TW429238B - Ferroelectric film formation composition and ferroelectric film formation method - Google Patents

Ferroelectric film formation composition and ferroelectric film formation method

Info

Publication number
TW429238B
TW429238B TW087113618A TW87113618A TW429238B TW 429238 B TW429238 B TW 429238B TW 087113618 A TW087113618 A TW 087113618A TW 87113618 A TW87113618 A TW 87113618A TW 429238 B TW429238 B TW 429238B
Authority
TW
Taiwan
Prior art keywords
ferroelectric film
film formation
ferroelectric
solution
forming
Prior art date
Application number
TW087113618A
Other languages
English (en)
Inventor
Akira Kamisawa
Hayato Katsuragi
Taku Yamate
Kiyoto Mori
Original Assignee
Rohm Co Ltd
Kanto Kagaku
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd, Kanto Kagaku filed Critical Rohm Co Ltd
Application granted granted Critical
Publication of TW429238B publication Critical patent/TW429238B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
    • H01L21/02197—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides the material having a perovskite structure, e.g. BaTiO3
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C23C18/1216—Metal oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314—Inorganic layers
    • H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
    • H01L21/31691—Inorganic layers composed of oxides or glassy oxides or oxide based glass with perovskite structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Semiconductor Memories (AREA)
  • Inorganic Insulating Materials (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)
  • Chemically Coating (AREA)
  • Compositions Of Oxide Ceramics (AREA)
TW087113618A 1997-08-21 1998-08-19 Ferroelectric film formation composition and ferroelectric film formation method TW429238B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22470197A JP4146533B2 (ja) 1997-08-21 1997-08-21 強誘電体膜形成用溶液および強誘電体膜の形成法

Publications (1)

Publication Number Publication Date
TW429238B true TW429238B (en) 2001-04-11

Family

ID=16817896

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087113618A TW429238B (en) 1997-08-21 1998-08-19 Ferroelectric film formation composition and ferroelectric film formation method

Country Status (6)

Country Link
US (2) US6086665A (zh)
EP (1) EP0897901B1 (zh)
JP (1) JP4146533B2 (zh)
KR (1) KR100562925B1 (zh)
DE (1) DE69819429T2 (zh)
TW (1) TW429238B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI549183B (zh) * 2011-05-17 2016-09-11 三菱綜合材料股份有限公司 強介電體薄膜之製造方法

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EP0939434A1 (en) * 1998-02-25 1999-09-01 Interuniversitair Micro-Elektronica Centrum Vzw Method for fabricating ferroelectric thin films using a sol-gel technique
US6203608B1 (en) * 1998-04-15 2001-03-20 Ramtron International Corporation Ferroelectric thin films and solutions: compositions
KR100333669B1 (ko) * 1999-06-28 2002-04-24 박종섭 레드니오비움지르코니움타이타니트 용액 형성 방법 및 그를 이용한 강유전체 캐패시터 제조 방법
DE19943789A1 (de) * 1999-09-13 2001-03-15 Fraunhofer Ges Forschung Verfahren zur Abscheidung von Zirkonoxid-Schichten unter Verwendung von löslichen Pulvern
KR100416760B1 (ko) * 2001-03-12 2004-01-31 삼성전자주식회사 졸겔공정을 이용한 지르콘산-티탄산 납 후막의 제조방법
KR20030042482A (ko) * 2001-11-22 2003-06-02 (주) 디엔에프솔루션 비스무스 란타늄 티타네이트 강유전체막 형성용 용액
KR20030042483A (ko) * 2001-11-22 2003-06-02 (주) 디엔에프솔루션 납 마그네슘 니오베이트/납 티타네이트 강유전체막 형성용용액
JP4572364B2 (ja) * 2003-06-30 2010-11-04 セイコーエプソン株式会社 強誘電体薄膜形成用組成物及び強誘電体薄膜並びに強誘電体薄膜の製造方法
WO2005015292A1 (ja) * 2003-08-07 2005-02-17 Rohm Co., Ltd 光変調膜を備える構造体およびそれを用いた光制御素子
KR100616730B1 (ko) * 2004-07-26 2006-08-28 한국표준과학연구원 강유전체 나노선 및 이의 제조 방법
KR100638890B1 (ko) * 2005-10-04 2006-10-27 삼성전기주식회사 고유전성 박막용 코팅용액 및 이를 이용한 유전박막의제조방법
KR100759366B1 (ko) 2006-04-24 2007-09-19 한국기계연구원 질산 용액에 처리된 피지티 분말을 첨가한 솔-젤 후막 용액및 상기 용액을 이용한 솔-젤 후막 제조 방법
JP5578310B2 (ja) * 2010-01-05 2014-08-27 セイコーエプソン株式会社 圧電セラミックス膜形成用組成物、圧電素子及び液体噴射ヘッド並びに液体噴射装置
JP5828293B2 (ja) * 2011-05-17 2015-12-02 三菱マテリアル株式会社 Ｐｚｔ強誘電体薄膜の製造方法
JP5919956B2 (ja) * 2012-03-30 2016-05-18 三菱マテリアル株式会社 Ｐｚｔ系強誘電体薄膜の製造方法
EP3125317B1 (en) * 2014-03-27 2022-04-27 Mitsubishi Materials Corporation Mn-doped pzt-based piezoelectric film formation composition and mn-doped pzt-based piezoelectric film
KR102330630B1 (ko) * 2014-03-28 2021-11-23 미쓰비시 마테리알 가부시키가이샤 Mn 및 Nb 도프의 PZT 계 압전체막 형성용 조성물
KR20180045954A (ko) 2016-10-26 2018-05-08 현대자동차주식회사 배터리 관리 시스템 및 그 제어방법
CN109665839B (zh) * 2018-12-20 2022-03-04 中国科学院上海硅酸盐研究所 一种高储能密度plzt基反铁电陶瓷材料及其制备方法和应用

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2729373B2 (ja) * 1987-01-07 1998-03-18 東京応化工業 株式会社 金属酸化膜形成用塗布液
JPH01260870A (ja) 1988-04-12 1989-10-18 Toray Ind Inc 変性チタン酸ジルコン酸鉛薄膜の形成方法
US5393907A (en) * 1992-03-24 1995-02-28 Tokyo Ohka Kogyo Co., Ltd. Coating solution for forming composite metal oxide film and process for making same
US5753945A (en) * 1995-06-29 1998-05-19 Northern Telecom Limited Integrated circuit structure comprising a zirconium titanium oxide barrier layer and method of forming a zirconium titanium oxide barrier layer
JP3195265B2 (ja) * 1997-01-18 2001-08-06 東京応化工業株式会社 Ｂｉ系強誘電体薄膜形成用塗布液およびこれを用いて形成した強誘電体薄膜、強誘電体メモリ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI549183B (zh) * 2011-05-17 2016-09-11 三菱綜合材料股份有限公司 強介電體薄膜之製造方法

Also Published As

Publication number Publication date
JPH1160211A (ja) 1999-03-02
DE69819429T2 (de) 2004-09-09
EP0897901A1 (en) 1999-02-24
US6086665A (en) 2000-07-11
US6485779B1 (en) 2002-11-26
JP4146533B2 (ja) 2008-09-10
EP0897901B1 (en) 2003-11-05
KR100562925B1 (ko) 2006-07-03
DE69819429D1 (de) 2003-12-11
KR19990023743A (ko) 1999-03-25

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