TW508785B - Method and device for alignment - Google Patents
Method and device for alignment Download PDFInfo
- Publication number
- TW508785B TW508785B TW090122331A TW90122331A TW508785B TW 508785 B TW508785 B TW 508785B TW 090122331 A TW090122331 A TW 090122331A TW 90122331 A TW90122331 A TW 90122331A TW 508785 B TW508785 B TW 508785B
- Authority
- TW
- Taiwan
- Prior art keywords
- alignment
- overlapped
- mark
- scope
- patent application
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims description 46
- 239000002674 ointment Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 23
- 239000010408 film Substances 0.000 description 11
- 239000010409 thin film Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 241000283074 Equus asinus Species 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Details Of Measuring And Other Instruments (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000356277A JP2002162206A (ja) | 2000-11-22 | 2000-11-22 | アライメント方法および装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW508785B true TW508785B (en) | 2002-11-01 |
Family
ID=18828556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090122331A TW508785B (en) | 2000-11-22 | 2001-09-10 | Method and device for alignment |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2002162206A (ja) |
| KR (1) | KR100819571B1 (ja) |
| CN (1) | CN1258809C (ja) |
| TW (1) | TW508785B (ja) |
| WO (1) | WO2002043138A1 (ja) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1349114A3 (en) | 2002-03-19 | 2011-06-15 | Canon Kabushiki Kaisha | Sensor calibration apparatus, sensor calibration method, program, storage medium, information processing method, and information processing apparatus |
| JP2005166859A (ja) * | 2003-12-02 | 2005-06-23 | Athlete Fa Kk | ボール搭載装置 |
| CN100406846C (zh) * | 2006-03-20 | 2008-07-30 | 友达光电股份有限公司 | 对准检测装置及对准偏移量的检测方法 |
| CN102856239B (zh) * | 2006-07-31 | 2018-03-30 | 温泰克工业有限公司 | 将预定元件置于目标平台的装置和方法 |
| CN101188247B (zh) * | 2007-08-16 | 2010-11-10 | 清华大学 | 一种有机电致发光显示器及其制备方法 |
| KR100890757B1 (ko) * | 2007-12-05 | 2009-03-26 | 주식회사 나래나노텍 | 노즐 디스펜서의 노즐 오프셋 보정 장치 및 방법 |
| KR100975647B1 (ko) * | 2008-10-09 | 2010-08-17 | 주식회사 나래나노텍 | 잉크젯 헤드의 얼라인 장치, 액적 실시간 검사 장치, 및 잉크젯 헤드의 얼라인 및 액적 실시간 검사 장치 |
| JP5342210B2 (ja) | 2008-10-30 | 2013-11-13 | 三菱重工業株式会社 | アライメント装置制御装置およびアライメント方法 |
| KR101132842B1 (ko) * | 2009-10-22 | 2012-04-02 | 세크론 주식회사 | 다이본딩장치의 오프셋입력방법 |
| US8102064B2 (en) * | 2010-04-08 | 2012-01-24 | Nanya Technology Corp. | Electrical alignment mark set and method for aligning wafer stack |
| JP6305887B2 (ja) * | 2014-09-16 | 2018-04-04 | 東芝メモリ株式会社 | 半導体装置の製造方法及び半導体製造装置 |
| CN105413769A (zh) * | 2015-12-22 | 2016-03-23 | 苏州汶颢芯片科技有限公司 | 微流控芯片对准键合装置 |
| JP7496506B2 (ja) | 2020-12-02 | 2024-06-07 | パナソニックＩｐマネジメント株式会社 | 部品圧着装置および部品圧着方法 |
| KR102633129B1 (ko) * | 2021-09-29 | 2024-02-06 | 한국생산기술연구원 | 다이 웨이퍼 간 본딩 시 정렬방법 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04302445A (ja) * | 1991-03-29 | 1992-10-26 | Toshiba Corp | 半導体素子の実装構造 |
| JPH07283272A (ja) * | 1994-04-15 | 1995-10-27 | Citizen Watch Co Ltd | 電子部品搭載装置 |
| JPH08162503A (ja) * | 1994-11-30 | 1996-06-21 | Casio Comput Co Ltd | 電子部品の位置合わせ方法及びその装置 |
| US5764366A (en) * | 1995-11-30 | 1998-06-09 | Lucent Technologies Inc. | Method and apparatus for alignment and bonding |
-
2000
- 2000-11-22 JP JP2000356277A patent/JP2002162206A/ja active Pending
-
2001
- 2001-09-06 CN CNB018221394A patent/CN1258809C/zh not_active Expired - Fee Related
- 2001-09-06 KR KR1020037006847A patent/KR100819571B1/ko not_active IP Right Cessation
- 2001-09-06 WO PCT/JP2001/007741 patent/WO2002043138A1/ja active Application Filing
- 2001-09-10 TW TW090122331A patent/TW508785B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002043138A1 (fr) | 2002-05-30 |
| CN1486507A (zh) | 2004-03-31 |
| KR20030055315A (ko) | 2003-07-02 |
| KR100819571B1 (ko) | 2008-04-04 |
| CN1258809C (zh) | 2006-06-07 |
| JP2002162206A (ja) | 2002-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW508785B (en) | Method and device for alignment | |
| JP5354382B2 (ja) | 基板貼り合わせ装置及び基板貼り合わせ方法、並びに積層半導体装置の製造方法 | |
| TWI225841B (en) | Robot system for transferring substrates and substrate transferring container used by the same | |
| JP2829642B2 (ja) | 露光装置 | |
| JP5359873B2 (ja) | 基板貼り合わせ方法、位置決め方法、積層基板製造装置、位置決め装置及び露光装置 | |
| WO2009122529A1 (ja) | 面状体のアライメント装置、製造装置、面状体のアライメント方法及び製造方法 | |
| JP4768731B2 (ja) | フリップチップ実装ずれ検査方法および実装装置 | |
| JP2005251972A (ja) | ウェハ重ね合わせ方法及びウェハ重ね合わせ装置 | |
| TW200304016A (en) | Substrate laminating apparatus and method thereof and substrate detecting apparatus | |
| KR20210004872A (ko) | 고정밀 본드 헤드 위치 결정 방법 및 장치 | |
| CN112771652A (zh) | 裸晶附接系统及用此系统进行集成精度验证和校准的方法 | |
| US20060199085A1 (en) | Method and device for adjusting an alignment microscope by means of a reflective alignment mask | |
| JP4289961B2 (ja) | 位置決め装置 | |
| JP2006071395A (ja) | 較正方法及び位置合わせ方法 | |
| JPH09138256A (ja) | 被検査基板のアライメント方法 | |
| TW201218246A (en) | characterized by detecting the positions of a mask and a work-piece alignment marks for several times to thereby check the difference between a first alignment measure and a second alignment measure | |
| KR20140146442A (ko) | Z축 비틀림 보정이 포함된 기판과 마스크 정렬방법 | |
| KR20210123161A (ko) | 기판 접합 장치. | |
| JPH0737785A (ja) | 露光装置およびそのアライメント方法 | |
| KR102094962B1 (ko) | 기판의 고정밀 위치정렬 방법 및 그 방법을 사용하는 합착기 | |
| CN109103122A (zh) | 影像校准的置晶方法及置晶设备 | |
| CN111580358B (zh) | 曝光系统以及物品制造方法 | |
| JP2007173285A (ja) | ウェーハプローバ装置およびウェーハ検査方法 | |
| US20100231878A1 (en) | Systems and methods for manufacturing semiconductor device | |
| JP2860569B2 (ja) | 露光装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |