TW507303B - Conductive composition, and manufacturing method of electrode or printed circuit board, electrode connecting method, and electrode or printed circuit board using the same - Google Patents

Conductive composition, and manufacturing method of electrode or printed circuit board, electrode connecting method, and electrode or printed circuit board using the same Download PDF

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Publication number
TW507303B
TW507303B TW90113407A TW90113407A TW507303B TW 507303 B TW507303 B TW 507303B TW 90113407 A TW90113407 A TW 90113407A TW 90113407 A TW90113407 A TW 90113407A TW 507303 B TW507303 B TW 507303B
Authority
TW
Taiwan
Prior art keywords
electrode
conductive composition
scope
hardened
conductive
Prior art date
Application number
TW90113407A
Other languages
English (en)
Chinese (zh)
Inventor
Isamu Arai
Masumi Arai
Yasuhumi Otsubo
Kazuya Edamura
Original Assignee
Fujiprint Ind Co Ltd
New Technology Man Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujiprint Ind Co Ltd, New Technology Man Co Ltd filed Critical Fujiprint Ind Co Ltd
Application granted granted Critical
Publication of TW507303B publication Critical patent/TW507303B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW90113407A 2000-06-02 2001-06-01 Conductive composition, and manufacturing method of electrode or printed circuit board, electrode connecting method, and electrode or printed circuit board using the same TW507303B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000166543 2000-06-02

Publications (1)

Publication Number Publication Date
TW507303B true TW507303B (en) 2002-10-21

Family

ID=18669842

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90113407A TW507303B (en) 2000-06-02 2001-06-01 Conductive composition, and manufacturing method of electrode or printed circuit board, electrode connecting method, and electrode or printed circuit board using the same

Country Status (3)

Country Link
AU (1) AU2001262682A1 (fr)
TW (1) TW507303B (fr)
WO (1) WO2001095343A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7786600B2 (en) * 2008-06-30 2010-08-31 Hynix Semiconductor Inc. Circuit substrate having circuit wire formed of conductive polarization particles, method of manufacturing the circuit substrate and semiconductor package having the circuit wire

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0695462B2 (ja) * 1989-05-19 1994-11-24 シャープ株式会社 電極上への導電性粒子の配置方法
JP2998169B2 (ja) * 1990-04-12 2000-01-11 富士ゼロックス株式会社 異方導電体用構造体及び異方導電体の製造方法
JPH05298913A (ja) * 1991-07-19 1993-11-12 Ajinomoto Co Inc 光硬化性導電性ペースト
JP3165477B2 (ja) * 1991-09-11 2001-05-14 昭和電工株式会社 回路接続方法
JPH07216272A (ja) * 1994-02-07 1995-08-15 Showa Denko Kk 光硬化性導電ペースト
JPH08134383A (ja) * 1994-11-16 1996-05-28 Sekisui Chem Co Ltd 光硬化性導電性塗料組成物
JPH08315883A (ja) * 1995-03-14 1996-11-29 Fujikura Rubber Ltd コネクタおよびコネクタ付基板とそれらの製造方法
JPH08273440A (ja) * 1995-03-31 1996-10-18 Asahi Chem Ind Co Ltd 異方性導電膜
JPH10126036A (ja) * 1996-10-18 1998-05-15 Shin Etsu Polymer Co Ltd フレキシブル配線板の製造方法、ヒートシールコネクタの製造方法およびヒートシールコネクタ
JP3925571B2 (ja) * 1997-06-06 2007-06-06 株式会社ブリヂストン 異方性導電フィルム
JPH10338842A (ja) * 1997-06-06 1998-12-22 Bridgestone Corp 異方性導電フィルム
EP1005509B1 (fr) * 1997-08-19 2002-01-16 Minnesota Mining And Manufacturing Company Compositions de resines epoxy conductrices, films adhesifs anisotropiquement conducteurs et procedes de connexion electrique
JPH11112150A (ja) * 1997-09-30 1999-04-23 Hokuriku Electric Ind Co Ltd 多層基板とその製造方法

Also Published As

Publication number Publication date
WO2001095343A1 (fr) 2001-12-13
AU2001262682A1 (en) 2001-12-17

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