TW428326B - Semiconductor memory apparatus and its fabricating method - Google Patents

Semiconductor memory apparatus and its fabricating method

Info

Publication number
TW428326B
TW428326B TW088118593A TW88118593A TW428326B TW 428326 B TW428326 B TW 428326B TW 088118593 A TW088118593 A TW 088118593A TW 88118593 A TW88118593 A TW 88118593A TW 428326 B TW428326 B TW 428326B
Authority
TW
Taiwan
Prior art keywords
layer
semiconductor memory
memory apparatus
inter
metal
Prior art date
Application number
TW088118593A
Other languages
English (en)
Inventor
Kazuo Tanaka
Kunio Watanabe
Takashi Kumagai
Junichi Karasawa
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of TW428326B publication Critical patent/TW428326B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B10/00—Static random access memory [SRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B10/00—Static random access memory [SRAM] devices
    • H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/903—FET configuration adapted for use as static memory cell

Landscapes

  • Semiconductor Memories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
TW088118593A 1998-10-30 1999-10-27 Semiconductor memory apparatus and its fabricating method TW428326B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP32618698 1998-10-30
JP32618798 1998-10-30
JP11260537A JP2000200838A (ja) 1998-10-30 1999-09-14 半導体記憶装置およびその製造方法

Publications (1)

Publication Number Publication Date
TW428326B true TW428326B (en) 2001-04-01

Family

ID=27334925

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088118593A TW428326B (en) 1998-10-30 1999-10-27 Semiconductor memory apparatus and its fabricating method

Country Status (4)

Country Link
US (1) US6534864B1 (zh)
JP (1) JP2000200838A (zh)
KR (1) KR100472801B1 (zh)
TW (1) TW428326B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9807721D0 (en) * 1998-04-08 1998-06-10 Chiron Spa Antigen
TW521226B (en) * 2000-03-27 2003-02-21 Semiconductor Energy Lab Electro-optical device
TW522374B (en) * 2000-08-08 2003-03-01 Semiconductor Energy Lab Electro-optical device and driving method of the same
JP4954400B2 (ja) * 2000-08-18 2012-06-13 株式会社半導体エネルギー研究所 半導体装置
US7180496B2 (en) 2000-08-18 2007-02-20 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and method of driving the same
JP4954399B2 (ja) * 2000-08-18 2012-06-13 株式会社半導体エネルギー研究所 液晶表示装置
JP4570811B2 (ja) 2001-04-27 2010-10-27 ルネサスエレクトロニクス株式会社 半導体装置
KR20030085323A (ko) * 2002-04-30 2003-11-05 주식회사 하이닉스반도체 에스렘(ｓｒａｍ) 셀 및 그 제조방법
KR100855862B1 (ko) * 2002-06-29 2008-09-01 매그나칩 반도체 유한회사 에스렘(ｓｒａｍ) 셀 및 그의 제조방법
KR100447030B1 (ko) * 2002-08-22 2004-09-07 삼성전자주식회사 웰 바이어스 전압을 인가할 수 있는 반도체 소자 및 그제조방법
TWI228793B (en) * 2003-04-28 2005-03-01 Fujitsu Ltd Semiconductor device and manufacturing method thereof
KR100591771B1 (ko) * 2005-02-07 2006-06-26 삼성전자주식회사 반도체 장치의 불량 분석을 위한 분석 구조체
JP5090671B2 (ja) * 2005-08-01 2012-12-05 ルネサスエレクトロニクス株式会社 半導体装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62259469A (ja) * 1986-05-06 1987-11-11 Hitachi Ltd 半導体装置
US4884123A (en) * 1987-02-19 1989-11-28 Advanced Micro Devices, Inc. Contact plug and interconnect employing a barrier lining and a backfilled conductor material
JP2537413B2 (ja) * 1989-03-14 1996-09-25 三菱電機株式会社 半導体装置およびその製造方法
US5138425A (en) * 1989-05-23 1992-08-11 Seiko Epson Corp. Semiconductor integrated circuit device with nitride barrier layer ion implanted with resistivity decreasing elements
US5237187A (en) * 1990-11-30 1993-08-17 Hitachi, Ltd. Semiconductor memory circuit device and method for fabricating same
DE69226987T2 (de) * 1991-05-03 1999-02-18 Sgs-Thomson Microelectronics, Inc., Carrollton, Tex. Lokalverbindungen für integrierte Schaltungen
JPH0697192A (ja) * 1992-07-29 1994-04-08 Kawasaki Steel Corp 半導体装置及びその製造方法
JP2925416B2 (ja) * 1992-11-09 1999-07-28 株式会社東芝 半導体集積回路装置の製造方法
JPH07226387A (ja) 1993-03-26 1995-08-22 Kawasaki Steel Corp 金属配線およびその形成方法
US5528081A (en) * 1993-06-25 1996-06-18 Hall; John H. High temperature refractory metal contact in silicon integrated circuits
JP2596331B2 (ja) * 1993-09-08 1997-04-02 日本電気株式会社 半導体装置およびその製造方法
KR0138307B1 (ko) * 1994-12-14 1998-06-01 김광호 반도체 장치의 측면콘택 형성방법
US5654589A (en) * 1995-06-06 1997-08-05 Advanced Micro Devices, Incorporated Landing pad technology doubled up as local interconnect and borderless contact for deep sub-half micrometer IC application
JPH0955440A (ja) 1995-08-17 1997-02-25 Sony Corp 半導体装置及び半導体装置の製造方法
US5831899A (en) * 1997-04-07 1998-11-03 Integrated Device Technology, Inc. Local interconnect structure and process for six-transistor SRAM cell
JP3456391B2 (ja) * 1997-07-03 2003-10-14 セイコーエプソン株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
KR100472801B1 (ko) 2005-03-07
KR20000029422A (ko) 2000-05-25
JP2000200838A (ja) 2000-07-18
US6534864B1 (en) 2003-03-18

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Legal Events

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees