問題があった。However, in the above-mentioned conventional cooling device, the heat pipe having a circular cross section is fixed in the mounting groove of the heat sink by caulking or adhesive treatment. There is a problem that it is difficult to sufficiently secure a bonding area between the surface and the inner peripheral surface of the mounting groove and a sufficient heat transfer property therebetween, and it is difficult to obtain a sufficient cooling performance.
【０００６】また、ヒートパイプの吸熱側端部は、ヒー
トスプレッダを介してＣＰＵに固定するものであるた
め、ヒートスプレッダを組み付ける分、部品点数が多く
なり、組立作業が困難になるばかりか、コストの増大を
来すという問題があった。Further, since the heat-absorbing end of the heat pipe is fixed to the CPU via the heat spreader, the number of parts increases due to the heat spreader being assembled, which not only makes assembly work difficult but also increases costs. Had the problem of coming.
【０００７】この発明は、上記従来技術の問題を解消
し、部品点数を削減できて、組立作業を簡単に行えると
ともに、コストの削減を図ることができ、更に冷却性能
の向上を図ることができるヒートパイプ式冷却装置を提
供することを目的とする。The present invention solves the above-mentioned problems of the prior art, can reduce the number of parts, can simplify the assembling work, can reduce the cost, and can further improve the cooling performance. It is an object to provide a heat pipe type cooling device.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するた
め、この発明のヒートパイプ式冷却装置は、高さが幅に
比べて小さい扁平な形状を有し、かつ両側面が断面形状
において側方に膨出する円弧状に形成されたヒートパイ
プと、前記ヒートパイプの断面形状に対応する断面形状
のヒートパイプ嵌合溝が形成された放熱手段とを具備
し、前記ヒートパイプの放熱側端部が、前記ヒートパイ
プ嵌合溝内に嵌合された状態で固定されてなるものを要
旨としている。Means for Solving the Problems To achieve the above object, a heat pipe type cooling device of the present invention has a flat shape whose height is smaller than its width, and both side surfaces are laterally shaped in cross section. A heat pipe formed in an arc shape that bulges out into the heat pipe, and heat radiating means having a heat pipe fitting groove having a cross-sectional shape corresponding to the cross-sectional shape of the heat pipe, and a heat radiating side end of the heat pipe. However, the gist of the present invention is that which is fixed in a state fitted in the heat pipe fitting groove.
【０００９】本発明のヒートパイプ式冷却装置において
は、両側面が円弧状の扁平なヒートパイプを、ヒートシ
ンク等の放熱手段の嵌合溝に適合状態に嵌合して固定す
るものであるため、ヒートパイプの外周面と、放熱手段
の溝内周面との間の接触面積を十分に大きく確保するこ
とができるとともに、伝熱性を向上させることができ
る。In the heat pipe type cooling device of the present invention, a flat heat pipe having arcuate sides on both sides is fitted and fixed in a fitting groove of a heat radiating means such as a heat sink. A sufficiently large contact area between the outer peripheral surface of the heat pipe and the inner peripheral surface of the groove of the heat radiating means can be ensured, and the heat conductivity can be improved.
【００１０】更に本発明においては、ヒートパイプが扁
平形状に形成されているため、ヒートパイプの吸熱側端
部にＣＰＵ等の熱源を直接固定できる上、十分な伝熱性
を確保することができる。このため本発明の冷却装置に
おいては、例えばＣＰＵとの伝熱性を確保するためにヒ
ートスプレッダ等をヒートパイプに組み付ける必要がな
く、その分、部品点数を削減することができる。Further, in the present invention, since the heat pipe is formed in a flat shape, a heat source such as a CPU can be directly fixed to the end of the heat pipe on the heat absorption side, and sufficient heat conductivity can be ensured. Therefore, in the cooling device of the present invention, for example, it is not necessary to attach a heat spreader or the like to the heat pipe in order to secure heat conductivity with the CPU, and the number of components can be reduced accordingly.
【００１１】一方、本発明においては、前記ヒートパイ
プの放熱側端部外周面が、前記ヒートパイプ嵌合溝内周
面に低融点ハンダからなるろう材を介して接合固定され
てなる構成を採用するのが好ましい。On the other hand, the present invention adopts a configuration in which the outer peripheral surface of the heat radiation side end of the heat pipe is joined and fixed to the inner peripheral surface of the heat pipe fitting groove via a brazing material made of low melting point solder. Is preferred.
【００１２】すなわちこの構成を採用する場合、溶融状
態でのろう材が、毛管現象により、ヒートパイプの外周
面と嵌合溝の内周面との間における隙間全域に均等に浸
透していき、嵌合溝内周面における所要領域の全域をヒ
ートパイプの外周面にむら無く接合することができ、よ
り一層伝熱性を向上させることができる。In other words, when this configuration is adopted, the brazing material in the molten state uniformly penetrates into the entire gap between the outer peripheral surface of the heat pipe and the inner peripheral surface of the fitting groove by capillary action, The entire required area on the inner peripheral surface of the fitting groove can be uniformly joined to the outer peripheral surface of the heat pipe, and the heat conductivity can be further improved.
【００１３】また本発明においては、前記放熱手段が、
銅製のヒートシンクをもって構成されてなるものを採用
するのが望ましい。[0013] In the present invention, the radiating means may include:
It is desirable to employ one having a heat sink made of copper.
【００１４】すなわち、銅は、例えばアルミニウム等よ
りも熱伝導率が高いため、一段と伝熱性を向上させるこ
とができる。That is, since copper has a higher thermal conductivity than, for example, aluminum, it is possible to further improve the heat conductivity.
【００１５】[0015]
【発明の実施の形態】図１ないし図３はこの発明のヒー
トパイプ式冷却装置の放熱部を示す図である。これらの
図に示すように、この冷却装置は、ヒートパイプ（１
０）と、ヒートシンク（２０）とを備えている。1 to 3 are views showing a heat radiating portion of a heat pipe type cooling device according to the present invention. As shown in these figures, the cooling device is provided with a heat pipe (1).
0) and a heat sink (20).
【００１６】ヒートパイプ（１０）は、高さが幅に比べ
て小さく、かつ上下面を平坦面（１３）とする扁平な形
状を有しており、更に両側面（１４）が、図３に示すよ
うに断面形状において、両側方に膨出するように円弧状
に形成されている。また、ヒートパイプ（１０）の放熱
側端部（１５）の端縁（１５ａ）は、平面視において円
弧状に形成されている。The heat pipe (10) has a flat shape in which the height is smaller than the width and the upper and lower surfaces are flat surfaces (13), and both side surfaces (14) are shown in FIG. As shown in the cross-sectional shape, it is formed in an arc shape so as to bulge to both sides. The edge (15a) of the heat radiation side end (15) of the heat pipe (10) is formed in an arc shape in plan view.
【００１７】一方、ヒートシンク（２０）は、ベース部
（２１）と、ベース部（２１）の裏面側に、削り起こし
加工（スカイブ法）により形成された多数の放熱フィン
（２５）とを備える銅製加工品（銅製スカイブヒートシ
ンク）をもって構成されている。On the other hand, the heat sink (20) is made of copper having a base portion (21) and a large number of radiating fins (25) formed on the back side of the base portion (21) by shaving (skiving). It is configured with a processed product (copper skive heat sink).
【００１８】ベース部（２１）の表面側には、前端から
後端にかけて、ヒートパイプ嵌合溝（２２）が形成され
ている。このヒートパイプ嵌合溝（２２）は、上記ヒー
トパイプ（１０）の断面形状に対応する断面形状を有し
ており、溝底面（２３）が平坦面に構成されるととも
に、内周側面（２４）が、断面形状において外側にえぐ
り込むように円弧状に形成されている。A heat pipe fitting groove (22) is formed on the front side of the base portion (21) from the front end to the rear end. The heat pipe fitting groove (22) has a cross-sectional shape corresponding to the cross-sectional shape of the heat pipe (10), the groove bottom surface (23) is formed as a flat surface, and the inner peripheral side surface (24) is formed. ) Are formed in an arc shape so as to go outside in the cross-sectional shape.
【００１９】本実施形態においては、上記のヒートパイ
プ（１０）をヒートシンク（２０）に以下のようにして
固定する。すなわち、ヒートシンク（２０）におけるヒ
ートパイプ嵌合溝（２２）の内周面に、ペースト状ない
しは固形状（板状）の低融点ハンダ（融点９０℃）から
なるろう材（３０）を配設した後、嵌合溝（２２）内に
ヒートパイプ（１０）の放熱側端部（１５）を嵌合す
る。そしてその嵌合組付品を炉中で加熱して、ろう材
（３０）を溶融固化することにより、ヒートパイプ（１
０）の放熱側端部外周面をヒートシンク（２０）の嵌合
溝内周面にろう材（３０）を介して接合固定する。In the present embodiment, the heat pipe (10) is fixed to the heat sink (20) as follows. That is, on the inner peripheral surface of the heat pipe fitting groove (22) of the heat sink (20), a brazing material (30) made of paste or solid (plate) low melting point solder (melting point 90 ° C.) is disposed. After that, the heat radiation side end (15) of the heat pipe (10) is fitted into the fitting groove (22). Then, the fitting assembly is heated in a furnace to melt and solidify the brazing material (30), thereby forming a heat pipe (1).
The outer peripheral surface of the heat-dissipating side end of (0) is joined and fixed to the inner peripheral surface of the fitting groove of the heat sink (20) via the brazing material (30).
【００２０】なお、ヒートパイプ（１０）の図示しない
吸熱側端部には、その平坦面（１３）にＣＰＵ等の熱源
が接着剤等を介して接合固定される。A heat source such as a CPU is bonded and fixed to the flat surface (13) of the heat pipe (10) at an end portion (not shown) of the heat pipe (10) via an adhesive or the like.
【００２１】以上のように、本実施形態の冷却装置によ
れば、ヒートパイプ（１０）が扁平形状を有し、かつ両
側面（１４）が円弧状に形成されるとともに、ヒートシ
ンク（２０）のヒートパイプ嵌合溝（２２）が、ヒート
パイプ（１０）の形状に対応して形成されているため、
ヒートパイプ（１０）の外周面と、ヒートシンク（２
０）の溝内周面との間の接触面積を十分に大きく確保す
ることができるとともに、伝熱性の向上を図ることがで
き、冷却性能の向上を図ることができる。As described above, according to the cooling device of the present embodiment, the heat pipe (10) has a flat shape, the both side surfaces (14) are formed in an arc shape, and the heat sink (20) is formed. Since the heat pipe fitting groove (22) is formed corresponding to the shape of the heat pipe (10),
The outer peripheral surface of the heat pipe (10) and the heat sink (2)
In addition to ensuring a sufficiently large contact area with the inner peripheral surface of the groove (0), heat transfer can be improved, and cooling performance can be improved.
【００２２】更に本実施形態におけるヒートパイプ（１
０）は、上下両面が平坦面（１３）に形成されているた
め、その平坦面（１３）にＣＰＵ等の熱源を直接固定で
きる上、十分な伝熱性を確保することができる。従って
本実施形態の冷却装置においては、従来のようにヒート
パイプに、ＣＰＵとの伝熱性を確保するためにヒートス
プレッダ等を取り付ける必要がなく、その分、部品点数
を削減できて、組立作業を簡単に行えるとともに、コス
トの削減を図ることができる。Further, in the present embodiment, the heat pipe (1)
In (0), since both upper and lower surfaces are formed as flat surfaces (13), a heat source such as a CPU can be directly fixed to the flat surface (13), and sufficient heat conductivity can be ensured. Therefore, in the cooling device of the present embodiment, it is not necessary to attach a heat spreader or the like to the heat pipe in order to secure heat conductivity with the CPU unlike the related art, and the number of parts can be reduced by that much, and the assembly work can be simplified. And cost reduction can be achieved.
【００２３】また本実施形態において、ヒートシンク
（２０）の嵌合溝（２２）内に低融点ハンダからなるろ
う材（３０）を配設し、そのろう材（３０）を溶融固化
して、ヒートパイプ（１０）を接合固定するものである
ため、溶融状態でのろう材（３０）が、毛管現象によ
り、ヒートパイプ（１０）の外周面と嵌合溝（２２）の
内周面との間における隙間全域に均等に浸透していき、
嵌合溝（２２）内周面における所要領域の全域をヒート
パイプ（１０）の外周面にむら無く接合することがで
き、より一層伝熱性を向上させることができる。In this embodiment, a brazing material (30) made of low melting point solder is provided in the fitting groove (22) of the heat sink (20), and the brazing material (30) is melted and solidified. Since the brazing material (30) in the molten state is used for joining and fixing the pipe (10), the gap between the outer peripheral surface of the heat pipe (10) and the inner peripheral surface of the fitting groove (22) is caused by capillary action. Penetrates evenly throughout the gap in
The entire required area on the inner peripheral surface of the fitting groove (22) can be evenly joined to the outer peripheral surface of the heat pipe (10), and the heat conductivity can be further improved.
【００２４】しかも、ろう材（３０）として、融点が９
０℃程度の低融点ハンダを用いているため、ろう付け時
の加熱温度を低く設定することができ、ヒートパイプ
（１０）に、熱による悪影響が及ぶのを防止でき、例え
ば熱劣化による品質の低下を有効に防止することがで
き、高い品質を確実に得ることができる。Further, the brazing material (30) has a melting point of 9
Since a low melting point solder of about 0 ° C. is used, the heating temperature at the time of brazing can be set low, and the heat pipe (10) can be prevented from being adversely affected by heat. Reduction can be effectively prevented, and high quality can be reliably obtained.
【００２５】更に嵌合溝（２２）の内周側面（２４）
を、外側にえぐり込むような円弧状に形成して、その嵌
合溝（２２）にヒートパイプ（１０）を嵌合するもので
あるため、ろう付け加熱時において、ヒートパイプ（１
０）の両側縁部を、嵌合溝（２２）の内周側面上縁（２
４ａ）によって溝底側に抑圧することができる。従って
ろう付け時に、ヒートパイプ（１０）を抑圧するための
仮止め治具等を別途組み付ける必要がなく、その分、ろ
う付け作業を簡単に行えて、組立作業を、より一層簡単
に行うことができる。Further, the inner peripheral side surface (24) of the fitting groove (22)
Is formed in a circular arc shape so as to go outside, and the heat pipe (10) is fitted into the fitting groove (22).
0), the upper edge (2) of the inner peripheral side surface of the fitting groove (22).
4a) can be suppressed to the groove bottom side. Therefore, at the time of brazing, it is not necessary to separately attach a temporary fixing jig or the like for suppressing the heat pipe (10), so that the brazing operation can be performed easily and the assembling operation can be performed more easily. it can.
【００２６】また本実施形態においては、ヒートシンク
（２０）を、アルミニウム等と比べて、熱伝導率が高い
銅製加工品により構成しているため、この点において
も、伝熱性（放熱性）を向上でき、より一層、冷却性能
を向上させることができる。In this embodiment, since the heat sink (20) is made of a copper-made product having a higher thermal conductivity than aluminum or the like, the heat transfer (radiation) is also improved in this respect. The cooling performance can be further improved.
【００２７】なお、上記実施形態においては、放熱手段
として、ヒートシンク（２０）を用いるようにしている
が、本発明は、それだけに限られず、ヒートシンクに代
えて他の放熱手段、例えば熱拡散板等を用いるようにし
ても良い。In the above embodiment, the heat sink (20) is used as the heat radiating means. However, the present invention is not limited to this, and other heat radiating means, such as a heat diffusion plate, may be used instead of the heat sink. It may be used.
【００２８】[0028]
【発明の効果】以上のように、この発明のヒートパイプ
式冷却装置によれば、両側面が円弧状の扁平なヒートパ
イプと、ヒートパイプに対応する形状の嵌合溝を有する
ヒートシンク等の放熱手段とを備え、ヒートパイプを嵌
合溝に適合状態に嵌合して固定するものであるため、ヒ
ートパイプの外周面と、放熱手段の溝内周面との間の接
触面積を十分に大きく確保できるとともに、伝熱性を向
上できて、冷却性能を向上させることができる。更に本
発明においては、ヒートパイプが扁平形状に形成されて
いるため、十分な伝熱性を確保しつつ、ヒートパイプの
吸熱側端部にＣＰＵ等の熱源を直接固定することができ
るので、例えばＣＰＵとの伝熱性を確保するためにヒー
トスプレッダ等を取り付ける必要がなく、その分、部品
点数を削減できて、組立作業を簡単に行えるとともに、
コストの削減を図ることができるという効果がある。As described above, according to the heat pipe type cooling device of the present invention, heat is radiated from a flat heat pipe having arcuate sides on both sides and a heat sink having a fitting groove having a shape corresponding to the heat pipe. Means, the heat pipe is fitted and fixed to the fitting groove in a fitting state, so that the contact area between the outer peripheral surface of the heat pipe and the inner peripheral surface of the groove of the heat radiating means is sufficiently large. As well as securing, heat transfer can be improved, and cooling performance can be improved. Furthermore, in the present invention, since the heat pipe is formed in a flat shape, a heat source such as a CPU can be directly fixed to the heat-absorbing end of the heat pipe while securing sufficient heat conductivity. There is no need to attach a heat spreader, etc., to ensure heat transfer with the device, which reduces the number of parts and makes assembly work easier.
There is an effect that the cost can be reduced.
【００２９】また本発明において、ヒートパイプを放熱
手段の嵌合溝に、低融点ハンダからなるろう材を用いて
接合固定する場合には、溶融状態でのろう材が、毛管現
象により、ヒートパイプの外周面と嵌合溝の内周面との
間における隙間全域に均等に浸透していき、嵌合溝内周
面における所要領域の全域をヒートパイプの外周面にむ
ら無く接合することができ、より一層伝熱性を向上させ
ることができるという利点がある。Further, in the present invention, when the heat pipe is joined and fixed to the fitting groove of the heat radiating means by using a brazing material made of low melting point solder, the brazing material in the molten state is formed by the heat pipe due to a capillary phenomenon. It can evenly penetrate the entire gap between the outer peripheral surface of the fitting groove and the inner peripheral surface of the fitting groove, and can evenly join the entire required area of the inner peripheral surface of the fitting groove to the outer peripheral surface of the heat pipe. This has the advantage that the heat conductivity can be further improved.
【００３０】また本発明において、放熱手段として、熱
伝導率が高い銅製のヒートシンクを用いる場合には、一
段と伝熱性を向上でき、冷却性能を更に向上させること
ができるという利点がある。Further, in the present invention, when a copper heat sink having a high thermal conductivity is used as the heat radiating means, there is an advantage that the heat conductivity can be further improved and the cooling performance can be further improved.
【図１】この発明の実施形態であるヒートシンク式冷却
装置の放熱部を分解して示す斜視図である。FIG. 1 is an exploded perspective view showing a heat radiating portion of a heat sink type cooling device according to an embodiment of the present invention.
【図２】実施形態における冷却装置の放熱部を示す斜視
図である。FIG. 2 is a perspective view showing a heat radiating portion of the cooling device in the embodiment.
【図３】実施形態における冷却装置の放熱部を示す断面
図である。FIG. 3 is a cross-sectional view illustrating a heat radiating portion of the cooling device according to the embodiment.
１０…ヒートパイプ １４…側面 １５…放熱側端部 ２０…ヒートシンク（放熱手段） ２２…ヒートパイプ嵌合溝 ３０…ろう材 DESCRIPTION OF SYMBOLS 10 ... Heat pipe 14 ... Side surface 15 ... Heat dissipation side end part 20 ... Heat sink (heat dissipation means) 22 ... Heat pipe fitting groove 30 ... Brazing material
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） // Ｂ２３Ｋ 101:14 Ｈ０１Ｌ 23/46 Ｂ Continued on the front page (51) Int.Cl. 7 Identification FI FI Theme Court II (Reference) // B23K 101: 14 H01L 23/46 B
Claims (3)
し、かつ両側面が断面形状において側方に膨出する円弧
状に形成されたヒートパイプと、 前記ヒートパイプの断面形状に対応する断面形状のヒー
トパイプ嵌合溝が形成された放熱手段とを具備し、 前記ヒートパイプの放熱側端部が、前記ヒートパイプ嵌
合溝内に嵌合された状態で固定されてなることを特徴と
するヒートパイプ式冷却装置。1. A heat pipe having a flat shape whose height is smaller than its width and having both side surfaces formed in an arc shape bulging laterally in a cross-sectional shape; Heat radiating means having a heat pipe fitting groove having a corresponding cross-sectional shape, wherein a heat radiating side end of the heat pipe is fixed in a state fitted in the heat pipe fitting groove. A heat pipe type cooling device characterized by the above-mentioned.
が、前記ヒートパイプ嵌合溝内周面に低融点ハンダから
なるろう材を介して接合固定されてなる請求項１記載の
ヒートパイプ式冷却装置。2. The heat pipe type according to claim 1, wherein an outer peripheral surface of a heat radiation side end of the heat pipe is joined and fixed to an inner peripheral surface of the heat pipe fitting groove via a brazing material made of low melting point solder. Cooling system.
もって構成されてなる請求項１又は２記載のヒートパイ
プ式冷却装置。3. The heat pipe type cooling device according to claim 1, wherein said heat radiating means is constituted by a copper heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001092145A JP2002286380A (en) | 2001-03-28 | 2001-03-28 | Heat pipe type cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001092145A JP2002286380A (en) | 2001-03-28 | 2001-03-28 | Heat pipe type cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002286380A true JP2002286380A (en) | 2002-10-03 |
Family
ID=18946659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001092145A Pending JP2002286380A (en) | 2001-03-28 | 2001-03-28 | Heat pipe type cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002286380A (en) |
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| JP2009302417A (en) * | 2008-06-17 | 2009-12-24 | Furukawa Electric Co Ltd:The | Method for fixing heat pipe and heat sink |
| CN101959389A (en) * | 2009-07-13 | 2011-01-26 | 富瑞精密组件（昆山）有限公司 | Heat radiating device and manufacture method thereof |
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| JP2009302417A (en) * | 2008-06-17 | 2009-12-24 | Furukawa Electric Co Ltd:The | Method for fixing heat pipe and heat sink |
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