TW200922745A - Grinding head, grinding device, and the peeling off method for work piece - Google Patents

Abstract

The present invention provides a grinding head 11, which includes: a disc-like bracket 13, which has forms a ring-shaped protruding portion 13a and latching portion 13b of bracket in a peripheral portion thereof; a disc-like grinding head main body 12, which forms a ring-shaped latching portion 12a of the grinding head main body in an outer side thereof; a separation membrane 14, which is connected with the grinding head main body and the bracket; and a spacer 15, which is mounted to a portion of the latching portion of the bracket and/or latching portion of the grinding head main body, and located between the latching portion of the bracket and the latching portion of the grinding head main body. When the grinding head main body is raised, the latching portion of the bracket and/or the latching portion of the grinding head main body is put into contact with the spacer, so as to make the bracket inclined and lifted to peel off a work piece W from the grinding cloth. Therefore, the present invention provides a grinding head, which can raise the grinding head that carries the work piece and peel off the work piece from the grinding cloth easily, safely and accurately without forming troughs in the grinding cloth or making the grinding head protrude from the turntable.

Description

200922745 IX. Description of the Invention: [Technical Field] The present invention relates to a polishing head, a polishing apparatus having the same, and a method of peeling a workpiece from a polishing cloth, which is used when grinding a surface of a workpiece To keep the back of the workpiece. [Prior Art] As a device for polishing the surface of a semiconductor wafer such as a germanium wafer, a single-side polishing device for polishing a wafer on one side and a surface polishing device for simultaneous double-side polishing are used. A general single-side polishing apparatus, for example, as shown in Fig. 10, is composed of a turntable (platform) 73 to which a polishing cloth 74 is bonded, an abrasive supply mechanism 76, a polishing head 726, and the like. In the polishing apparatus 71, the wafer W is held by the polishing head 72, and the polishing agent 7 is supplied from the abrasive supply unit 76 to the rubbing cloth 74, and the turntable 73 and the polishing head 72 are each rotated. The polishing is performed by sliding the surface of the circle W into contact with the polishing cloth 74. As a method of holding the workpiece, there is a method of attaching a workpiece to a flat disk-shaped plate with an adhesive such as wax, a method of hydrating using a soft pad (pad), and a method of vacuum adsorption. Fig. 11 is a view showing an example of a polishing head for holding a workpiece using a spacer. The polishing head 91 is a gasket 95 made of urethane or the like on the bottom surface of a disk-shaped holder 92 made of ceramics or the like, and the gasket 95 is made to absorb moisture to hold the workpiece W by surface tension. Further, in order to prevent the workpiece W from falling off from the bracket 92 during the grinding, a ring-shaped grinding is provided around the bracket 92 to double the grinding and grinding the crystal to cover the grinding mold 5

200922745 Board 94. Use a grooveless flat abrasive cloth, especially when grinding a large-diameter workpiece such as an early crystal dicing wafer of a diameter house. 'The workpiece is ground to raise the polishing head and the workpiece is to be peeled off from the polishing cloth. The surface tension adheres to the surface of the polishing cloth, which may cause problems in the residual cloth. Further, excessively increasing the adsorption of the polishing head to the workpiece causes a problem that the load of the turntable is applied to the bearing of the fixed turntable. In order to solve this problem, a method of forming the adsorption force of the groove weak abrasive cloth on the side of the polishing cloth or a method of raising the polishing head after the polishing head is removed from the turntable (hereinafter referred to as a protruding method) can be employed. JP-A-200 1 -340 1 70) and the like. However, when the polishing cloth is formed into a groove, the rotation of the polishing cloth may cause wrinkles on the surface of the workpiece, or the workpiece may be damaged due to the groove portion being caught by the workpiece, or the quality may be caused by the peripheral sag. Because it is necessary to ensure a space in which the polishing head protrudes, there is a problem that the size becomes large. SUMMARY OF THE INVENTION Therefore, in view of such a problem, an object of the present invention is to provide a polishing head which can raise a polishing head holding a workpiece without having to form a groove in the polishing cloth or to protrude the polishing head from one end. The workpiece is completely and reliably peeled off from the polishing cloth. After 300 sec, that is, when the workpiece is left under the force of research, the upper part of the workpiece is reduced, for example, printed, and the edge will be & Also, there is a device for the convenience of a turntable 6

200922745 The present invention has been made in order to solve the above problems, and is characterized in that at least the support for holding the back surface of the workpiece has an annular projection in which an annular projection projecting upward is formed in a peripheral portion thereof. a latching portion; the polishing head body frame is simultaneously rotatable, and an annular polishing head body latching portion extending outwardly from the space portion is formed on the inner side; and the polishing head body and the bracket are separated, and the bracket is closed at the same time When the surface of the workpiece is brought into contact with the turntable for polishing, the back surface is held by the bracket in a state in which the pressure in the sealed space portion is adjusted by being connected to the space portion, and the workpiece is When the polishing head rises to peel the workpiece from the polishing cloth, the head body rises, and the bracket latch portion latches the front lock portion and rises to peel the workpiece from the polishing cloth with a spacer. a part of the latch body and the body latching portion located between the bracket latch latches, and when the polishing head body is raised to peel off the rubbing cloth, The main body upper latching portion and/or the polishing head main body latching portion 舆the above-mentioned bracket is inclined and lifted, and the workpiece can be polished from the polishing cloth by using the polishing head before, and then the workpiece can be peeled off from the polishing cloth. It is easy to provide a pressure-reducing mechanism which is a disc-shaped portion and a portion from which the projection portion is used to hold the holder, and a film is formed on the outer side, and the polishing cloth which is densely connected to the space portion of the main body is slidably connected. After the workpiece is ground, the grinding head is latched by the polishing head body, and the workpiece is lifted and raised by the polishing head body and the polishing head body. Abutting, the polishing cloth is peeled off. The workpiece is ground safely and reliably peeled off the 7 200922745 workpiece from the polishing cloth. Further, since the inclination angle at the time of raising the polishing head can be adjusted by adjusting the thickness of the spacer, the inclination angle of the polishing head can be adjusted by a simple operation. Further, there is no possibility that the quality of the surface to be polished of the workpiece is deteriorated by, for example, the method of forming the groove in the polishing cloth, and the case where the polishing device must be enlarged, for example, in the case of using the protruding method.

At this time, it is preferable to provide a spacer on the surface of the bracket for holding the back surface of the workpiece. Thus, when the lining is provided on the surface of the bracket for holding the back surface of the workpiece, the workpiece can be more reliably held in the bracket. Therefore, when such a polishing pad is used, the workpiece can be more reliably peeled off from the polishing cloth. Further, the bracket can hold a semiconductor wafer as the workpiece having a diameter of 300 mm or more. In this way, even if the carrier is a semiconductor wafer as a workpiece having a diameter of 300 mm or more which is strongly adhered to the polishing cloth after polishing, the polishing head according to the present invention can be used easily, safely and reliably. The workpiece is peeled off from the polishing cloth. Moreover, the present invention provides a polishing apparatus which is a polishing apparatus used for polishing a surface of a workpiece, characterized in that it comprises at least: a polishing cloth attached to a turntable; and an abrasive supply mechanism for supplying an abrasive to the polishing cloth. And the aforementioned polishing head of the present invention is used as a polishing head for holding the aforementioned workpiece. As described above, the polishing apparatus having the polishing head of the present invention is used to perform the grinding process. When the workpiece is peeled off from the polishing cloth after polishing, the workpiece can be completely and reliably peeled off from the polishing cloth. Further, for example, the method of forming the groove in the polishing cloth causes the shape of the surface to be polished to be deteriorated, and the case where the device must be grounded, for example, in the case of using the protruding method, does not occur. At this time, it is preferable to have a position adjustment mechanism for automatically adjusting the stop position of the grinding rotation. Q. When the adjustment mechanism for automatically adjusting the stop position of the rotation of the polishing head is provided, the wafer can be easily placed at the rotational position that is easily peeled off, and the rotational position of the polishing head can be stopped at an appropriate position. The polished wafer is peeled off. Further, the present invention provides a method for peeling a workpiece by first trimming the polishing cloth on the turntable, and sliding the surface of the workpiece into contact with the entire polishing cloth to perform polishing, and then peeling the workpiece from the polishing cloth. The polishing head of the present invention is used to maintain the above-described polishing, so that the position of the spacer is located at 30 with respect to the center of the preceding C/grinding head to the center of the polishing cloth. The polishing head is stopped by the rotation of the inner portion, and the polishing head body is raised at the rotation position to peel the workpiece. Thus, the dressing of the polishing cloth is first performed, and the surface grinding of the workpiece is performed using the grinding of the present invention, after the workpiece is ground so that the spacing position is relative to the center from the polishing head to the center of the polishing cloth. By rotating the position, the polishing head stops rotating, and when the workpiece is peeled off from the polishing cloth, the workpiece can be easily and safely and reliably produced with a large quality head position angle. Due to the surface of the workpiece that has been repaired, the position of the grinding head is 3 〇. I will peel off the work from the research 9 200922745. Further, there is no possibility that the method of forming the groove in the polishing cloth causes the quality of the surface to be polished of the workpiece to be deteriorated, and the case where the polishing device must be enlarged, for example, when the protruding method is employed.

According to the polishing head of the present invention, when the workpiece is peeled off from the polishing cloth after the workpiece is polished, the quality of the surface to be polished of the workpiece is not deteriorated, and the workpiece can be easily and safely and reliably peeled off from the polishing cloth. Further, since the inclination angle at the time of raising the polishing head can be adjusted by adjusting the thickness of the spacer, the inclination angle of the polishing head can be adjusted by a simple operation, and the peeling condition of the wafer can be easily adjusted. Further, after the trimming, the workpiece is polished by using the polishing head of the present invention, and after the workpiece is ground, the rotating position of the polishing head is stopped so that the spacer is near the center of the turntable, and the workpiece is removed from the polishing cloth. At the time of peeling, the workpiece can be easily and safely and reliably peeled off from the polishing cloth. [Embodiment] Hereinafter, the present invention will be described in detail. As described above, when a large-diameter workpiece is polished using a grooveless polishing cloth, after the workpiece is polished, even if the polishing head is raised and the workpiece is to be peeled off from the polishing cloth (also called separation, peeling off), the workpiece after grinding will be There is a problem of sticking to the surface of the polishing cloth and remaining on the polishing cloth. In order to solve such a problem, the inventors of the present invention have conducted intensive studies on a method in which a workpiece can be easily peeled off from a polishing cloth without a method of forming a groove in a polishing cloth or a protruding method. Therefore, the inventors found that the grinding head for holding the workpiece is raised 10 200922745

In the case where a specific region of the workpiece holding surface of the back surface of the holder (the surface opposite to the surface to be polished) is held in a concentrated manner, the workpiece can be peeled off by applying a force to incline and raise it. Further, the inventors of the present invention found that when the dressing is performed by a usual method, the center of the polishing cloth is lower than the periphery and has a concave shape. Further, when the workpiece is peeled off from the polishing cloth after polishing, it is possible to more easily peel the workpiece from the polishing cloth by applying a force to the vicinity of the center concave portion of the polishing cloth to peel the workpiece from the polishing cloth. The present invention has been completed by optimizing various conditions. Hereinafter, the polishing head and the polishing apparatus of the present invention will be specifically described with reference to the accompanying drawings, but the present invention is not limited thereto. Fig. 1 is an example (first aspect) of the polishing head of the present invention. The polishing head 11 of the present invention is provided with a spacer 15 as will be described later. First, a schematic configuration will be described. The polishing head 11 has a polishing head body 12, and a space portion 18 is formed inside the polishing head body 12. The polishing head main body 12 is rotatable, and a through hole 20 for pressure adjustment is provided at the center of the upper portion for communicating the pressure adjusting mechanism 19. In the polishing head main body 12, a disc-shaped bracket 13 which is concentrically arranged is connected by a diaphragm 14. By the connection of the diaphragm 14, the grinding head body 12 holds the bracket 13 while the space portion 18 of the polishing head body 12 is sealed. The polishing head main body 12 can be moved up and down by a means for moving up and down, not shown. The bracket 13 is for holding the back surface of the workpiece W (the surface opposite to the side to be polished), and for example, the holding surface is smooth, high in rigidity, and does not cause the workpiece 11

For the metal polluter of 200922745, it is suitable to use a circular plate made of ceramics such as alumina, and it is also possible to use various brackets such as a rubber chuck bracket to be described later, and to support the entire back surface of the workpiece W, the work of the bracket 13 The holding surface is preferably the same diameter as the ground workpiece W, or a little larger. The separator 14 is preferably made of a material having high elasticity such as an elastomer or a rubber. Each of the separators 14 made of a material is fixed to the polishing head main body 12 and the bracket 13 by bolts or the like, and the air 18 of the polishing head main body 12 is sealed. In the polishing head body 12, an outwardly projecting annular head body latching portion 1 2 a is formed on the outer side. Further, a peripheral protruding portion 13a and a bracket latching portion 13b projecting are formed in the peripheral portion of the bracket 13. The outer diameter of the polishing head lock portion 1 2 a is larger than the inner diameter of the bracket latch portion 1 3 b, and the polishing body latch portion 1 2 a and the bracket latch portion 13 3 b are provided without a spacer. As shown in Fig. 9, in order to peel the workpiece from the polishing cloth and raise the polishing body 12, they are latched on the annular abutting surface. Since the spacer 15 is provided on the upper surface, a small gap area is left between the lapping portion 1 2 a of the lapping head body latch portion 1 2 a, and is not shown in the drawing. Moving up and down, the inner diameter of the projection 1 3 a of the bracket is larger than the outer diameter of the head portion 1 2 a of the polishing head body, and protrudes to a position higher than the head portion 1 2 a of the head body. The inner portion of the outer portion 1 3 a of the bracket 1 3 does not necessarily have to be flat, and may have a convex shape in the space portion 18 of the grinding head main body 1 2 . In order to achieve such a position and the like for the polishing head body 12 and the bracket 13. 〇 保 保 保 保 保 保 保 保 保 保 由此 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨 研磨The output must be made in a manner similar to that shown in the first aspect, for example, but it is not limited thereto.

First, the bracket 13 is separately prepared by the first assembly 13c composed of a portion of the annular projection 13a and the portion of the bracket latch portion 13b, and further consists of a disk portion. The second component 1 3 d (Fig. 12 (a)). Next, the polishing head main body 12 in which the separator 14 is fixed by bolts or the like is disposed above the second assembly 134d (Fig. 12(b)). Next, the first assembly 1 3 c is fixed to the second unit 13 d from above by a bolt or the like as a bracket 13 (Fig. 12(c)). Further, the diaphragm 14 can be fixed to the bracket 13 by using the same bolts as the first unit 13c and the second unit 13d. Moreover, the connection of the bracket 13 and the polishing head main body 12 through the diaphragm 14 is as shown in Fig. 1, and when the protruding portion 13a of the bracket 13 is coupled to the polishing head body latching portion 1 2 a, The structure can be relatively simple, but is preferable, but is not limited thereto. It is preferable to provide the spacer 17 in the surface (holding surface) of the bracket 13 that holds the back surface of the workpiece W. For example, the foamed polyurethane spacer 17 is fixed by using a double-sided adhesive tape or the like. By providing such a gasket 17 and making it watery, the workpiece W can be reliably held by the surface tension of the water contained in the gasket 17. A template 16 may be provided on the outer peripheral portion of the bracket 13, that is, on the outer side of the workpiece holding surface. The template 16 is provided to hold the edge portion of the workpiece W and to protrude downward along the outer peripheral portion of the bracket 13. The template 16 holds the edge portion of the workpiece W in the grinding to prevent the workpiece W from falling off the bracket 13 and does not push the polishing cloth 22 on the other hand. The material of the template 16 is softer than the workpiece W so as not to contaminate the workpiece W and does not cause scratches or indentations.

200922745 The material is better. In order to prevent the polishing cloth 22 from being pressed and pressed during polishing, the polishing cloth may be deformed, and a coating ring may be provided around the template 16. The coated ring is preferably free from metal contamination of the workpiece W, and the wear of the polishing cloth 22 is minimal. For example, the polishing head 11 of the present invention having a ring structure having such a rough configuration can be suitably used, and as shown in the female figure, at least a part of the bracket latch portion and the polishing head body latch portion are at least placed on the tray. The spacer 15 is provided in such a manner that the holder latch portion and the polishing head body latch portion are provided. Further, as shown in Fig. 2, the spacer 15 is attached to a part of the bracket latch portion 1 3 b as viewed from above. If the material of the spacer is rigid and is not easily denatured, the size of the spacer 15 can be any unsafe when the head latch portion 12a abuts, and can be any size, for example, the bracket latch The inner diameter of the lock is about 1 / 1 0. Further, the cross-sectional shape of the spacer 15 may be any shape if it is located between the bracket latch portion 13b and the head body latch portion 1 2 a. For example, as shown in Fig. 1, the shape of the lock portion 13b may be sandwiched, and if it is fixed from the upper surface by using a bolt or the like, it is not limited thereto. The thickness of the spacers 15 is appropriately adjusted so as to be, for example, an inclination angle of 0·1 to Γ when the bracket 13 is tilted as will be described later. To be simpler, it is preferable that the thickness of the spacer 15 is adjusted to be appropriately exchanged in advance with various spacers. Since the spacer 15 is not in contact with the polishing head body latch name when the workpiece is polished, the same as the polishing head 1 1 not having the spacer 15 and 22 concave material causes the first side of the crucible 3, Matter 15. At least p 13b is generated at the same time, and the thickness of the holder is inclined. Since the thickness i [5 12a can be 14 200922745, the same polishing as that of the conventional polishing head 11 is performed, and the polishing quality of the workpiece is not problematic. Fig. 1 is a view showing the second aspect of the polishing head of the present invention, showing that the holder is a rubber chuck holder.

The polishing head 61 is mainly composed of a polishing head main body 12 and a rubber chuck bracket 62 which is obtained by joining the polishing head body 12 and the diaphragm 14 using a diaphragm 14. By the connection of the diaphragm 14, the polishing head body 12 holds the rubber chuck holder 62, and the space portion 18 of the polishing head body 12 is sealed, and the pressure adjustment is provided at the center of the upper portion of the polishing head body 12. The through hole 20 is for communicating with the pressure adjusting mechanism 19 as in the case of the first aspect described above. The rubber chuck holder 62 includes an upper bracket unit 63 and a rubber 65 which is fixed by a ring-shaped rigid ring 64 made of a rigid material such as SUS (stainless steel) and has a flat bottom surface. The holding surface of the workpiece W is the bottom surface of the rubber 65. Further, a workpiece pressurizing chamber 66 is provided on the opposite side of the rubber knee 65, and the workpiece pressurizing chamber 66 is supplied with fluid by the fluid supply path 68 of the pressure adjusting mechanism 67. In the workpiece pressurizing chamber 66, the pressure air is supplied by the pressure adjusting mechanism 67 and the pressure is uniformly applied to the rubber 65, so that the workpiece W can be pressed against the polishing cloth 22 on the turntable 21 with a uniform pressure. Further, the pressure adjusting mechanism 67 can suck the workpiece W onto the rubber 65 by evacuating the workpiece pressurizing chamber 66. Further, a spacer 17 is provided on the bottom surface of the rubber 65, and the workpiece W can be adsorbed by the spacer 17. Further, the template 16 can be further provided. The upper bracket assembly 633 is formed with a protruding portion 633a and a bracket latching portion 633b, and is similar to the first aspect, in the bracket latching portion 633b and the grinding 15

200922745 A part of at least one of the head body latching portion 1 2 a, and a component 15 between the latching portion 633b and the polishing head body latching portion 1 2 a. In addition to the rubber chuck holder having the typical structure as described above, various well-known rubber chuck holders can be employed. Fig. 3 is a view showing an example of an example of the polishing head 11 3 1 of the present invention. The polishing apparatus 3 1 includes a polishing cloth 22 attached to the turntable 21 and a supply mechanism 3 6 for supplying the abrasive 35 to the polishing cloth before polishing the workpiece W using the polishing apparatus 31. Trimming of the abrasive cloth 22. This trimming is performed by a usual dresser as shown in Fig. 7(a). In general, a dresser that is larger than the workpiece W to be polished is in a sliding contact with the workpiece W when the workpiece W is polished, for example, the outer diameter t of the abutting portion with the polishing cloth 22 is slightly larger, and the inner diameter ratio is larger. The radius of the turntable 2 1 is small (4). For example, when a millimeter-sized silicon wafer is drilled using a rotary disk having a diameter of 800 mm, the outer diameter of the abutting portion of the polishing cloth is about 380 mm. The wheel dresser is rotated as a state in which the i-wheel dresser 41 is trimmed and brought into contact with the polishing cloth 22. At this time, the wheel dresser 41 may be rotated in the diameter direction of the disk 21, and the wheel dresser 4 1 may be shaken in such a manner that the rocking amplitude is the radius of the turntable. As described above, the inventors of the present invention have found that the polishing head 11 and the polishing agent 22 are provided by the polishing apparatus which is usually provided with a spacer other than the spacer. It is first carried out, usually, to at least trim the ring of the turntable 21 to grind the diameter of 3 0 0 410 mm, g, in the fixed sand, so that the turntable 2 1 ., can also be rotated about 1/10修16 200922745 In full time, as shown in Fig. 7(b), the center of the polishing cloth is lower than the surrounding and becomes a concave shape. Further, Fig. 7(b) is a view showing the height distribution of the polishing cloth in the radial direction of the turntable. The two curves in the figure are the height distributions of the polishing cloths indicating the directions orthogonal to each other in the top surface of the turntable. This is considered to be because the trimming contact time of the dressing is longer in the vicinity of the center of the polishing cloth than in the periphery when the dressing is performed by the dresser.

After the refurbishment in the usual manner, the workpiece W is polished using the polishing apparatus 31 having the polishing head 11 of the present invention. The workpiece W is polished by the polishing apparatus 31. First, the water-containing spacer 17 is attached to the workpiece W, and the back surface of the workpiece W is held by the holder 13 while the edge portion of the workpiece W is held by the template 16. Then, the polishing agent 35 is supplied from the polishing agent supply unit 36 to the polishing cloth 22, and the polishing head 11 and the turntable 21 are each rotated in a predetermined direction to slide the workpiece W into contact with the polishing cloth 22. At this time, the pressure adjusting mechanism 19 adjusts the pressure of the space portion 18 sealed by the polishing head main body 1 to elastically deform the diaphragm 14. For example, by supplying the pressurized air from the pressure adjusting mechanism 19 to the space portion 1, the diaphragm 14 is elastically deformed toward the side of the head body 12, and the bracket 13 is pressed toward the polishing cloth 22 at a predetermined pressure. In this manner, when the diaphragm 14 is elastically deformed by the pressure adjusting mechanism 19, the workpiece W held by the carrier 13 can be rotated with respect to the polishing cloth 22 on the turntable 21 while being pushed by a predetermined push. The pressure is pressed to grind the surface of the workpiece W. Further, at the time of polishing the workpiece W, the recess in the vicinity of the center of the polishing cloth 22 is crushed to almost the extent that it can be ignored due to the pressing of the workpiece W, and the polishing quality of the workpiece at 17 200922745 is not a problem. Further, during the polishing of the workpiece, the workpiece W can be ground while the polishing head 11 is shaken. In this manner, after the workpiece W is trimmed and polished, the workpiece W is peeled off from the polishing cloth 2 2 as follows.

First, the rotation of the polishing head 11 is stopped so that the spacer 15 is located near the concave portion of the center portion of the polishing cloth 22. Specifically, as shown in Fig. 6, the position of the spacer 15 is relative to the center from the polishing head 11 to the center of the polishing cloth 22 (i.e., the center of the turntable 2 1) to be located at 30. The grinding head 1 1 is stopped from rotating in a manner of a rotation position within . The position of the spacer 15 is preferably set to be within 15 ° with respect to the center from the center of the polishing head 11 to the center of the polishing cloth 22, and is preferably set to be located at the center of the joining polishing head 11 and to be ground. On the line segment of the center of cloth 2 2 . The method of stopping the rotational position of the polishing head 11 at the predetermined position is not particularly limited, and it is preferably simple, and it is preferable to automatically stop it at a predetermined position. Therefore, it is preferable that the polishing apparatus 31 is provided with a mechanism (for example, a servo mechanism or the like) that can automatically align the position of the rotation of the polishing head 11 with the stop position. In this manner, after the rotation of the polishing head 11 is stopped, the polishing head body 12 is raised to peel the workpiece W from the polishing cloth 22 as will be described later. When the polishing head main body 12 is raised, first, as shown in Fig. 4, the spacer 15 abuts against the polishing head main body latching portion 1 2 a. When the force for raising the polishing head main body 12 is further applied from this state, the force is concentratedly applied to the spacer 15 and the force is applied to the area immediately below the spacer 18 200922745 15 of the workpiece holding surface of the bracket 13 . If the spacer 15 is located near the center of a little recess of the polishing cloth 22, since the focus application force region of the workpiece holding surface of the bracket 13 is also located near the center of a little recess of the polishing cloth 22, it can be easily The workpiece W is peeled off from the polishing cloth 2 2 in a stable manner.

When the polishing head main body 12 is raised, as shown in Fig. 5, the spacers 15 and the portions of the annular bracket latching portions 1 3 b opposite to the side on which the spacers 15 are attached are polished. The head body latching portion 1 2 a abuts to lift the bracket 13 obliquely. Further, the thickness of the spacer 15 is appropriately adjusted so that the workpiece W can be stably separated from the polishing cloth 22. In this case, when the bracket 13 is tilted and raised as described above, for example, the tilt angle may be adjusted to about 0.1 to 1 °. Further, if the workpiece to be polished is not significantly smaller than the trimming region, the concave portion near the center of the polishing cloth 22 is located on the outer edge of the workpiece, so that the effect of the present invention can be obtained. Further, once the dressing is performed, the effect of the present invention can be obtained even if the workpiece is repeatedly polished in the normal range and peeled off from the polishing cloth 2 2 without trimming. Further, in the above, the case where the spacer provided in the polishing head of the present invention is attached to the bracket latch portion 13b has been described, but as shown in Fig. 8, the spacer 15 may be attached to the polishing head. The body latch portion 1 2 a may be attached to both the bracket latch portion 13b and the polishing head body latch portion 1 2a. 19

200922745 Hereinafter, examples and comparative examples of the present invention will be described. (Example υ The polishing head 61 shown in Fig. 13 is manufactured as follows. The polishing head body 12 and the bracket 63 are prepared, and the connection 63 is formed by the diaphragm 14 in the form of a workpiece holding surface of the rubber 65, the workpiece of the rubber The pressurizing chamber 66 is supplied with pressurized air to the workpiece by the pressure adjusting mechanism 67, and applies a uniform pressure to the rubber 65. As shown in Fig. 3, the polishing head 61 having the above-described polishing head 61 is used. The state of the polishing head 11 of Fig. 1 shows a state in which the polishing head 61 is provided, and the following grinding is performed as a workpiece W having a diameter of 300 mm and a thickness of 775 micro circles. Further, the used stone wafer is used. It is one that has been applied to the edge portion in advance on both sides. Also, the turntable 2 1 is made up to 800 μm, and the polishing cloth 22 is made by using the ungrooved machine. First, trimming is performed before grinding. The polishing cloth 22, f is a 380-millimeter outer diameter using an inner diameter of 410 mm, and the wheel dresser 41 is pressed at a pressure of 30 kPa, and the turntable 21 is rotated to perform trimming for 180 minutes.

At the time of polishing, the polishing agent was a colloidal dioxide-containing liquid, and the polishing pressure (pushing) of the polishing head 11 and the turntable workpiece W was set to 15 kPa at 31 rpm and 29 rpm, respectively. After the polishing time is completed, the spacer 1 5 (thickness: 2 millimeters: is the rotation position from the center of the polishing head 11 to the center of the polishing cloth 22), so that the polishing head 1 1 is stopped. II stainless steel, the back of the bracket has a pressurizing chamber 6 6 grinding device, but the grinding of the rice crystal, and the diameter of the user. The fuser 41 meters of grinding wheel. 29rpm 矽 alkali Dissolve 21 rotation. 10 0 minutes. The position of the meter) is at 30 ° and the bearing pressure between the workpiece W and the suction surface (rubber) of the carrier 13 at the rotation position of the 20 200922745 (the workpiece pressurizing chamber 66) The pressure; adsorption pressure was -45 kPa, so that the polishing head body 12 was raised and peeled off in 2 seconds. The above workpiece was repeatedly polished and peeled off from the polishing cloth for 300 pieces of the workpiece, and was not trimmed on the way. As a result, among the 300 workpieces, 300 pieces were able to be peeled off normally (the success rate was 100%), and it was clearly understood that the effects of the present invention can be obtained.

(Example 2) The same procedure as in Example 1 was carried out except that the polishing head was stopped at a position where the position of the spacer was not particularly determined after the completion of the polishing of the workpiece, and the polishing head main body 12 was raised at the rotation position. To try to peel off 26 pieces from the polishing cloth. As a result, although 24 out of the 26 pieces of the workpiece W can be peeled off without problems, two of them have an abnormal sound at the time of peeling. (Comparative Example 1) A polishing apparatus equipped with a polishing head similar to that of Example 1 was used, except that the spacer was not provided, and the silicon wafer was polished in the same manner as in Example 1, and the adsorption pressure was attempted to be -3 0 k. P a way, try to peel off in 1 ~ 2 seconds. As a result, the turntable rises, but the workpiece cannot be peeled off. The present invention is not limited to the above embodiment. The above-described embodiment is an example of the structure of the present invention, and the object of the invention is substantially the same as the technical concept described in the patent application of the present invention, and the same effects are achieved, and any of them are included in the technical scope of the present invention. For example, the polishing head of the present invention is not limited to the one shown in Figs. 1 and 3, for example, the shape of the polishing head body, and the like, and can be appropriately designed in addition to the conditions described in the patent application. Further, the configuration of the polishing apparatus is not limited to that shown in Fig. 3. For example, a polishing apparatus including a plurality of polishing heads of the present invention may be used. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing a first aspect of a polishing head according to the present invention. Fig. 2 is a schematic plan view showing an example of the polishing head of the present invention viewed from above.

Fig. 3 is a schematic block diagram showing an example of a polishing apparatus including the polishing head of the present invention. Fig. 4 is a schematic cross-sectional view showing the operation when the workpiece is peeled off from the polishing cloth by using the polishing head of the present invention. Fig. 5 is a schematic cross-sectional view showing the operation when the workpiece is peeled off from the polishing cloth by using the polishing head of the present invention. Fig. 6 is an explanatory view showing a state in which the rotation position of the polishing head is rotated from above. Fig. 7(a) is a schematic plan view showing a state of trimming, and Fig. 7(b) is a view showing a height distribution in the diameter direction of the polishing cloth after trimming 22 200922745. Fig. 8(a) is a schematic cross-sectional view showing an example of a polishing head having a spacer on the side of the polishing head main body. Fig. 9(a) is a schematic cross-sectional view showing an operation of raising the polishing head at a position without a spacer and peeling the workpiece from the polishing cloth. Fig. 10 is a schematic block diagram showing an example of a single-sided polishing apparatus.

Fig. 11 is a schematic block diagram showing an example of a conventional polishing head. Fig. 12 is a schematic cross-sectional view showing an example of a method of assembling the polishing head of the present invention. Figure 13 is a schematic cross-sectional view showing a second aspect of the polishing head of the present invention. [Main component symbol description] 11 ' 61, polishing head 12 polishing head body 72 ' 91 12a polishing head body latch 1 3 ' 92 bracket lock portion 13a projection 13b bracket latch portion 13c -~' assembly 13d second Assembly 14 diaphragm 15 spacer 16 template 1 7 ' 95 pad 18 space 19 pressure adjustment mechanism 23 200922745

20 through hole 2 1 ' 73 turntable 22, 7 4 polishing cloth 3 1 ' 7 1 grinding device 35 ' 7 5 abrasive 36, 76 abrasive supply mechanism 4 1 grinding wheel dresser 62 rubber chuck bracket 63 upper bracket member 64 Rigid ring 65 Rubber 66 Workpiece pressurization chamber 67 Pressure adjustment mechanism 68 Fluid supply path 94 Template W Workpiece 24

Claims (1)

200922745 X. Patent application scope: 1. A polishing head characterized in that: at least: a bracket for holding a back surface of a workpiece, which is in the shape of a disk, and has an annular protrusion protruding upward at a peripheral portion thereof; An annular bracket latching portion projecting inward from the protruding portion; The polishing head body is configured to keep the bracket rotatable at the same time, and has a space portion formed on the inner side, an annular polishing head body latching portion extending outwardly formed on the outer side, and a diaphragm connecting the polishing head body and The bracket is configured to seal the space of the bracket body at the same time. When the surface of the workpiece is slidably contacted with the polishing cloth attached to the turntable for polishing, the pressure adjusting mechanism connected to the space portion is used. In a state in which the pressure of the sealed space portion is adjusted, the back surface of the workpiece is held in the bracket, and after the workpiece is polished, the polishing head is raised to peel the workpiece from the polishing cloth, thereby a polishing head in which the polishing head body is raised and the bracket latch portion is latched to the polishing head body latch portion to lift the workpiece from the polishing cloth, and a spacer is provided therein, which is located at the bracket latch And a portion of the polishing head body latching portion and located between the bracket latching portion and the polishing head body latching portion; When the workpiece is peeled off from the polishing cloth, when the polishing head body is raised, the bracket latch portion and/or the polishing head body latch portion are brought into contact with the spacer, thereby tilting the bracket The workpiece is peeled off from the polishing cloth. 2. The polishing head according to claim 1, wherein a pad is provided on a surface of the aforementioned bracket for holding the back surface of the workpiece. 3. The polishing head according to claim 1, wherein the bracket is capable of holding a semiconductor wafer as the workpiece of a diameter of 300 mm or more. 4. The polishing head according to claim 2, wherein the bracket is capable of holding a semiconductor wafer as the workpiece of a diameter of 300 mm or more. 5. A polishing apparatus for polishing a surface of a workpiece, characterized in that it comprises at least: a polishing cloth attached to the turntable; an abrasive supply mechanism for supplying an abrasive to the polishing cloth; The polishing head according to any one of claims 1 to 4 is a polishing head for holding the workpiece. 6. The polishing apparatus of claim 5, wherein the position adjustment mechanism is provided to automatically adjust the stop position of the rotation of the polishing head. 7. A method for peeling off a workpiece by first trimming a polishing cloth attached to a turntable, and sliding the surface of the workpiece to the trimmed polishing cloth 26 200922745 for polishing, and then peeling the workpiece from the polishing cloth. The method of the present invention, wherein the position of the spacer is relative to the polishing head from the polishing head after the polishing is performed by the polishing head according to any one of claims 1 to 4 The center is moved to the center of the polishing cloth at a rotational position within 30° to stop the polishing head, and the polishing head body is raised at the rotational position to peel the workpiece. 27