TW495415B - Semiconductor wafer, polishing apparatus and method - Google Patents

Semiconductor wafer, polishing apparatus and method Download PDF

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Publication number
TW495415B
TW495415B TW089126752A TW89126752A TW495415B TW 495415 B TW495415 B TW 495415B TW 089126752 A TW089126752 A TW 089126752A TW 89126752 A TW89126752 A TW 89126752A TW 495415 B TW495415 B TW 495415B
Authority
TW
Taiwan
Prior art keywords
wafer
polishing
patent application
cassette
grinding
Prior art date
Application number
TW089126752A
Other languages
English (en)
Chinese (zh)
Inventor
Peter D Albrecht
Ezio Bovio
Paride Corbellini
Marco Morganti
Giovanni Negri
Original Assignee
Memc Electronic Materials Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials Spa filed Critical Memc Electronic Materials Spa
Application granted granted Critical
Publication of TW495415B publication Critical patent/TW495415B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW089126752A 2000-11-21 2000-12-14 Semiconductor wafer, polishing apparatus and method TW495415B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IT2000/000471 WO2002042033A1 (en) 2000-11-21 2000-11-21 Semiconductor wafer, polishing apparatus and method

Publications (1)

Publication Number Publication Date
TW495415B true TW495415B (en) 2002-07-21

Family

ID=11133584

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089126752A TW495415B (en) 2000-11-21 2000-12-14 Semiconductor wafer, polishing apparatus and method

Country Status (7)

Country Link
US (1) US7137874B1 (enExample)
EP (1) EP1335814A1 (enExample)
JP (1) JP2004520705A (enExample)
KR (1) KR20040011433A (enExample)
CN (1) CN1461251A (enExample)
TW (1) TW495415B (enExample)
WO (1) WO2002042033A1 (enExample)

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* Cited by examiner, † Cited by third party
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TWI448356B (zh) * 2006-11-22 2014-08-11 應用材料股份有限公司 定位環、用於向定位環施加負載的撓性膜以及定位環組件
TWI554360B (zh) * 2006-11-22 2016-10-21 應用材料股份有限公司 用於硏磨頭的夾持環

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US7218983B2 (en) * 2003-11-06 2007-05-15 Applied Materials, Inc. Method and apparatus for integrating large and small lot electronic device fabrication facilities
DE102004005702A1 (de) * 2004-02-05 2005-09-01 Siltronic Ag Halbleiterscheibe, Vorrichtung und Verfahren zur Herstellung der Halbleiterscheibe
US7150673B2 (en) * 2004-07-09 2006-12-19 Ebara Corporation Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
US8192248B2 (en) * 2008-05-30 2012-06-05 Memc Electronic Materials, Inc. Semiconductor wafer polishing apparatus and method of polishing
JP5038259B2 (ja) * 2008-08-26 2012-10-03 株式会社日立ハイテクノロジーズ クリーニング装置およびクリーニング方法
KR101057228B1 (ko) 2008-10-21 2011-08-16 주식회사 엘지실트론 경면연마장치의 가압헤드
KR101022277B1 (ko) * 2009-02-25 2011-03-21 그린스펙(주) 실리콘 베어 웨이퍼 연마장치용 캐리어 헤드
JP5635957B2 (ja) * 2010-09-09 2014-12-03 日本碍子株式会社 被研磨物の研磨方法、及び研磨パッド
US8545290B2 (en) * 2010-12-08 2013-10-01 Edmond Arzuman Abrahamians Wafer polishing apparatus and method
US9199354B2 (en) * 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
FR3001169B1 (fr) * 2013-01-24 2016-02-12 Airbus Operations Sas Dispositif d'assistance pour manipuler un outil de poncage
CN103203683B (zh) * 2013-03-13 2015-02-18 大连理工大学 一种浮动抛光头
JP7250311B2 (ja) * 2016-04-01 2023-04-03 モ カン，ジューン 基板収容部材を備える化学機械的な研磨装置用のキャリアヘッド
US10541165B2 (en) * 2016-11-10 2020-01-21 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port backplane
CN106891244A (zh) * 2017-03-01 2017-06-27 天津华海清科机电科技有限公司 抛光头
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
JP7287761B2 (ja) 2018-07-31 2023-06-06 株式会社荏原製作所 球面軸受の軸受半径決定方法
KR101966017B1 (ko) * 2018-09-13 2019-04-04 오민섭 반도체소자의 불량분석을 위한 그라인딩 제어 방법 및 장치
CN110355664B (zh) * 2019-07-17 2021-10-12 广州创研智能科技有限公司 一种打磨装置
CN110587469A (zh) * 2019-09-29 2019-12-20 苏州光斯奥光电科技有限公司 一种用于液晶面板的研磨机构
CN110653720B (zh) * 2019-09-29 2021-05-28 福建北电新材料科技有限公司 抛光器件及其制备方法、抛光方法以及半导体器件
WO2022132310A1 (en) * 2020-12-18 2022-06-23 Applied Materials, Inc. Pad carrier for horizontal pre-clean module
CN112757137B (zh) * 2021-03-02 2025-04-22 核工业理化工程研究院 全自动磨抛机抛光盘型试样的辅助夹具
CN115101459B (zh) * 2022-06-16 2025-05-13 华海清科股份有限公司 晶圆装卸装置及化学机械抛光系统
CN115592559B (zh) * 2022-10-10 2026-07-31 金华博蓝特新材料有限公司 晶片研磨装置
CN116394093A (zh) * 2023-05-29 2023-07-07 宁波芯丰精密科技有限公司 自适应调整抛光头以及抛光装置
CN117506566B (zh) * 2023-10-31 2026-03-06 北京创思工贸有限公司 碳化硅零件加工方法
CN117260407B (zh) * 2023-11-20 2024-03-12 铭扬半导体科技(合肥)有限公司 一种抛光设备的检测方法
CN117602826A (zh) * 2023-12-15 2024-02-27 江苏铁锚科技股份有限公司 一种硅酸盐玻璃及其表面抛光工艺
CN118162984B (zh) * 2024-05-15 2024-09-17 河北霞文红外材料科技有限公司 一种用于氟化镁球罩的球面洗磨机
CN120095665A (zh) * 2024-12-31 2025-06-06 华海清科股份有限公司 一种晶圆边缘抛光系统

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JPH079896B2 (ja) * 1988-10-06 1995-02-01 信越半導体株式会社 研磨装置
US5377451A (en) 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5605487A (en) 1994-05-13 1997-02-25 Memc Electric Materials, Inc. Semiconductor wafer polishing appartus and method
US5762544A (en) * 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US5738568A (en) 1996-10-04 1998-04-14 International Business Machines Corporation Flexible tilted wafer carrier
US5791978A (en) 1996-11-14 1998-08-11 Speedfam Corporation Bearing assembly for wafer planarization carrier
US5957751A (en) 1997-05-23 1999-09-28 Applied Materials, Inc. Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US5916015A (en) 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
US5899798A (en) 1997-07-25 1999-05-04 Obsidian Inc. Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing
JPH11204615A (ja) * 1998-01-19 1999-07-30 Speedfam Co Ltd ローディングロボットのウェーハローディング、アンローディング機構
JP3467184B2 (ja) 1998-02-05 2003-11-17 信越半導体株式会社 ワークの研磨方法
JP3664593B2 (ja) * 1998-11-06 2005-06-29 信越半導体株式会社 半導体ウエーハおよびその製造方法
US6068549A (en) 1999-06-28 2000-05-30 Mitsubishi Materials Corporation Structure and method for three chamber CMP polishing head
US6755723B1 (en) * 2000-09-29 2004-06-29 Lam Research Corporation Polishing head assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448356B (zh) * 2006-11-22 2014-08-11 應用材料股份有限公司 定位環、用於向定位環施加負載的撓性膜以及定位環組件
TWI554360B (zh) * 2006-11-22 2016-10-21 應用材料股份有限公司 用於硏磨頭的夾持環

Also Published As

Publication number Publication date
KR20040011433A (ko) 2004-02-05
JP2004520705A (ja) 2004-07-08
EP1335814A1 (en) 2003-08-20
CN1461251A (zh) 2003-12-10
US7137874B1 (en) 2006-11-21
WO2002042033A1 (en) 2002-05-30

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