JP2004520705A - 半導体ウエハ、研磨装置及び方法 - Google Patents

半導体ウエハ、研磨装置及び方法 Download PDF

Info

Publication number
JP2004520705A
JP2004520705A JP2002544196A JP2002544196A JP2004520705A JP 2004520705 A JP2004520705 A JP 2004520705A JP 2002544196 A JP2002544196 A JP 2002544196A JP 2002544196 A JP2002544196 A JP 2002544196A JP 2004520705 A JP2004520705 A JP 2004520705A
Authority
JP
Japan
Prior art keywords
wafer
polishing
cassette
wafers
polishing head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002544196A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004520705A5 (enExample
Inventor
エツィオ・ボヴィオ
パリデ・コルベッリーニ
マルコ・モルガンティ
ジョヴァニ・ネグリ
ピーター・ディ・アルブレヒト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MEMC Electronic Materials SpA
Original Assignee
MEMC Electronic Materials SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEMC Electronic Materials SpA filed Critical MEMC Electronic Materials SpA
Publication of JP2004520705A publication Critical patent/JP2004520705A/ja
Publication of JP2004520705A5 publication Critical patent/JP2004520705A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2002544196A 2000-11-21 2000-11-21 半導体ウエハ、研磨装置及び方法 Pending JP2004520705A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IT2000/000471 WO2002042033A1 (en) 2000-11-21 2000-11-21 Semiconductor wafer, polishing apparatus and method

Publications (2)

Publication Number Publication Date
JP2004520705A true JP2004520705A (ja) 2004-07-08
JP2004520705A5 JP2004520705A5 (enExample) 2005-05-26

Family

ID=11133584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002544196A Pending JP2004520705A (ja) 2000-11-21 2000-11-21 半導体ウエハ、研磨装置及び方法

Country Status (7)

Country Link
US (1) US7137874B1 (enExample)
EP (1) EP1335814A1 (enExample)
JP (1) JP2004520705A (enExample)
KR (1) KR20040011433A (enExample)
CN (1) CN1461251A (enExample)
TW (1) TW495415B (enExample)
WO (1) WO2002042033A1 (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7778721B2 (en) * 2003-01-27 2010-08-17 Applied Materials, Inc. Small lot size lithography bays
US7221993B2 (en) 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US7156946B2 (en) * 2003-04-28 2007-01-02 Strasbaugh Wafer carrier pivot mechanism
US7720557B2 (en) 2003-11-06 2010-05-18 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US7218983B2 (en) * 2003-11-06 2007-05-15 Applied Materials, Inc. Method and apparatus for integrating large and small lot electronic device fabrication facilities
DE102004005702A1 (de) * 2004-02-05 2005-09-01 Siltronic Ag Halbleiterscheibe, Vorrichtung und Verfahren zur Herstellung der Halbleiterscheibe
US7150673B2 (en) * 2004-07-09 2006-12-19 Ebara Corporation Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
US7699688B2 (en) * 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
US7575504B2 (en) * 2006-11-22 2009-08-18 Applied Materials, Inc. Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly
US8192248B2 (en) * 2008-05-30 2012-06-05 Memc Electronic Materials, Inc. Semiconductor wafer polishing apparatus and method of polishing
JP5038259B2 (ja) * 2008-08-26 2012-10-03 株式会社日立ハイテクノロジーズ クリーニング装置およびクリーニング方法
KR101057228B1 (ko) 2008-10-21 2011-08-16 주식회사 엘지실트론 경면연마장치의 가압헤드
KR101022277B1 (ko) * 2009-02-25 2011-03-21 그린스펙(주) 실리콘 베어 웨이퍼 연마장치용 캐리어 헤드
JP5635957B2 (ja) * 2010-09-09 2014-12-03 日本碍子株式会社 被研磨物の研磨方法、及び研磨パッド
US8545290B2 (en) * 2010-12-08 2013-10-01 Edmond Arzuman Abrahamians Wafer polishing apparatus and method
US9199354B2 (en) * 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
FR3001169B1 (fr) * 2013-01-24 2016-02-12 Airbus Operations Sas Dispositif d'assistance pour manipuler un outil de poncage
CN103203683B (zh) * 2013-03-13 2015-02-18 大连理工大学 一种浮动抛光头
JP7250311B2 (ja) * 2016-04-01 2023-04-03 モ カン，ジューン 基板収容部材を備える化学機械的な研磨装置用のキャリアヘッド
US10541165B2 (en) * 2016-11-10 2020-01-21 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port backplane
CN106891244A (zh) * 2017-03-01 2017-06-27 天津华海清科机电科技有限公司 抛光头
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
JP7287761B2 (ja) 2018-07-31 2023-06-06 株式会社荏原製作所 球面軸受の軸受半径決定方法
KR101966017B1 (ko) * 2018-09-13 2019-04-04 오민섭 반도체소자의 불량분석을 위한 그라인딩 제어 방법 및 장치
CN110355664B (zh) * 2019-07-17 2021-10-12 广州创研智能科技有限公司 一种打磨装置
CN110587469A (zh) * 2019-09-29 2019-12-20 苏州光斯奥光电科技有限公司 一种用于液晶面板的研磨机构
CN110653720B (zh) * 2019-09-29 2021-05-28 福建北电新材料科技有限公司 抛光器件及其制备方法、抛光方法以及半导体器件
WO2022132310A1 (en) * 2020-12-18 2022-06-23 Applied Materials, Inc. Pad carrier for horizontal pre-clean module
CN112757137B (zh) * 2021-03-02 2025-04-22 核工业理化工程研究院 全自动磨抛机抛光盘型试样的辅助夹具
CN115101459B (zh) * 2022-06-16 2025-05-13 华海清科股份有限公司 晶圆装卸装置及化学机械抛光系统
CN115592559B (zh) * 2022-10-10 2026-07-31 金华博蓝特新材料有限公司 晶片研磨装置
CN116394093A (zh) * 2023-05-29 2023-07-07 宁波芯丰精密科技有限公司 自适应调整抛光头以及抛光装置
CN117506566B (zh) * 2023-10-31 2026-03-06 北京创思工贸有限公司 碳化硅零件加工方法
CN117260407B (zh) * 2023-11-20 2024-03-12 铭扬半导体科技(合肥)有限公司 一种抛光设备的检测方法
CN117602826A (zh) * 2023-12-15 2024-02-27 江苏铁锚科技股份有限公司 一种硅酸盐玻璃及其表面抛光工艺
CN118162984B (zh) * 2024-05-15 2024-09-17 河北霞文红外材料科技有限公司 一种用于氟化镁球罩的球面洗磨机
CN120095665A (zh) * 2024-12-31 2025-06-06 华海清科股份有限公司 一种晶圆边缘抛光系统

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3708921A (en) * 1970-08-17 1973-01-09 Monsanto Co Apparatus and process for polishing semiconductor or similar materials
JPH079896B2 (ja) * 1988-10-06 1995-02-01 信越半導体株式会社 研磨装置
US5377451A (en) 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5605487A (en) 1994-05-13 1997-02-25 Memc Electric Materials, Inc. Semiconductor wafer polishing appartus and method
US5762544A (en) * 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US5738568A (en) 1996-10-04 1998-04-14 International Business Machines Corporation Flexible tilted wafer carrier
US5791978A (en) 1996-11-14 1998-08-11 Speedfam Corporation Bearing assembly for wafer planarization carrier
US5957751A (en) 1997-05-23 1999-09-28 Applied Materials, Inc. Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US5916015A (en) 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
US5899798A (en) 1997-07-25 1999-05-04 Obsidian Inc. Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing
JPH11204615A (ja) * 1998-01-19 1999-07-30 Speedfam Co Ltd ローディングロボットのウェーハローディング、アンローディング機構
JP3467184B2 (ja) 1998-02-05 2003-11-17 信越半導体株式会社 ワークの研磨方法
JP3664593B2 (ja) * 1998-11-06 2005-06-29 信越半導体株式会社 半導体ウエーハおよびその製造方法
US6068549A (en) 1999-06-28 2000-05-30 Mitsubishi Materials Corporation Structure and method for three chamber CMP polishing head
US6755723B1 (en) * 2000-09-29 2004-06-29 Lam Research Corporation Polishing head assembly

Also Published As

Publication number Publication date
KR20040011433A (ko) 2004-02-05
TW495415B (en) 2002-07-21
EP1335814A1 (en) 2003-08-20
CN1461251A (zh) 2003-12-10
US7137874B1 (en) 2006-11-21
WO2002042033A1 (en) 2002-05-30

Similar Documents

Publication Publication Date Title
US7137874B1 (en) Semiconductor wafer, polishing apparatus and method
US6080042A (en) Flatness and throughput of single side polishing of wafers
JP3030276B2 (ja) 表面研磨方法およびその装置
US7589023B2 (en) Method of manufacturing semiconductor wafer
US8192248B2 (en) Semiconductor wafer polishing apparatus and method of polishing
JP4264289B2 (ja) ウエーハ研磨装置及びその研磨ヘッド並びにウエーハ研磨方法
JP2004520705A5 (enExample)
US6132295A (en) Apparatus and method for grinding a semiconductor wafer surface
US6322434B1 (en) Polishing apparatus including attitude controller for dressing apparatus
US8662961B2 (en) Polishing pad seasoning method, seasoning plate, and semiconductor polishing device
JP2004311506A (ja) ウエーハ研磨装置及びその研磨ヘッド並びにウエーハ研磨方法
US6712673B2 (en) Polishing apparatus, polishing head and method
CN115383622B (zh) 抛光头用分体式万向节及抛光装置
JP4781654B2 (ja) 研磨クロス及びウェーハ研磨装置
JP3327378B2 (ja) ウェーハ研磨装置
JP4331622B2 (ja) 平板状ワークピースの研磨方法
TWI824493B (zh) 表面處理裝置及方法
JP3699950B2 (ja) ウエハ研磨装置
CN117178233A (zh) 表面处理设备和方法
JP2000202767A (ja) 平坦化装置及び平坦化方法
JPH07263386A (ja) 半導体ウェーハの表面基準研磨装置
TW200922745A (en) Grinding head, grinding device, and the peeling off method for work piece
JPH02199834A (ja) 薄板研磨方法
JP2004349571A (ja) ウエーハの研磨装置及び研磨方法
JP2004152890A (ja) ウェーハの研磨方法、ウェーハの研磨装置、およびｉｉｉ−ｖ族化合物半導体ウェーハ