TW508785B - Method and device for alignment - Google Patents

Abstract

The object of the present invention is to provide a method and a device for alignment capable of easily and absolutely adjusting the relative position between both the objects to be joined within an acceptable accuracy in the case that alignment is performed for joining the objects to be joined and that one object is covered with a coating material. To solve the problem, when the relative position between the first object to be joined and the second object to be joined covered with a coating material is aligned, the reference mark that is the representative of position of aligning the first object to be joined at the position corresponding to the area of outside covering material of the second object to be joined is displayed on a screen on the basis of the position of a mark for aligning the first object to be joined recognized by means of recognition. The position of the mark for aligning the second object to be joined fitted on the outside of the coating material of the second object to be joined which is recognized by the recognition means is displayed on the screen. The position of the second object to be joined is corrected so that the position of the mark for aligning the second object to be joined is within the acceptable accuracy range with respect to the position of the reference mark.

Description

508785

V. Description of the invention 0) [Technical leadership] The relative positions of conductive pastes are specified in the invention. This invention relates to a range of alignment accuracy when one side is made of a non-conductive film or a non-covered bonded object. Method and device. [Background Art] For example, when mounting a semiconductor wafer on a substrate, a substrate covered with a coating material may be used in some areas such as a non-conductive film. Before lapping, the relative position of the wafer and the substrate must be aligned within the specified range. However, the position corresponding to the wafer position alignment mark on the substrate is covered by a non-conductive film or the like, and it is not possible to add a position alignment mark for the substrate at this position, that is, the substrate is added because it is shielded by the non-conductive film or the like Even with the alignment mark, the mark cannot be read correctly. Therefore, in practice, it is not possible to manually or automatically (automatically) align the relative positions between the wafers with such a non-conductive film. [Disclosure of the Invention] Therefore, an object of the present invention is to provide an alignment method and device, which can be used to align two overlapped objects when they are aligned to overlap each other and one of the overlapped objects has a covering material. The relative position of the object is surely and easily adjusted within the allowable accuracy range. In order to achieve the above-mentioned object, the alignment method of the present invention is characterized in that: when aligning the relative position of the first overlapped object with the second overlapped object having the covering material, the identification is performed by identifying The mechanism recognizes the position of the mark for alignment of the first overlapped object, and at the same time, based on the identified position, the position corresponding to the outer area of the covering material of the second overlapped object is displayed to represent the first overlapped object.

508785 V. Description of the invention (2) A / quasi-mark on the screen; #identified by the identification mechanism attached to the position of the second overlapped object on the outside of the covering material of the second latticed object f, / Υ Υ, it is expected that the position of the system is on the aforementioned screen; Correction No. = The position of the aforementioned reference mark reaches the prior specification:; = Within the range. In this method, 'as a covering material', non-permeability, or any of the permeation: Any kind can be 'The covering #, for example,' consisting of a non-conductive film or a non-conductive soft reward, and is set at the second overlap The prescribed area of things. The second object is composed of, for example, a semiconductor crystal moon, and the second object is, for example, an overlap. Consists of a substrate (such as a glass substrate). In addition, the above-mentioned alignment method can be used to manually correct the position of the second overlapped object, and it can be automatically (fully automatically) corrected. In the above-mentioned alignment method, when identifying the position of the alignment mark of the second object, the identification mechanism can be moved from the identification position of the alignment mark of the first object to the second object. The position is aligned with the identification position of the mark. When moving the recognition mechanism, the position recognition accuracy of each record obtained by the recognition mechanism may decrease with the movement. In order to avoid the decrease of the accuracy ^ the position recognition error generated by the movement of the recognition mechanism is calibrated with reference standards. Better. Furthermore, in the above-mentioned alignment method, from the positional relationship between the reference mark displayed on the aforementioned screen and the position alignment mark of the second object to be bonded, the second object to be bonded can be obtained without image processing. The amount of correction needed. Based on this correction amount, the position of the second overlapped object can be corrected. ,

Page 5 ^ 312 \ 2d > code \ 90-ll \ 90122331. 508785 V. Explanation of the invention (3) Furthermore, the holding and moving system of each overlapped object, or the axis direction and moving system of the identification mechanism When a deviation amount occurs due to some mechanical factors, the amount of compensation corresponding to the deviation amount is taken into consideration, and it can be corrected by inputting it when the screen displays the position alignment mark of the second overlapped object. Errors caused by mechanical elements. After aligning by such an alignment method, it is better to re-identify the position alignment mark of the second object to be bonded and confirm the accuracy of the first object and the second object. Due to such a lapping method, it is possible to achieve a high-precision alignment and high-precision alignment.

The alignment device of the present invention is an alignment device for aligning the relative position of the first overlapped object with the second overlapped object having a covering material, and is characterized by: The position of the positional alignment mark and the identification mechanism of the level alignment mark of the second overlapped object attached to the outside of the covering material of the second overlapped object; and the identification mechanism of the first overlapped object The position of the alignment mark is used as a reference, and a reference mark representing the position of the second overlapped object is displayed on the day surface with respect to the position of the outer area of the covering material of the second overlapped object. The identification position of the second alignment mark of the mechanism is on the same day, and the relationship between the position of the reference mark and the identification position of the second alignment mark of the object can be grasped. Image processing mechanism for the correction amount of the overlapped object. The first bonded object is composed of, for example, a semiconductor wafer, and the second bonded object is composed of, for example, a non-conductive thin film or a non-conductive substrate that is soft and depleted in a predetermined area as a coating material. As the identification means, for example, two cameras can be used. In addition, the identification mechanism is used to identify the side of the second object to be overlapped.

508785 V. Description of the invention (4) = = When it is necessary to move, it is better to have a reference gauge for calibrating the position recognition error caused by the private movement of the recognition mechanism. The method and device for the alignment of the moon, according to the reference mark of the position of the side of the first overlapped object is set and displayed on the day surface. The position of the reference mark of the second object position is based on |, and the identification is attached to V; The position of the second overlapped object outside the covering material of the grid is registered with the position (ie,! I can be identified by the identification mechanism: on the day, and the deviation of the two marked positions on the screen can be placed: Based on the position deviation, based on the position deviation, the position of the second overlapped object is within the position of the second overlapped object. The relative position of the rice dipper is easily controlled within the allowable accuracy range, that is, ' That is, the alignment of one side of the overlapped object is impervious to the desired high precision alignment. In other words, according to the alignment method and device of the present invention, the condition of the overlapped object is overlapped. Objects overlap each other by ，;: = ί The relative position of overlapping objects is within the allowable accuracy range center, ΐ

Bei now has a difficult alignment. 1 J

[Best Mode for Carrying Out the Invention] A preferred embodiment of the present invention will be described below with reference to the drawings. Figures 1 to 5 show that the alignment method according to the present invention is a donkey: ^ ^^ #, Λ, ζ " " The object to be connected is formed by covering a predetermined area with a non-conductive thin film substrate. This non-conductive film may be transparent

) ⑽ / 85 V. Description of the invention (5) = Impervious. The figure shows the alignment of the wafer before the substrate is mounted. However, the types of the two overlapped objects are not particularly limited as long as they satisfy the requirements specified in the present invention. The alignment device not shown in the figure is a device assembled on the overlapping device. As shown in FIG. 2, the wafer 2 as the bonded object at the place 1 is passed from the wafer holder 3 through the wafer. Money structure 4 /, take out a piece 'through the suction nozzle 5 with a reverse function. It is under the lap joint 7 located at the lower end of the joint tool β, and is held there by suction. Lapping tool 6 is made of pressurized gas red and can be vertically adjusted

(Direction), and necessary pressure can be applied at the same time. 2 directions, guide along the Z-axis guide 9. As shown in Fig. 1, two cameras 10a, 1a, 1 ^ 0.1, and camera No.2, which can be identified by 1f ° circumferential positive position, are arranged below the wafer 2 held by the aforementioned lap joint 7. ). The cameras 10a and 10b are ^ targets, and can identify the position alignment mark of the wafer 2 located above.

^ ^ ^ ^ ^ 2〇 ^ 'π ^ ± χ ^ ^ (Xl 5 X stage 12 m I u is on the mouth 12' and at the same time due to the camera orientation), it can be adjusted to the up and down direction (Z direction) and forward and backward Direction α square n = ', by ΥΓΓΓ: held on the substrate table 13, because the substrate table has the 彺 X Υ direction' while the rotation direction (Θ direction) is adjusted. V. Description of the invention (β) The plate 1 1, with its 4 Only move to the second position and move to the third position. You can go to the position above the wafer 2 and the camera 10a, 10b, and then apply the position. When the position is corrected later, the substrate 11 is adjusted. The fine-tuning action of the Zhou Zhou plate 13 can be manually fine-tuned. The US plate = is not limited to the mechanism, and can also be performed automatically. The method of emptying the glass between the substrate 11 and the auxiliary glass when 0.1 soil_process Λ is loaded with the second auxiliary glass ^; Guima \ '/ Drop down and mount the substrate 11 on the auxiliary lower Z axis: its' Errors in the X and Y directions of the mechanical factors when the camera Z axis or the head Z car is lifted, the substrate is lifted, and the sloped substrate is lowered. # The position of the substrate is aligned with the mark on the day and day. Yes, the amount of compensation can be prevented. It is held under the wafer 2 of the lap joint 7, as shown in Fig. 3, and the alignment marks 14a and 14b for the wafer 2 are attached to both sides. The non-conductive thin film 15 having a size as large as that of the wafer 2 is coated on a predetermined area of the panel (for example, an area having a plurality of overlapping terminals 16). It is in the area covered by the non-conductive film 丨 5, because the test wave of light seeking is blocked by the non-conductive special film 15 and cannot be transmitted, or because it is transmissive but difficult to read with good accuracy, for example, it is Even with the positioning marks, the following cameras 10a and 1 Ob cannot be read correctly. That is, there are prior art problems as indicated. In this embodiment, in the outer region of the non-conductive thin film 5 on the substrate 11 and in the area shown in FIG. 3, in the outer region of the non-conductive ^ thin film 15 as shown in FIG. Positioning marks 17a and 17b for the 11 basic sides are provided. Since the substrate 11 is composed of a glass substrate, it can transmit light well, and these position alignment marks 1 7a and 17b can be used in the following cameras.

\\ 312 \ 2d-code \ 90-ll \ 90122331.ptd Page 9 508785 V. Description of the invention (7) 10a, 10b. Regarding the position of the wafer 2, the position of the substrate 11 can be adjusted within the allowable accuracy range of the target by the following alignment method. As shown in FIG. 4, first, the alignment marks 1 4 a and 1 4 b of the wafer 2 are read by the cameras 10 a and 10 b (step S1), and the read positions are aligned with the identification positions of the marks 14 a and 14 b. As a reference, with respect to the position of the outer region of the non-conductive thin film 15 of the substrate 11 (that is, the positions of the alignment marks 17a and 17b with respect to the substrate 11), the display is set to represent the position of the wafer 2. The reference marks (for example, the cross marks 1 8 a and 1 8 b shown in FIG. 3) are on the day surface (step S2). Next, the substrate 11 is inserted above the cameras 10a and 10b due to the operation of the substrate stage 13 (step S3). Then, the cameras i0a and 10b are moved to the positions X1 and X2 on the photographic table 12 to the positions of the substrate 11 for the alignment marks 17a and 17b (step S4). Next, the cameras 10a and 10b are used to identify the positional alignment notes 17a and 17b of the substrate 11. As shown in FIG. 5, on the day surface 19 of the above-mentioned display reference marks 18a and 18b, the reference is used. The positions of the markers i8a and Γα are used as a reference, and the position alignment marker 17a b is displayed like the marker 20a through image processing.) Fig. 5 (b) shows that Dong-shaped two reference marks 18a, 18b are used as circular image marks 20a, 20; f, for cross-shaped reference marks 18a, 18 "" square opening / image mark 20a, 20b To show. The above image processing is used to display the position on the written image, which is aligned on the n side of the substrate :: Temple: fiducial position of the fiducial mark 18a, 18b = 2〇, 2 cents, and the quantity 'enables display. About its X, γ, 0;

508785

V. Description of the invention (8)

Looking at the above-mentioned display day surface, for example, the substrate stage 丨 3 is fine-tuned while one side, and the substrate is moved manually (by hand) (however, it is also possible to move fully automatically), and the position is adjusted (step S6). . That is, as shown in Figs. 5 (a) and (b), the positions of the image marks 20a, 2Ob (20a, 20b,) on the 11 side of the substrate 11 are adjusted to match the positions of the reference marks 18a, 18b. In this alignment, in order to accurately identify the current position of the substrate 11 and perform image processing, press the confirm button to set the positions of the substrate 11's position alignment marks 17a and i7b as one of the image marks 20a and 20b. The position is identified by image processing, and the alignment error is displayed (step S7). Moreover, it is better to make it possible to display the required amount for the next correction.

In this way, the positions of the reference marks 丨 8a and 8b 'representing the position of the wafer 2 and the positions of the image marks 20a and 20b of the mark aligning marks 7a and 17b with respect to the substrate 11 are determined. Is it within the allowable accuracy range (step S 8). If it does not reach the allowable accuracy range, go back to step ς 6 and repeat the same operation as above. If it is determined that the accuracy is within the allowable range, the wafer bonding operation is performed (step S9). Check whether the operation is within the allowable accuracy range. After alignment, read the substrate again.

, 1 7 b ′ After confirming the accuracy and then overlapping, it is possible to perform a more solid and high-precision overlapping. , X

As for the alignment of the conventional embodiment, when the substrate 11 has a covered area of the non-conductive film 15, the alignment marks 17a and 17b attached to the area can be appropriately used, and the wafer and the substrate are easy. Moreover, the alignment position is accurately and accurately within the allowable error range. Furthermore, as described above, the cameras 〇a and 〇b need to be moved due to the position alignment marks 丨 7 a and 17 b of the identification substrate 11.

The gap is cold, as shown in the figure, which may cause the accuracy error of position recognition. However, in this case, for example, p I 规 does not add a reference gauge 21, which can be properly calibrated to correctly compensate for the error that # = ί 私 动. That is, along the camera 10 a, 10 b, ^. 1 h or the private movement route, a preset high-precision ratio of Ji Fucha Zhao Zhao 700, ..., not less than 22 is arranged The relationship between the reference gauge 21 and the reference target position from each comparison) and the reading of the position (moving photo # ,,) with the cameras 10a, 10b can correct the correction with the cameras 10a, 10b Move the 'reference standard' above, compare the reference mark 22 to the alignment, move to χι, \ and the direction of movement Υι, [industrial availability] For example, as shown in FIG. 7, the reference rule 21 is constituted on the X and γ sides. You can calibrate the two directions of the moving party Y2.

Regarding the alignment method and device of the present invention, it can be applied to an overlapped object having a covering material on one side of the position alignment. 2 An overlap device that needs to be aligned first.疋 Suitable [Explanation of the component number] 1 Alignment device for each other 2 Wafer Wafer holder

Wafer supply mechanism Suction nozzle Lapping tool Lap joint Pressurized cylinder

\\ 312 \ 2d-code \ 90-ll \ 90122331.ptd Page 12 508785 V. Description of invention (ίο) 9 Z-axis guides 10a, 10b Camera 11 Substrate 12 Zhao φ camera stage 13 Substrate stage 14a Note 14b Position registration 15 Non-conductive film 16 Terminal for overlap 17a Position registration 17b Position registration 18a Cross reference 18b Cross reference 19 Day surface 20a Image record 20b Image marks 21, 21 '' Benchmark 11, 22J comparison reference mark

\\ 312 \ 2d-code \ 90-ll \ 90122331.ptd Page 13 508785 Brief description of drawings Figure 1 is a perspective view of an alignment device according to an embodiment of the present invention. FIG. 2 is a partial perspective view of an overlapping device having the device of FIG. 1. FIG. FIG. 3 is an enlarged schematic perspective view of a wafer and a substrate as a bonded object. FIG. 4 is a control flowchart of an alignment method according to an embodiment of the present invention. 5 (a) and 5 (b) are schematic configuration diagrams showing a position alignment state of a reference mark and a position alignment mark on a substrate, which are displayed on a daytime surface. Figure 6 is a perspective view of a reference gauge. FIG. 7 is a perspective view of another reference gauge.

\\ 312 \ 2d-code \ 90-ll \ 90122331.ptd Page 14

Claims (1)

5〇8785 6. Scope of patent application, 1. An alignment method, which is characterized in that: when the relative position of the first overlapped object is aligned with the second overlapped object with the covering material, The position of the object alignment mark is recognized by the identification mechanism, and based on the identified position, the position of the outer area of the covering material relative to the second object is displayed as the position representing the first object. The reference mark is on the daylight surface; and the position of the second alignment mark on the outside of the covering material of the second overlapped object is identified by a recognition mechanism, and the identification position is displayed on the aforementioned daylight surface. ; The position of the alignment mark of the second overlapped object is within a predetermined tolerance range with respect to the position of the reference mark, and the position of the second overlapped object is corrected. 2. The alignment method according to item 1 of the scope of patent application, wherein when identifying the position of the second alignment target mark, the identification mechanism is moved from the position of the first alignment target mark. To the position where the second overlapped object is aligned with the mark for identification. 3. The alignment method according to item 2 of the scope of patent application, wherein the position recognition error as the recognition mechanism moves is calibrated with a reference gauge. 4. The alignment method according to item 丨 in the scope of patent application, wherein the positional relationship between the reference mark displayed on the aforementioned daytime surface and the position alignment mark of the second object to be overlapped is obtained through image processing. The amount of correction required for the second overlapped object. 5. The alignment method according to item} in the scope of the patent application, wherein when the position alignment mark of the second overlapped object is displayed on the aforementioned daytime surface, the compensation amount is taken into consideration by taking into account the amount of deviation caused by mechanical factors. 6 · — A method of overlap, which is used in the first scope of the patent application 508785 VI. Scope of Patent Application Method 后 After aligning, re-identify the position alignment mark of the 2nd object to be overlapped to confirm the accuracy of the 1st object and the 2nd object. 7 · —An alignment device, which is aimed at the relative position of the first overlapped object and the second overlapped object with a covering material, is characterized by including: a different mechanism for identifying the first overlapped object The position of the alignment mark of the overlapping object and the position alignment mark of the second overlapping object attached to the outside of the covering material of the second overlapping object; and the image processing mechanism, which recognizes the first substrate by the identification mechanism. The position of the alignment mark of the overlapped object is used as a reference, and the position corresponding to the outer area of the covering material of the second bonded object is displayed as the first overlapped object. The reference mark of the position of the object is displayed on the day, and the position of the alignment mark for identifying the position of the second object to be overlapped is displayed on the same screen by the recognition mechanism ^ ', and the second object is overlapped according to the position of the reference mark. The relationship between the position of the object alignment mark and the identification position of the object can grasp the correction amount of the second object to be overlapped. 1. The alignment device according to item 7 of the scope of patent application, wherein the first bonded object is composed of a wafer, and the second bonded object is covered with a non-conductive film or a non-conductive ointment to be used as a covering material. It consists of a substrate in a predetermined area. / 9 · The alignment device according to item 7 of the patent application scope, wherein the identification mechanism is composed of two cameras. The alignment device of the scope of application for patent No. 7 has a reference gauge for identifying the position error of the mobile identification mechanism.