TW507303B - Conductive composition, and manufacturing method of electrode or printed circuit board, electrode connecting method, and electrode or printed circuit board using the same - Google Patents

Abstract

The present invention relates to a conductive composition, and a manufacturing method of electrode or printed circuit board, an electrode connecting method, and an electrode or a printed circuit board using the same. The present invention aims to provide a conductive composition that can improve the production efficiency in the connection process between electrodes and lower the product defective rate and a manufacturing method of electrode or printed circuit board, an electrode connecting method, and an electrode or a printed circuit board using the conductive composition. The conductive composition is a conductive composition (40) composing light-hardening elements and conductive materials (41). While in hardened condition after illumination, the conductivity of the conductive composition is higher than 10<SP>-4</SP> S/m.

Description

507303 A7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention (1) [Technical Field] The present invention relates to a composition for connecting one electrode to another electrode. Electricity &amp; [Technical Background] # For example, the method of electrically connecting the electrodes in a printed circuit board and the electrodes of electronic components is like using a cream solder. An example of such a connection method will be described with reference to FIG. 12. FIG. 12 is a schematic view of a part of a printed circuit board 10 including a substrate body 1] and a plurality of] electrodes (in this example, pads of a printed circuit board in a surface-mounting method) 12. First, a specific amount of 2 cream solder 20 is applied on the electrode 12 by, for example, printing. Next, the second electrode 30 (see _) is brought closer to the first electrode 12 and the milky soldering flux 20 is brought into contact with the second electrode 30. Then, the reflow is performed, that is, the substrate 10 is placed in a heated environment to melt the cream solder 20 and perform solder adhesion. However, in recent printed circuit boards 10, as the size of products such as mobile phones is miniaturized, the electrode interval L or the electrode width D is gradually becoming smaller. In this way, even if the number of the first electrodes 12 is small, when the milky soldering flux 20 is overloaded, as shown by the electrode 2 at the right end in FIG. 13, the milky soldering flux 20 may flow around and cause a short circuit. The probability is quite high. If the amount of the milky soldering flux 20 is too small in order to avoid such a bad situation, as shown by the electrode 12 in the center of FIG. 13, the possibility of a poor contact is extremely high. In this way, with the evolution of miniaturization of the printed circuit board 10, the conditions for applying the amount of the milky solder 20 are relatively strict, and it is easy to cause the increase of the defective rate or the deterioration of the production efficiency. (Please read the precautions on the back before filling out this page.) Installation • ϋ H ϋ This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -3- 507303 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs System A7---- ~-B7 V. Description of the invention (2) Therefore, in order to eliminate this phenomenon, there are techniques such as Japanese Unexamined Patent Publication No. H-97482, Japanese Unexamined Patent Publication No. Hiroshi, and Japanese Unexamined Patent Publication. [B] Bulletin No. 74313. In these techniques, first, a sheet-shaped circuit connection material mixed with conductive particles is prepared. This circuit connecting material has its electrical conductivity rounded, so that it can function as an insulator in the initial state (before use). Next, the circuit connection material is mounted on the first electrode. Next, the second electrode is pressed against the second electrode while sandwiching the circuit connection material. In this way, in the pressed part, the m particles, each electrode, and the conductive particles' will be electrically connected with the pressing force (or even heated while being pressed), thereby forming an electrical connection. Conversely, the unpressed portion maintains the insulator state. In this way, it can be obtained that the opposite electrodes are connected, and the non-opposed electrodes form an insulated electrode connection structure. However, in this technology, if the pressing force on the circuit connection material is too small, it will not be able to form sufficient conductivity, resulting in poor contact. To avoid this phenomenon, if the pressing force is too large, it may be possible. Damage to the electrode or substrate structure. Therefore, this technology is extremely delicate in adjusting the pressing force, so there is still room for improvement in terms of improving manufacturing efficiency or reducing product failure rates. The present invention has been made in view of the above-mentioned facts, and an object thereof is to provide a conductive composition that can improve the manufacturing efficiency and reduce the defective rate of products in the connection process between electrodes. [Invention] The conductive composition of the first patent application scope, which contains a light-hardening component and a conductive material, and is conductive after being irradiated by light (please read the note on the back? (This page)

This paper scale applies the Chinese National Standard (CNS) A4 specification (21,297 mm) 507303 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (3) The rate is above 10_4S / m. The conductive composition in the scope of the patent application No. 2 is the conductive composition in the scope of the patent application No. 1 in which the conductivity in the uncured state is above 10-7 $ / m. The conductive composition in the scope of the patent application No. 3 is the conductive composition in the scope of the patent application in the first or second scope of the patent application. It is treated with a heating environment above 150 ° C after being cured or hardened after light irradiation. , So that the conductivity in the hardened state is more than 0_2S / m. The conductive composition in the scope of patent application No. 4 is the conductive composition in any of the scope of patent applications No. 1 to 3, and the light for curing the photo-hardening component contains at least visible light, ultraviolet light, X Light, electron beam, laser light, infrared light. In the present invention, the electron beam is covered by the concept of light. The conductive composition in the scope of patent application No. 5 is the conductive composition in any of the scope of patent applications No. 1 to 4 in which the light-hardening component in the conductive composition is 15 to 85 parts by volume, and The composition of the conductive material is 85 to 15 parts by volume. The conductive composition according to the patent application No. 6 is the conductive composition according to any one of the patent application scopes Nos. 1 to 5. In the uncured state, the light-hardening component has a thin sheet or film shape. The conductive composition according to claim 7 is the conductive composition according to any of claims 1 to 5, in which the light-hardened component is in an emulsified or pasty state in an unhardened state. The conductive composition No. 8 in the scope of the patent application is the scope of the patent application. The paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page). 507303 A7 ------ B7 ____ 5. Description of the invention (4) In the conductive composition according to any one of items 1 to 7, the conductive material is particulate. The conductive composition according to item 9 of the scope of patent application is the conductive composition according to any one of claims 1 to 7, and the conductive material is linear or columnar. The conductive composition of the scope of patent application No. 10 is the conductive composition of any of the scope of patent application No. 9, the linear or columnar conductive material is along the direction of the gap between the electrodes to be connected extend. The manufacturing method of the electrode in the scope of patent application No. 11 is to make the first electrode connected to the second electrode in contact with the conductive composition in any of the scope of patent application No. B10, and then approximately equivalent to First] The rhenium conductive composition on the electrode part is hardened by irradiating light, and then the non-hardened conductive composition is removed, so that the hardened conductive composition remains on the first electrode. The manufacturing method of the electrode in the scope of patent application No. 12 is to make the first electrode which should be connected to the second electrode contact the conductive composition in any of the scope of patent application No. [b], and then it will be approximately equivalent to that. Except for the part of the electrode, the rest of the conductive composition is hardened by irradiating light, and then the hardened conductive composition is removed, so that the non-hardened conductive composition remains in the first Electrode. The method for manufacturing a printed circuit board according to item 13 of the scope of the patent application is to contact the conductive composition having any of the tenth scope of the scope of the patent application with the electrode provided with the printed circuit board and should be connected to the second electrode. Then, the conductive composition, which is approximately equivalent to the part of the electrode, is irradiated with light and the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 male f) (Please read the note on the back? Matters before (Fill in this page) Install -------- Order --------- ^^^ 1 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6 03

V. Description of the invention (Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs and then removing the non-hardened conductive composition, leaving the hardened conductive composition on the first electrode. The method for manufacturing a printed circuit board according to item 14 is to contact a conductive composition according to any one of item 10 of the application patent application on the second electrode provided with the printed circuit board and connected to the second electrode, and then Except for the portion that is approximately equivalent to the first electrode, the conductive composition in the remaining portion is hardened by irradiation with light, and then the cured conductive composition is removed to leave an unhardened conductive composition. The electrode connection method of item 5 of the declared patent scope is a residual electrode made according to the method of application item 11 or item 12 of the patent application]. In the state in which the second electrode is in contact with the second electrode, the first and second electrodes are heated by the conductive material and / or the second electrode or the second electrode is pressed against the conductive composition to make the second] and the second electrode 2-electrode shape The structure of the electrical connection. The electrode connection method of the printed circuit board with the scope of the patent application No. 16 is the conductive composition on the remaining first electrode prepared in accordance with the method of the patent application No. 3 or No. 4 In the state of contacting the 2f electrode, the conductive composition is heated and / or the conductive electrode is pressed by the conductive element or the second electrode, so that the conductive element is interposed between the conductive element and the second electrode. The structure for forming an electrical connection. The electrode connection method of claim 17 in the patent scope is to contact the electrode] with the conductive composition of any one of the scope of the patent application, and then it will be approximately equivalent to that of the first. 〖The conductive composition of the part of the electrode is hardened by light irradiation, and then the non-hardened conductive composition is removed, and then the second electrode is brought into contact with the cured conductive group (please read the precautions on the back before (Fill in this page)

Size of this paper _ China National Tomb Fresh (cns ;; A4 size coffee x Norwegian public love) 507303 A7 ----------- --B7 ____ V. Description of the invention (6) In the state of hardening The passed conductive composition is heated and / or pressed against the conductive composition by the first electrode or the second electrode. The electrode connection method of the 18th scope of the application for the patent is to contact the first electrode with the conductive composition according to any one of the 10th scope of the patent scope of the patent application, and then the electrode parts that are approximately equivalent to the first] The conductive composition is hardened by irradiating light, and then the hardened conductive composition is removed, and then the second electrode is brought into contact with the conductive composition on the remaining electrode. In this state, the conductive composition is The object is heated and / or pressed against the conductive composition by the first or second electrode. The electrode of the scope of patent application No. 19 is provided with a conductive composition according to any of the scope of patent application No. 10 on the surface. The electrode with a patent scope of 苐 20 is an electrode with a scope of patent application 申请 9, and the conductive composition provided on the surface is hardened by light. The electrode in the scope of patent application No. 21 is an electrode in the scope of patent application No. 9 in which the conductive composition provided on the surface is in a state before being hardened by light. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The printed circuit board with the scope of patent application No. 22 has electrodes for any of the patent scopes No. 19-21. The manufacturing method of the electrode in the scope of patent application No. 23 is such that the first electrode which is to be connected to the second electrode is in contact with the conductive composition in any of the scope of patent application No. [b], and then it will be approximately equivalent to the first 1 The conductive composition of the part of the electrode is hardened by irradiation with light, and then the non-hardened conductive composition is removed, so that the hardened conductive composition remains in the -8th-This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) 507303 A7 B7 7 V. Description of the invention (1 on the electrode. The manufacturing method of the electrode in the 24th scope of the patent application is in the 23rd scope of the patent application. The conductive composition is applied to the first electrode by a printing method or a spreading method, and is in contact with the first electrode. The connection method of the electrode in the scope of patent application No. 25 is based on the method in the scope of patent application No. 23. The obtained conductive composition on the remaining electrode is in a state of contacting the second electrode by heating the conductive composition and / or pressing the first or second electrode against the conductive composition Thing The first and second electrodes are electrically connected to each other. The conductive composition of the patent application No. 26 is a conductive composition containing a photo-hardening component and a conductive material. The electrical conductivity when the material is applied with a voltage and hardened by light irradiation is 10-6 S / m. The conductive composition in the 27th scope of the patent application is the conductive material in the 26th scope of the patent application. These are metal particles. The method for manufacturing an electrode in the 28th area of the patent application is such that the first electrode connected to the second electrode is in contact with the conductive composition in the %% or "" area of the patent application, and will be approximately equivalent. The employee of the Intellectual Property Bureau of the Section] applied the electric field printed by the conductive composition printed on the electrode, and then irradiated the conductive composition with light to harden it, leaving the hardened conductive composition to remain. On this electrode. The manufacturing method of the electrode of the scope of patent application No. 29 is provided with the scope of the patent scope of claim 28, and the conductive composition is applied by a printing method or a spreading method. It is placed on the electrode], and it is in contact with the electrode]. This paper size is applicable to t _ house standard (CNS) A4 size coffee x Norgesha-507303 A7 -------- B7 __ V. Description of the invention (8) The manufacturing method of the 30th electrode for patent application is to contact the first electrode that is to be connected to the second electrode and contact the conductive composition in the %% or ^ item of the patent application scope, and then approximately equivalent to the first ] The conductive composition of the electrode part is applied with an electric field, and then the conductive composition is irradiated with light to harden, and then the non-hardened conductive composition is removed to make the hardened conductive composition. Residues remain on the electrode]. The method of manufacturing the electrode of the scope of patent application No. 3 is the method of manufacturing the electrode of the scope of patent application No. 11 or 12, so that the conductive composition is in contact with the No. After one electrode, before the conductive composition is irradiated with light to be cured, the conductive composition is pre-cured by heating or light irradiation. The conductive composition No. 32 in the scope of the patent application is in the form of a sheet or film in the sixth scope of the patent application, and the conductive composition is supported on both sides or single sides by a protective film, and A state in which the conductive composition is retained. [Brief description of the drawings] Fig. 1 is a schematic enlarged partial cross-sectional view of a conductive composition according to a first embodiment of the present invention. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 2 is a schematic enlarged cross-sectional view of a schematic part of the particulate conductive material used in the first embodiment of the present invention. Figures 3 (a) to (d) are enlarged schematic cross-sectional views of the outline of a linear conductive composition as a conductive material in the first embodiment of the present invention. Figure iiXi ^ gyi3 (e) is a schematic plan view. Figure 4 is an electrode using a conductive composition according to the first embodiment of the present invention. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) A7 V. Description of the invention (Illustration diagram of the connection method, The __ opening is intended to correspond to the section of a printed circuit board.

The second-bright view 'of the method for connecting electrodes of the conductive composition shown in Fig. 3' is a schematic diagram corresponding to a cross section of a printed circuit board. The first diagram is a description of the type not shown in the fifth diagram, and is equivalent to a schematic diagram of a printed circuit board. The drawing is an explanatory diagram of a method for connecting electrodes using a conductive composition according to a second embodiment of the present invention, and is an * intent corresponding to a cross section of a printed circuit board. The second illustration of the method for connecting the electrodes of the conductive composition according to the third embodiment is a view corresponding to a cross section of a printed circuit board. / The illustration of the electrode connection method of the conductive composition of the fourth embodiment of the invention, 75 corresponds to τσer of the cross section of the printed circuit board, and the illustration of the electrode connection method of the conductive composition of the fifth embodiment of the 4th invention. Equivalent to the cross section of a printed circuit board

(Please read the notes on the back before filling this page} -------- ^ --------- 1 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 61 ^ ^ ^ m ^ ^ ^ t The illustration of the connection method is a schematic diagram corresponding to the cross-section of a printed circuit board. Figure 12 is an explanatory diagram of the conventional electrode connection method, which is equivalent to the schematic diagram of a cross-section of a printed circuit board. Standard (CNS) A4 specification (21 × 297 mm 507303 _ — V. Description of the invention (10) Figure 13 shows the conventional electrode remote connection, and the table u _ does not go through each illustration, which is equivalent. A schematic view of a cross section of a printed circuit board. [Illustration of symbols] 10 Printed circuit board 11 Substrate body 12 First electrode 20 Emulsion solder 30 Second electrode 40 Conductive composition 41 Conductive material 50 Cover 60 Hardened Part 70 Uncured part 80 Electrode 81 Power source 140 Conductive composition 142 Protective film 143 Protective film 160 Hardened part 170 Uncured part 240 Conductive composition 260 Conductive composition 41 α Non-conductive material body 41b Conductive coating film[A better aspect of the invention implementation] The conductive consumer composition 40 of the first embodiment of the present invention is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, and will be described in detail according to the first and second figures. This conductive composition The system contains a photo-hardening component and a conductive material, and the conductivity after curing under light irradiation is 10-4 S / m or more, preferably 10_2 S / m or more. In addition, the conductive composition of this embodiment , The conductivity in the unhardened state is 〖〇-7S / m (Please read the precautions on the back before filling this page)

I A7 ^ ~ ---------------- -_B7 V. Description of the invention (11)-It is better to be more than 104S / m. In addition, the conductive composition of the present embodiment is hardened by light irradiation or has a conductivity of 10-2 S / m or more after being treated with a heating environment of 150 t or more during hardening, and is preferably composed of the above. The conductive composition 40 is formed into a thin sheet or a thin film in a state where the photo-hardening component is not hardened, and only a part of the figure is enlarged). Although the thickness is set according to the application, it can be, for example, 100 to 500. When forming a thin sheet or thin film, the conductive composition 40 is preferably flexible. The conductive) and green composition 40 is prepared by mixing a photo-hardening component, a conductive material 41, and additives necessary for mixing. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, the light-hardening component exists in the conductive material. The term “hardness of light” used herein refers to the reaction (such as polymerization reaction or cross-linking reaction) between light-hardened components through light 'to change the rheological properties of the composition. For example, if the original state is liquid (such as milky or pasty), it will form a solid state (a state with a certain degree of self-retention of the shape, generally referred to as elastic). Such phenomena are mostly manifested in curing or gelation. If the original state is a semi-solid state or a solid state, then light hardening means increasing the hardness or elasticity, or reducing the solubility of the developing solution used in the developing process of the subsequent process (the process of removing unnecessary parts). The light-hardening component refers to, for example, analogs or derivatives of methacrylic acid polymers, such oligomers, and polymers, vinyl polymers or polymers containing at least one or more of these polymers. Ethylene compounds, these oligomers, and polymers or resins containing at least one or two or more of these polymers. You can choose one of these or two of them and mix them together. The conductive composition 40 may contain various additives in addition to the light-hardening component and the conductive material 41. For example, solvent, hardener, and paper size are applicable to China National Standard (CNS) A4 (21〇 X 297 public love) -13- 507303 A7

Please read Note I I on the back first

t J I

Page I A7 B7 Printed by Zhihui Finance Co., Ltd. V. Description of the invention (13) f Records of conventional indium and tin oxide alloys such as tin oxide and thallium. In addition, the conductive coating film 41b is preferably heated, and it is easy to generate contact metal (electrode or other conductive material) and intermetallic compounds. Such a composition is like a solder alloy. The conductive material 41 only needs to be conductive on the outer mask, and may be composed of a conductive material (same material as the conductive coating film) as a whole. When an intermetallic compound is generated, the conductive composition can be improved through Since the conductivity between the electrodes is strengthened, the joint strength between the metals is strengthened, so that the decrease in the conductivity due to vibration, time, etc. can be reduced, and a joint with excellent durability and stability can be formed. The conductive materials 41 may be those having the same structure with each other, or a mixture of different structures. The conductive material 41 can be produced, for example, by coating a non-conductive material body 41α with a material that forms a conductive coating film. The conductive material 41 may be made of a conductive material as a whole. Conductive material 4] When the total amount with the light-hardening component is set to 100 parts by volume, it is prepared in the amount of 85 to 15 parts by volume relative to the light-hardening component, preferably from 15 to 85 parts by volume. In the case of 20 to 40 volume parts, 80 to 60 volume parts are prepared. Since this structure imparts conductivity to a conductive material, the conductivity in the conductive composition can basically be set. When the conductive material is in the form of particles, its particle size is ^ obtained by the conductive material 41, ease of uniform dispersion, sufficient conductivity to be imparted to the conductive composition 40, and photo-hardening is ensured From the viewpoint that the necessary light enters the conductive composition 40, it is best that this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 2. Description of the invention (14) This type. In addition, when the linear material is linear (including beard) or columnar, the length of the long axis varies depending on the electrode interval, but it is best] 〇〜5〇〇 # | ' (Cross-section diameter) is 〇5〜100〇 # (more preferably 50 // m). Examples of the conductive composition 40 using the linear conductive material 41 are shown in Figs. 3 (α) to (e). As shown in these figures, examples of the linear conductive material 41 are a structure protruding above and below the photocurable component (Figure (a)), a structure protruding only above or below (Figure (b) or (c)) In the structure that does not protrude from above and below (Fig. (D)), as shown in Fig. (E), it is preferable to arrange them at intervals in a plan view. The linear conductive material 4 is arranged in a direction crossing the extending direction of the conductive composition 40, and is preferably arranged in a vertical direction. As a result, the linear conductive material 4 is formed so as to extend in the direction of the gap to which the electrodes should be connected (in the example in FIG. 3, approximately along the vertical direction of the drawing). In addition, in use, the linear conductive material 41 may be arranged in a direction crossing the end surface to which the electrode is to be connected, and is preferably arranged in a vertical direction. As a result, the electrodes are connected to each other by a linear conductive material (to be described later). In addition, the length of the major axis of the linear conductive material shrinks and stretches during fusion bonding, and it is preferable to design it to include this part of the reserved length. For example, consider designing about 90% to 20% of the distance between the electrodes. Next, the electrode connection method using the conductive composition 40 according to this embodiment is described in detail with reference to FIG. 4. In this example, the conductive material 41 is a particulate material. In the same figure (α), only a part of the printed circuit board 10 which is the same as the conventional one is shown. If this structure is the same as the conventional one-outfit -------- order i — (Please read the precautions on the back before filling this page)%,

Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 507303 A7 --------_____ B7___ V. The same symbol is assigned to the description of the invention (15), and the description of the components is omitted here. Although this printed circuit board 10 has a plurality of first electrodes 12 as is conventional, only one is shown in the figure for simplicity. First, as shown in Fig. (B), a conductive composition 40 formed in a sheet shape is mounted on the first electrode 12 in a contact shape I. The planar shape of the conductive composition 40 may be formed into a specific shape in advance according to the arrangement state of the electrodes 12, or may cover the entire surface of the substrate. Next, as shown in Fig. (C), in the conductive composition 40, a portion corresponding to the electrode 12 to be connected is exposed, and a cover 5 covering the remaining portion is disposed on the conductive composition 40. . Next, the hardenable conductive composition 40 is irradiated from above the mask 50 (it varies with the composition of the conductive composition 40, such as ultraviolet rays). Thereby, the conductive composition 40 forms a portion 60 which is hardened by the exposure-hardening component and a portion 70 which is not hardened by the exposure-hardening component. After that, only the non-hardened portion 70 is removed with an appropriate solvent (such as a test solution, specifically, an aqueous sodium carbonate solution), and only the hardened portion 60 remains (see the same figure (d)). This operation of removing unnecessary portions is also referred to as development in this specification. Thereby, the electrode 12 on which the hardened conductive composition 40 remains and the printed circuit board 10 having such an electrode 12 can be obtained. Here, if the conductive composition 40 has some adhesiveness with the electrode 12 (the so-called "adhesion" here refers to the state of the result of relative adhesion due to fusion or the generation of intermetallic compounds) With the composition, the state of being adhered to the electrode 12 can be maintained. Therefore, it can be transported or stored in this state. After that, as shown in Figure (e), the second electrode 30 is brought into contact with conductivity (please read the precautions on the back before filling in this page). -

507303 A7 V. Description of the invention (16) The composition 40 is pressed on top, and placed at a temperature of 150 ° C or more at the same time in a heating environment at 200 ° C ~ 250 ° C. Therefore, in this aspect, the first electrode 12 can be electrically connected to the second electrode 30. In this specification, the term "electrical connection between electrodes" means "a state in which the electrodes are in a connected state, or a level that can achieve the purpose of electrical connection". In this embodiment, by using the aforementioned pressing, the electrodes 2 and 30 and the conductive composition 40 can be reliably contacted, so that an electrical connection is formed between them. In the conventional technique disclosed in Japanese Unexamined Patent Publication No. Π-97482, if sufficient pressure is not applied to the circuit connection material, a problem arises that it is difficult to obtain conductivity. In view of this, according to this embodiment, since the conductive composition 40 can be used as a conductive body and has conductivity, it is not necessary to press strongly, but only to ensure that each electrode 1 2, 30, and conductive The degree of electrical connection of the sexual composition 40 can be very slightly pressed. Therefore, until the electrode is damaged, there is a sufficient spatial range of the pressing force range of the pressing force channel, so the control of the pressing force becomes easier to control. Therefore, by using the conductive composition of this embodiment and connecting the electrodes, it has the advantages of improving the production efficiency in the manufacturing process and reducing the defective rate of the product. In addition, in this embodiment, in addition to pressing, a heating environment treatment is performed. Therefore, intermetallic compounds are easily generated between each of the electrodes 12 and 30 and the conductive composition 40, and the two can be further ensured. Electrical connection. Please refer to Fig. 4 (4) for such a ready-to-connect state. Moreover, in this embodiment, since the conductive composition 40 is formed in a thin sheet shape, its thickness is extremely easy to be uniform. Therefore, the remainder is on page] (Please read the notes on the back before filling out this page) ^ ------- I --------- Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-18 Explanation of the invention (17) The thickness of the conductive composition 4Q on the electrode 12 can be uniformized. This has the advantage that problems such as poor contact with the second electrode 30 can be reduced. Furthermore, in this embodiment, the conductivity of the conductive composition 40 in the uncured state is 10-7 S / m or more, and it is particularly preferable to set it to i0_4 s / m or more, so it is assumed that Even if only the hardened portion 60 of the conductive composition 40 is hardened on the outside, and the hardened portion 60 is not hardened on the inside, it is possible to provide extremely high conductivity between the first electrode 12 and the second electrode 30. In addition, the first or second electrode 12, 30 may be a part which can be used for connection other than a pad of a printed circuit board, such as a conductive circuit or a lead of an electronic component. In this embodiment, a method for connecting the electrodes using the linear conductive material 41 shown in FIG. 3 (α) will be described in detail with reference to FIG. 5. The pattern numbers (α) to ⑴ in the figure correspond to the procedures shown in Figure 4. In this example, the basic sequence is the same as above. In this example, as shown in FIG. 5 (e), the second electrode 30 is brought into contact with the conductive composition 40 (especially the conductive material 41 therein), and then the conductive material 4 is melted by reflow. , So that the first electrode 12 and the second electrode 30 are electrically connected. In this way, the electrical connection between the electrodes can be ensured, and at the same time, it has the advantages of high durability and stability over time. In addition, the properties of the conductive composition 40 are non-adhesive when uncured, and have an adhesive structure when cured (light irradiation), so that it is easier to remove the uncured portion 70, and The hardened portion 60 has advantages on the residual electrode 12. In addition, when it is not hardened, use a temperature of less than 100c> c, or use a different type or irradiation amount of light than that used during hardening (for example,

507303 V. Description of the invention (18) Weak light), before the developing process, the conductive composition 40 is made into a semi-hardened state on the electrode 12 and the surface layer is made into a semi-hardened state. Tightness. If such a pre-hardening treatment is performed, the conductive composition 40 on the electrode 2 is in a semi-hardened state and is laminated on the printed circuit board], and the printed circuit board can be stored or transported until the next development process. until. For a modification of the example shown in FIG. 5, please refer to FIG. The example of Fig. 5 is as shown in Fig. (C), and corresponds to the conductive composition 40 on the remaining first electrode 2 and is cured by using a mask 50 and irradiated with light. In the example of FIG. 6, instead of this method, portions other than the conductive composition 40 on the remaining [] electrode] 2 are covered with a mask 50 as shown in FIG. 6 and hardened by irradiating light. . Then, only this hardened portion is removed, and a state shown in Fig. 5 (d) is obtained. Then, it moves to the procedure after FIG. 5 (e). Here, the related conductive composition 40 can be maintained in a state as shown in Fig. 5 (d) as long as it has the property that the electrode can be adhered even in an uncured state in advance. Next, "the conductive composition according to the second embodiment of the present invention] 40 will be described in detail mainly based on Fig. 7 (b). In the description of the second embodiment, the same reference numerals are given to the structures and functions common to those in the above-mentioned embodiment, and the description of this part is omitted. This conductive composition 140 basically includes a photo-hardening component and a particulate conductive material 41 as in the first embodiment. However, in the second embodiment, the whole is slightly milky, pasty, or semi-solid in a state where the light-curing component has not yet been cured. This rheological property varies with the use, but when it is milky or pasty, this paper h applies the Chinese National Standard (CNS) A4 specification -------- (Please read the precautions on the back before filling (This page) * Installation ---- Order --------- Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives-20-Si 303

V. Description of the invention (19) In the case of uncured state, the viscosity is 100 ~ 3000cps. In addition, although it is milky or pasty, in the hardened state, it shows a semi-solid state that can maintain its self-shape, such as the one with a yield value of more than 0 2Pα. The term "semi-solid" refers to a state close to the pasty state, or having a shape retention property (holding property), and a state having greater solid characteristics than the pasty state. In addition, "Uncured, it can use 10 (rc or less), or use a different type of light than that used for curing, or a weaker amount of light than when curing." Prior to the development process, the conductive material 41 is semi-cured. Or the surface layer can be made into a semi-hardened state. In terms of rheological properties, the semi-hardened state shows a gel state in the middle of the milky or pasty state and the semi-solid state after light hardening. Next, for the electrode connection method using the conductive composition 14 in this embodiment, please refer to Fig. 7 for detailed description. Fig. 7 (α) to ⑴ correspond to Fig. 4 (α) to ( The steps in step f) are related to the common steps, and their basic explanations are omitted. As shown in FIG. 7 (α), the printed circuit board 10 used may be the same as that in the first embodiment. Then, if As shown in FIG. 7 (b), a milky conductive composition is mounted on the first electrode [2] in a contact state] 40. The planar shape of this conductive composition [40] can be mounted on the entire surface. On the substrate 10, an arbitrary method such as a printing method may be used. The method is only mounted on the configuration corresponding to the electrode 2. In this embodiment, since the conductive composition 14 is milky, even if the electrode stands at a position lower than the upper surface of the substrate (that is, the electrode (12 is recessed in the substrate and has a concave shape), and the conductive composition 14 can also easily contact the electrode 12. (Please read the precautions on the back before filling this page) —----- ^ —- ------ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics-21-507303 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics A7 ----------- -B7_— V. Description of the invention ( 20) Then, as shown in FIG. (C), as in the first embodiment, a portion corresponding to the electrode to be connected 2 is exposed in the conductive composition 140, and the V electrical composition 1 40 is exposed. A cover covering the rest is arranged on the top. Next, the hardenable conductive composition 14 is irradiated from above the cover 50. With this, the conductive composition 40 forms a portion hardened by the exposure hardening component 1 60, And unexposed parts that are not exposed to hardened components. Then, only the unexposed parts The chemical conversion part 170 is removed by a suitable solvent, and only the hardened part 160 remains (see the same figure (d)). As a result, the electrode 12 with the hardened conductive composition 140 remaining thereon, and a print having such an electrode 12 can be obtained. Circuit board 10. Even if the conductive composition 1 40 according to this embodiment contains a composition having some adhesiveness with the electrode] 2, the state of being adhered to the electrode 12 can be maintained. Therefore, Transport or store in this state. The subsequent sequence is the same as the first implementation. Therefore, even if the conductive composition is used, the electrodes can be connected. As a result, the production in the manufacturing process can be improved. Efficiency, and the advantages of reducing product failure rate. In the second embodiment, since the conductive composition 1 40 is not in the form of a sheet and is paste-like, the conductive composition disposed on the substrate 1 Q is not in a uniform thickness state. Appropriate components for the surface with a defined thickness can make its thickness uniform. The so-called "appropriate element having a surface with a limited thickness" means, for example, a plate-like element, which can be used by the cover 50 as well. Therefore, the structure of the mask 50, for example, has a plate-like element structure as a whole, and the exposed (exposed) portion only needs to be transparent. Next, regarding the third embodiment of the present invention, a conductive composition is used.

---------------. (Please read the notes on the back before filling this page)

A7 A7 B7 V. Invention description (21 140 electrode connection method, as shown in Figure 8 below, detailed description. Ground conduction 14, and the finished product 1 40 'can be used as in the second embodiment. The 8th Figures (α) to (c) correspond to steps 7f-1. The steps in Figure 7 (α) to (c). As shown in Figure 8 (α), the printed lightning failure Lr-1 Π 罨The circuit board 10 may be the same as that of the first embodiment. Next, as shown in FIG. 8 (b), a conductive composition 14Q having a milky shape is mounted on the first electrode in a contact state. In the embodiment, the conductive composition is mounted only at a position corresponding to the first electrode 12 (that is, only at a required position) by a screen printing method. However, the method of mounting the conductive composition 140 is also Other printing methods (such as metal plates and waxed paper) can be used. 'Spreading method (such as using a sprayer) can be used. Then, as shown in FIG. The hardened light. This conductive composition 14 is mounted only at a desired position by screen printing, so even if it is not With a cover, the conductive composition at a desired position can also be subjected to light irradiation treatment. By this, the conductive composition 1 40 will form a cured conductive composition 1. Then, the residue on the top can be obtained. The electrode 12 has a hardened conductive composition] 60. The subsequent procedure is the same as that shown in FIG. 7 of the second embodiment, and detailed explanations are omitted. Next, the fourth embodiment of the present invention is related to The method of connecting the electrodes using the conductive composition 240 will be described in detail with reference to Fig. 9. Figs. 9 (α) to (c) are steps corresponding to Fig. 7 (α) to (c). As shown in FIG. 9 (α), the printed circuit board 10 used may be the same as that of the first embodiment. However, in this embodiment, the paper is at a position opposite to the electrode 12 Standards are applicable to China National Standard (CNS) A4 specifications (210 X 297 mm) (Please read the precautions on the back before filling out this page) I! IIII Order I --- III I. Printed by the Consumers ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -23- Printed A7 by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs &quot;- ----------- V. Description of the invention (22) An electrode 80 is provided (see Fig. 9 (b)). The relevant electrode 80 is not particularly limited. For example, it can be used with the first electrode 12 The flat electrodes on the upper side are parallel. The electrode 80 and the power source 81 are electrically connected through a switch. Next, as shown in FIG. 9 (b), a conductive composition is mounted on the first electrode 12 in a contact state. 240. Here, the conductive composition 240 is mounted on the position corresponding to the electrode 2 by using a screen printing method. To make it easier to arrange the conductive composition 240, the electrode 8 may be temporarily removed first. 〇. Thereafter, a voltage is applied between the counter electrode 80 and the electrode 12, whereby an electric field can be applied to the conductive composition 240. Therefore, the conductive material containing the conductive composition 240 is aligned in the direction of the electric field. Then, as shown in Fig. 9 (c), the conductive composition 24o is irradiated with light that can harden it, and the conductive composition 24o is formed into a cured conductive composition 260. At this time, the conductive composition 240 shrinks as the light hardens. In this way, a chain-like arrangement is formed near the conductive materials arranged as described above, and the conductivity between the mutually conductive materials is enhanced, whereby the conductivity of the conductive composition 240 can be improved. The subsequent procedures are the same as those shown in Fig. 7 (d) of the second embodiment, and detailed descriptions thereof are omitted. Next, the electrode manufacturing method using the conductive composition 1 40 according to the fifth embodiment of the present invention will be described in detail with reference to FIG. Here, the conductive composition 40 may be the same as that in the second embodiment. Figures (α) to (c) correspond to the steps in Figures (α) to (c) of Figure 7. As shown in FIG. 10 (α), the printed circuit board 10 used may be the same as that of the first embodiment. In Fig. 10, two electrodes 12 are shown. This paper size applies to China National Standard (CNS) A4 (21〇 297 mm) (Please read the precautions on the back before filling this page)

-twenty four-

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). Then, as shown in Figure 10 (b), a conductive composition 14 is mounted on the! Electrode 12 in a contact state. This In this embodiment, the conductive composition 1 40 is mounted on the entire printed circuit board. However, the method is not limited to this method, and only the conductive composition 1 40 can be used by the screen printing method. It is mounted at a desired position. Then, the conductive composition 140 is subjected to a heat treatment until the hardness of a degree of semi-hardening and drying is achieved by placing the conductive composition 140 in a heated environment. To this end, Heat curing treatment can be performed on the conductive composition 1 40 before light curing by light. For example, if the conductive composition 1 40 is mixed in a volatile solvent, after screen printing is performed, it can be placed in a heated environment. Solvent method in which the solvent is volatilized to make the conductive composition] 40 have a semi-hardened appearance, or if the conductive composition] 4 is mixed with a hardening agent prepared by disintegrating the microcapsules under a heating environment , Or mixed in Under the heat ring, the chemical reaction will be used in the latent hardener that generates the hardener component. After screen printing, the hardener (such as an amine) and the hardening component (such as an epoxy component) will be chemically processed under a heated environment. Reaction hardener method. In addition to the method of mixing the hardener in the conductive composition 14 at the beginning, it can also be mixed in the conductive composition 1 40 immediately before the screen printing process. There is also a method in which a hardener is mixed with the conductive composition 1 40 after screen printing (for example, a hardener is applied to the surface layer of the conductive composition 140). In addition, before the photohardening process, it may be used. The screen-printed conductive composition 1 40 ′ is subjected to light irradiation using a different type or a weaker amount of light than that used in the light curing process. In this case, the light -25 7 pack- ------- Order --------- (Please read the precautions on the back before filling this page) 507303 A7 V. Description of the invention (24) Before the hardening process, you can put the electrode 1 2 on The conductive composition 1 40 is pre-hardened, For example, two or more types of light-hardening components that are different from each other in light wavelength induction can be blended in the conductive composition, and then different light wavelengths can be used for pre-hardening and light-hardening treatment. Then '如 第 〖0 As shown in Fig. (C), the conductive screens [40] are brought into contact with each other. The screen 50 is formed into a thin film. In this embodiment, it is conductive. Composition〗 40 is subjected to pre-hardening treatment, so even if the mask 50 is mounted on the conductive composition M0, there is an advantage that the mask 50 can be easily removed afterwards. After that, the conductive composition 1 40 Since the cover 50 is mounted on the 'electrical composition 1 40', it is possible to perform light irradiation treatment on the conductive composition 1 40 only at a desired position. Thus, the conductive composition 140 is formed into a cured conductive composition 160. Thereby, the electrode 12 having the hardened hardened portion 160 remaining thereon can be obtained. The subsequent procedures are the same as those shown in Fig. 7 (d) of the second embodiment, and detailed descriptions thereof are omitted. Next, a method for manufacturing an electrode using the conductive composition 1 40 according to a sixth embodiment of the present invention will be described in detail with reference to FIG. 1. The conductive composition 1 40 may be the same as that in the second embodiment. As shown in FIG. 11 (α), the printed circuit board 10 used may be the same as that of the first embodiment. However, in FIG. Π, two electrodes 12 ° are shown. In addition, in this embodiment, the conductive composition 14 is on both the surface and the surface of the substrate. 'Using the protective film 1 42, 1 43 (Please refer to the figure)] Figure (α)) and (Please read the note on the back? Matters before filling out this page) Printed by the cooperative -26- 507303

Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. That is, the conductive composition 140 is sandwiched by the protective films 142j43. Therefore, even when a conductive composition having a weak strength (or viscosity) is used, the whole can be processed in a sheet or film shape, which improves the convenience in processing. In this embodiment, the protective film M2 is light transmissive. Even the protective film 143 can be light-permeable. Next, as shown in FIG. 11 (α) and FIG. 11 (b), a conductive composition 14 is mounted on the first electrode K in a contact state. At this time, the conductive film] 40 was mounted on the electrode 12 while the protective film] 43 opposite to the electrode 12 was peeled off. In this case, the pre-heating of the electrode 2 or the working treatment in a heated environment can improve the adhesion between the electrode 2 and the conductive composition] 40. In addition, according to this embodiment, as described above, since the material having relatively low viscosity of the conductive composition 1 40 can be used, the adhesion between the electrode 12 and the conductive composition 140 can be further improved. Then, as shown in Fig. 11 (b), the covers 50 are brought into contact with each other on the protective film 142. The mask 50 is a thin film. In this embodiment, since the cover 50 is mounted on the protective film 42, there is an advantage that the cover 50 can be easily removed after the required program processing is completed. Thereafter, the conductive composition 1 40 is irradiated with light that can harden it. Since the mask 50 is mounted on the conductive composition 140, it is possible to perform light irradiation treatment on the conductive composition 1 40 at only a required position. In this way, the conductive composition 1 40 is formed into a cured conductive composition [60]. Thereby, the electrode 12 with the hardened hardened portion 60 remaining thereon can be obtained. Then, the protective film 142 is removed.

This paper is suitable for financial standards (CNS) A4 ii (210 x 297 mm) (Please read the notes on the back before filling this page)

507303 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. The procedures following the description of invention (26) are the same as those shown in Figure 7 (d) of the second embodiment, and detailed explanations are omitted. Next, an example of the conductive composition according to this embodiment will be described. (Example 1) In 94 parts by weight of a photocurable induction acrylic polymer (manufactured by Nippon Kayaku Co., Ltd., trade name "KAYARAD DPHA-2C"), 3 parts by weight of 2-formyl was mixed with a photopolymerization initiator. 1- [4- (thiomethyl) phenyl] -2-morpholinopropane-1-one, and 3 parts by weight of 2-pinyl-2-dimethylamino-1- (4-morpholinebenzene Gibb-butyl-1-one, and as a photopolymerizable resin component (the photohardening component in this embodiment). This photopolymerizable resin component has a particle size distribution of 45 ~ 25 / zm, and will be composed of alloy ratio tin 96.5: silver 3 · 0: Copper fine particles made of copper 0.5 (II / 卞 &gt; &gt; manufactured by Yuki, Co., Ltd., trade name "s_LLS22〇c_Q"), mixed in accordance with the weight ratio shown in Table 1 below, and thoroughly stirred A dispersion liquid of metal fine particles is prepared. This dispersion liquid is coated with a thickness of 0.5 mm, and is left to stand for 20 minutes under an ultraviolet illuminance of 160 mW / cm2, and an ultraviolet exposure treatment is performed to disperse the dispersion as shown in Table 1. The liquids A to D were polymerized and solidified to form a thin film. Conductivity measurement was performed on the obtained films, and the results were all below the measurement lower limit of the measured value lx 10--6. Dispersion E is polymerized and solidified into a block shape instead of a thin film, so the measurement of electrical conductivity does not carry out the following heating experiment. The prepared film is heated at 23crc for one hour, and left to return the film to the chamber. Temperature, and then conduct the conductivity measurement. Repeat the same test 3 times. The results are shown in Table 2. (Please read the note on the back? Matters and then fill out this page) τ Binding-Staple-: Table paper size Applicable quasi χ 297 mm) 28- 507303 Description of invention (27: Table 1

Metal fine particle weight ratio Metal fine particle capacity ratio Electrical conductivity after UV exposure (S / m) 50 Π.9 Film-like &lt; 1CM 70 24.0 Film-like &lt; 10-6 Table 2 B 60 16.9 Film-like &lt; 10-6 Film number Electrical conductivity (S / m) of the used dispersion 1st experiment 2nd experiment 3rd experiment 1 A 2 B 3 C 4 D &lt; 10-6 &lt; 10-6 &lt; * 1 0-6 &lt; 10-6 &lt; 10-6 &lt; 1 〇- ^ 2χ 10-4 5χ 10-5 9χ 10-5 7x 10-2 lx 10-1 3x 10-2 (Please read the notes on the back before filling out this Page) 'Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. It is known from Table 2 that when the weight ratio of the metal particles of the dispersion D is 80%, the film obtained after ultraviolet irradiation and heating shows a conductivity of more than 〖 rate. Another, when 707. At that time, it was found that the conductivity of the thin film was in the vicinity of 〇_4 $ / m. When the weight ratio of the metal fine particles is less than 60%, a good thin film can be formed, but the conductivity after heating is less than 10_0 S / m of the lower limit of measurement of the conductivity meter used. (Example 2) Instead of the metal fine particles composed of the alloy ratio tin 96.5: silver 3.0: copper 0.5 used in Example 1, metal fine particles composed of the alloy ratio tin 63.0: 37.0 (Niki & gt) Eight> In addition to the company's product, trade name "1 / ^^-Λ〇 ^-$ η63Ρό37 HO 粉"), a dispersion liquid as shown in Table 3 was prepared and subjected to ultraviolet exposure treatment. Dispersion F ~ 丨 Polymerized solid is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm-29- — II Order ·! 507303 V. Description of the invention (28) into a thin film. Dispersion "Yin-, mΦ ^ Horse polymerization is solidified instead of thin, so the measurement of conductivity will not be carried out in the following heating experiment. Table 3 Disperse ash || ----- A Ί *** · ---- Is a ^ save new f, right BCDF Ί melon / state V ^ Li metal particles volume rate after UV exposure 1 conductivity iS / ml ------------ 50 10.6 film-like &lt; [0 ^ 60 15.2 Film-like &lt; 1CM ———.— 70 21.7 Film-like &lt; 10-6 —--------- 丨 丨 丨 丨 丨 丨 80 32.3 Film-like &lt; 1〇 ^ | 匚 90 51.7 pieces The resulting film was heated at 200 ° C; # 1 £ — ^ + The bract was heated for 1 hour, and left to allow the film to return to room temperature, and then the measurement of the inferiority rate was repeated. Repeat the same The results are shown in Table 4. (Please read the precautions on the back before filling in this page) Table 4 Thin film weaving ~ The used liquid 5 6 7h 8 ^ (S / m) The first experiment &lt; 1 0 ~ 6 &lt; 10-6 όχ 10-5 9χ 10-2 2 experiments &lt; 1 0 ~ 6 &lt; 10-6 8χ 1〇 &gt; 5 lx 1 Π-ι 3 experiments &lt; 1 0 ~ 6 &lt; 10-0 1 χ 1 CM 4χ 10-2 i I t · ίι! Λ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs It is known from Table 4 that when the weight ratio of the metal particles of the dispersion 丨 is 80, the film obtained after ultraviolet irradiation and heating shows 10-2S Conductivity at / m. In addition, when 70%, it is known that the conductivity of the film is around 10-4 $ /. When the weight ratio of the metal particles is less than 60%, a good film can be formed, However, the conductivity after heating is 10-6 S / m or less of the lower limit of the measurement of conductivity 1. (Example 3) As in Example 1, metal fine particle dispersions A to D were prepared. In addition, ^ tApplicable to China National Standard (CNS) A4 specification (210 X 297 mm-30 printed by Employee Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 507303 A7 -----------___ B7 V. Description of Invention (29) &quot; —— ——-

According to the same preparation method, the weight ratio of the metal fine particles is 10 to 4 κ to N. The results are shown in Table 5. n I This dispersion was formed between two conductive transparent glass plates (卩 儿, manufactured by Chemical Co., Ltd. under the trade name of "Kojiri, IN ·") with IT0 (tin oxide surface) vapor-deposited. 5 · 5_Thickness, and each conductive transparent glass plate is used as an electrode to directly add electricity to the dispersion. Apply a kV DC voltage to the positive and negative electrodes of the conductive transparent glass plate for 2 hours. Although the current value of any dispersion liquid increased rapidly after the voltage was applied, even after the voltage was applied for 2 hours, it remained below 50 # a. Then, the state of encapsulating the dispersion liquid was maintained, and 160 mW / Cm2 was applied by ultraviolet irradiation. Then, it was left to stand for 20 minutes and subjected to an ultraviolet exposure treatment. This dispersion liquid reacts with ultraviolet rays transmitted through the conductive transparent glass substrate. Each of the dispersion liquids used is a thin film formed by polymerizing and curing two conductive transparent glass substrates. The measurement results of the electrical conductivity of the obtained film are shown in Table 5. Table 5 Dispersion A Β CD Weight of metal fine particles Electrical conductivity after UV exposure (S / m) 50 Thin film 3x 1 CM 60 Thin film 3x 1〇-6 70 Thin film 3x 1〇-5 80 Thin film 5x 1CM dispersion Metal particles weight ratio Electrical conductivity after UV exposure (S / m) κ 10 Film-like &lt; 10-6 L 20 Film-like 1x10-6 Μ 30 Film-like 2χ 1 〇-6 'N 40 Film-like 3x 10-6 Although only Apply voltage to the inside and outside of the conductive transparent glass substrate, and this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -31-.- ^ Packing ------- I- -------- (Please read the precautions on the back before filling in this page) 5. Description of the invention (30)… method to obtain the V electrical rate, but dispersed) The metal particles in the night are dispersed and transformed from uniform sentences In the condensed state, the light penetrability can be judged by visual observation. This is achieved by applying a voltage to the metal fine particles in the dispersion, and the dielectric polarization forms a relaxed chain structure between the electrodes. This chain structure can be judged to be caused by the formation of a three-dimensional mesh structure of the resin component by the use of ultraviolet rays and the polymerization, and at the same time densification, so that the metal particles are closer to each other and connected to each other, thereby forming conductivity. For any of the dispersions A to D, the conductivity of the photopolymerized film is applied without applying a voltage. Although the conductivity is below ICMS / m, the conductivity can be improved if the photopolymerized film is applied after applying a voltage. This shows that "(〗) metal fine particles form a chain structure arranged in a single direction, (2) when the resin component of the media is polymerized, the chain structure will also be densified, (3) The metal particles are closer to and in contact with each other. The effects of (1) to (3) can increase the conductivity in the alignment direction. " In addition, in the direction perpendicular to the alignment direction, since there is no arrangement of metal fine particles, the conductivity will be reduced, and as a result, an anisotropic thin film can be formed. Furthermore, according to this embodiment, a heating process is performed according to the high temperature of the dissolution temperature of the metal particles used, and a thin film having conductivity can be formed by applying a voltage and an ultraviolet exposure process. The description of each embodiment is only one example, and the present invention is not limited to this. The material or structure of each element is only required to achieve the gist of the present invention. [Industrial availability] This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 male f) 507303 A7 ______ B7 --- * --— 一 —_______ 5. Description of the invention (31) Related to the present invention The conductive composition is a conductive composition containing a photo-hardening component and a conductive material, and the structure has a conductivity of 10-4 S / m or more when in a hardened state after light irradiation, so it can be provided. A conductive composition capable of improving manufacturing efficiency in a connection process between electrodes and reducing a defective rate of a product. (Please read the precautions on the back before filling this page) · II ί! I Order ------- ^ Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-33- This paper size applies to Chinese National Standards (CNS) A4 size (210 X 297 mm)

Claims (1)

507303 Patent Application No. 9〇1134〇7 ^ Amendment to the scope of patent application ^ Revision date: July 6, 1991, the scope of patent application in January, g ^ is a conductive composition containing light The hardened component and the electrical composition 'have a conductivity in a hardened state after being irradiated with light. 2 · The conductive composition according to item 1 of the scope of patent application, wherein the conductivity in the uncured state is ≧ 0-7S / m or more. 3 · As described in the first patent application for the conductive composition, further, after hardening after light irradiation or during hardening, use a heating environment of 15 CTC or higher to make the hardened conductivity 10- 2S / m or more. 4. The conductive composition according to any one of claims 1 to 3 in the scope of the patent application, wherein the light for curing the photo-hardening component contains at least visible light, ultraviolet light, X-rays, electron beams, laser light, The light component of one of the infrared rays. 5. The conductive composition according to any one of claims 彳 to Liao, in which the photohardening component in the conductive composition is 15 to 85 parts by volume, and the conductive material component is 85 to 1 5 servings. 6. The conductive composition according to any one of claims 1 to 3 in the scope of application for a patent, wherein the photo-hardening component is in a slightly flaky or thin film state in an unhardened state. 7. The conductive composition as described in any one of the scope of the application for patents, wherein the photocuring component is in an emulsified or pasty state in an uncured state. 8. The conductive composition according to any one of claims 1 to 3 in the scope of application for a patent, wherein the conductive material is particulate. 9 · As for the conductive composition as described in any one of the scope of the application for patents, the paper size is applicable to the Chinese National Standard (CNS) A4 specification (21 × 297 mm): h, ...丨 丨 «^: (Please read the precautions on the back before filling out this page) -Order- # Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs-34- Wai Fanli, please call ABCD, where the conductive material is in line Like or columnar. 10. The conductive composition according to any one of item 9 in the scope of the patent application, wherein the linear or columnar conductive material extends in a direction of a gap between electrodes to be connected. 1 1 · A method for manufacturing an electrode is to contact the second electrode with the second electrode, and contact the conductive composition of any one of items 1 and Q in the scope of patent application, and then approximately equivalent to the first electrode A part of the conductive composition is hardened by irradiating light, and then the non-hardened conductive composition is removed, so that the hardened conductive composition remains on the first electrode. 12 · Method for manufacturing an electrode In order to contact the second electrode with the "conducting conductive composition of any one of the scope of application patents" to "10," the second electrode should be connected to the second electrode, and then a portion that is approximately equivalent to the second electrode should be excluded, and the rest of the The conductive composition is cured by irradiating light, and then the cured conductive composition is removed to leave an uncured conductive composition on the first electrode. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Cooperative 13 · —A method for manufacturing printed circuit boards, which is provided with a printed circuit board and should be connected to the second electrode of the second electrode and contact any one of the scope of patent applications 1 ~ The conductive composition of the item is then cured by irradiating light with the conductive composition approximately equivalent to that of the first electrode, and then the uncured conductive composition is removed to make the cured conductive composition. A substance remains on the first electrode. 14. · A method of manufacturing a printed circuit board 'is to contact a first electrode provided with a printed circuit board and should be connected to a second electrode' contact application patent scope 11 〇-35- This paper standard applies to China National Standard (CNS) A4 (210X297 mm) 507303 A8 B8 C8 D8, the conductive composition of any one of the scope of the patent application, and then the portion approximately equivalent to the first electrode is excluded, and the rest of the conductive composition is hardened by irradiation with light. The hardened conductive composition is removed, so that the non-hardened conductive composition remains on the first electrode. 1 ··· An electrode connection method is a residual conductive composition on the first electrode prepared in accordance with the method of item 1 or item 12 of the scope of the patent application. A structure in which the conductive composition is heated and / or the first or second electrode is pressed against the conductive composition to form an electrical connection between the first and second electrodes. 16 · —A method for connecting electrodes of a printed circuit board is a state in which the conductive composition on the first electrode remaining in contact with the second electrode is prepared in accordance with the method of item 13 or item 14 of the scope of patent application. Next, the conductive composition is heated, and / or the first or second electrode is pressed against the conductive composition, so that the first and second electrodes are electrically connected to each other. 1 7. —A method of connecting electrodes, in which the first electrode is brought into contact with the conductive composition of any one of the items 1 to 10 of the scope of patent application, and then the conductivity of a portion approximately equal to that of the first electrode The composition is hardened by irradiating light, and then the non-hardened conductive composition is removed, and then the second electrode is brought into contact with the hardened conductive composition, and in this state, the hardened conductive composition Heating and / or pressing the conductive composition with the first or second electrode. 1 8 · —A method of connecting electrodes. The first electrode is brought into contact with the conductive composition according to any one of claims 1 to 0 of the scope of patent application. The conductive composition is irradiated with light and the size of the paper is in accordance with Chinese National Standard (CNS) A4 (210X297 mm) -36 _ 507303 A8 B8 C8 ___D8 6. After the application for patent scope, remove the hardened conductive The second electrode is brought into contact with the conductive composition on the remaining first electrode, and in this state, the conductive composition is heated and / or pressed by the first or second electrode Conductive composition. 19. An electrode 'is a conductive composition having a spot-shaped conductive material containing a photochemical component on the surface, and a lightning conductivity in a hardened state after photo-ejection (盍 04S / m). 20. The electrode according to item 19 of the scope of patent application, wherein the conductive composition provided on the surface is hardened by light. 21-The electrode according to item 19 of the scope of patent application, wherein the conductive composition provided on the surface is in a state before being hardened by light. 22. —A printed circuit board with a lightning conductivity of lQ .: 4S / m or more with a lightning conductivity helmet with a light conductivity on the surface-conductive material and a hardened state after light irradiation Composition electrode. 23 · —A method of manufacturing an electrode is to contact the conductive composition of any of the items 1 to 0 of the patent application scope with the second electrode to be connected to the second electrode, and then approximately equal to that of the first electrode Part of the conductive composition is cured by irradiating light, and then the non-hardened conductive composition is removed from the printed product of the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, so that the cured conductive composition remains in the first Electrode. 24. The method for manufacturing an electrode according to item 23 of the scope of the patent application, wherein the conductive composition is coated on the first electrode using a printing method or a spreading method and contacts the first electrode. 25 · A method of connecting electrodes is based on the 23rd method of the scope of patent application. This paper is also applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) _ 37-507303 A BCD 6. Scope of patent application The conductive composition remaining on the first electrode is heated by the conductive composition and / or pressed against the conductive composition by the first or second electrode in a state of contact with the second electrode, A structure that electrically connects the first and second electrodes is formed. 26. A conductive composition is a conductive composition containing a light-hardening component and a conductive material, and the conductivity when the voltage is applied to the conductive composition and cured by irradiation with light is [CHS / m]. 27. The conductive composition according to item 26 of the patent application scope, wherein the conductive material is metal particles. 28. A method for manufacturing an electrode is to contact the conductive composition of the 26th or 27th patent application range with the second electrode to be connected to the second electrode. The conductive composition is applied with an electric field, and then the conductive composition is irradiated with light to be hardened, so that the hardened conductive composition remains on the first electrode. 29. If the method for manufacturing an electrode according to item 28 of the patent application scope, the conductive composition is coated on the first electrode by a printing method or a spreading method, and contacts the first electrode. Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of the People's Republic of China 30 · —A method of manufacturing electrodes, which is to connect the first electrode connected to the second electrode to the conductive composition in the 26th or 27th of the patent application ' The conductive composition, which is approximately equivalent to the part of the first electrode, is applied with an electric field, and then the conductive composition is irradiated with light to be cured, and then the non-cured conductive composition is removed to harden the cured composition. The used conductive composition remains on the first electrode. 31 · —A kind of electrode manufacturing method, which is the n or the item in the scope of patent application] 2 -38-This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) 507303 A8 B8 C8 D8 6. In the method for manufacturing an electrode for which a patent application is applied, after the conductive composition is brought into contact with the first electrode, the conductive composition is heated or hardened before being irradiated with light to harden the conductive composition. Light is radiated to perform preliminary hardening of the conductive composition. 32. The conductive composition according to item 6 of the scope of application for a patent, wherein the sheet-like or film-like shape is on both sides or one side of the conductive composition, and is supported by a protective film to make the conductive composition. Retentive state. (Please read the precautionary page on the back first) Order. # · Printed by a member of the Intellectual Property Bureau of the Ministry of Economic Affairs and a Consumer Cooperative. This paper size applies to China National Standard (CNS) A4 (210X297 mm) _ 39-