TW428096B - IC testing apparatus - Google Patents
IC testing apparatusInfo
- Publication number
- TW428096B TW428096B TW088104219A TW88104219A TW428096B TW 428096 B TW428096 B TW 428096B TW 088104219 A TW088104219 A TW 088104219A TW 88104219 A TW88104219 A TW 88104219A TW 428096 B TW428096 B TW 428096B
- Authority
- TW
- Taiwan
- Prior art keywords
- tested
- testing apparatus
- socket
- contact
- guiding
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Discharge Of Articles From Conveyors (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10557698A JP3951436B2 (ja) | 1998-04-01 | 1998-04-01 | Ic試験装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW428096B true TW428096B (en) | 2001-04-01 |
Family
ID=14411350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW088104219A TW428096B (en) | 1998-04-01 | 1999-03-18 | IC testing apparatus |
Country Status (4)
Country | Link |
---|---|
US (1) | US6573739B1 (zh) |
JP (1) | JP3951436B2 (zh) |
KR (2) | KR100810380B1 (zh) |
TW (1) | TW428096B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI732433B (zh) * | 2020-01-21 | 2021-07-01 | 四方自動化機械股份有限公司 | 利用金屬載盤進行晶片自動化測試分類的系統及方法 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003091741A1 (fr) * | 2002-04-25 | 2003-11-06 | Advantest Corporation | Appareil d'essai de composants electroniques |
AU2003241973A1 (en) * | 2003-05-30 | 2005-01-21 | Advantest Corporation | Electronic component test instrument |
TW200532837A (en) * | 2004-03-26 | 2005-10-01 | Renesas Tech Corp | Method for manufacturing semiconductor integrated circuit device |
KR100946482B1 (ko) * | 2004-11-22 | 2010-03-10 | 가부시키가이샤 어드밴티스트 | 전자 부품 핸들링 장치용 인서트, 푸셔, 테스트 헤드용소켓 가이드 및 전자 부품 핸들링 장치 |
JP4826096B2 (ja) * | 2005-02-22 | 2011-11-30 | 東洋製罐株式会社 | 分岐型スタンディングパウチ |
KR20100017958A (ko) * | 2005-07-21 | 2010-02-16 | 가부시키가이샤 어드밴티스트 | 푸셔 |
US20070176618A1 (en) * | 2005-08-12 | 2007-08-02 | Amkor Technology, Inc. | Universal contactor for use with multiple handlers and method therefor |
DE112005003685B4 (de) * | 2005-08-31 | 2015-09-03 | Hirata Corp. | Vorrichtung zum Handhaben von Werkstücken |
KR100647494B1 (ko) * | 2006-03-29 | 2006-11-23 | 주식회사 엠디플렉스 | 전자회로 검사장치 및 그 검사방법 |
KR100857911B1 (ko) * | 2007-02-01 | 2008-09-10 | 미래산업 주식회사 | 반도체 소자 테스트 핸들러용 소팅장치 및 소팅방법 |
KR100889356B1 (ko) * | 2007-06-15 | 2009-03-18 | 주식회사 아이티엔티 | 반도체 디바이스 테스트 시스템의 반도체 디바이스 핸들링방법 |
US7635973B2 (en) * | 2007-11-16 | 2009-12-22 | Electro Scientific Industries, Inc. | Electronic component handler test plate |
KR100960882B1 (ko) * | 2007-12-26 | 2010-06-04 | (주)엘텍솔루션 | 반도체 패키지용 캐리어 |
KR100938172B1 (ko) | 2007-12-28 | 2010-01-21 | 미래산업 주식회사 | 핸들러, 반도체 소자 로딩방법, 테스트트레이 이송방법, 및반도체 소자 제조방법 |
KR100950798B1 (ko) | 2008-03-25 | 2010-04-02 | (주)테크윙 | 테스트트레이용 인서트 개방유닛 및 이를 이용한반도체소자의 장착방법 |
US8564304B2 (en) * | 2010-04-23 | 2013-10-22 | AFA Micro Co. | Integrated circuit device test apparatus |
US8497697B2 (en) * | 2010-06-14 | 2013-07-30 | Analog Devices, Inc. | Apparatus and method for testing multiple integrated circuit devices on a film frame handler |
KR101830284B1 (ko) * | 2011-10-06 | 2018-02-21 | 삼성전자주식회사 | 컨택 장치 및 이를 이용한 반도체 테스트 장치 |
ITVI20110343A1 (it) * | 2011-12-30 | 2013-07-01 | St Microelectronics Srl | Sistema e adattatore per testare chips con circuiti integrati in un package |
KR101494176B1 (ko) * | 2013-10-16 | 2015-02-24 | 에이엠티 주식회사 | 반도체 소자의 테스트 시스템 |
KR101926410B1 (ko) * | 2014-11-06 | 2018-12-07 | 가부시키가이샤 무라타 세이사쿠쇼 | 전자 부품의 반송장치 |
KR101762835B1 (ko) * | 2015-03-03 | 2017-07-28 | 리노공업주식회사 | 검사장치 |
JP6582905B2 (ja) * | 2015-11-12 | 2019-10-02 | 株式会社リコー | ソケットガイド、及びソケット |
JP7281250B2 (ja) * | 2018-05-11 | 2023-05-25 | 株式会社アドバンテスト | 試験用キャリア |
CN108910494B (zh) * | 2018-07-06 | 2020-08-11 | 安徽贝昂科技有限公司 | 一种电子测试设备用移动装置 |
CN109384037B (zh) * | 2018-12-07 | 2024-02-02 | 深圳市微特精密科技股份有限公司 | 一种在线测试自动化设备 |
JP2023055016A (ja) * | 2021-10-05 | 2023-04-17 | 株式会社アドバンテスト | 電子部品試験装置、ソケット、及び、キャリア |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2547022Y2 (ja) * | 1990-10-12 | 1997-09-03 | 株式会社アドバンテスト | Ic試験装置 |
JPH04199531A (ja) * | 1990-11-28 | 1992-07-20 | Mitsubishi Electric Corp | 半導体測定装置 |
JPH05326757A (ja) * | 1990-12-18 | 1993-12-10 | Toshiba Corp | Icソケット |
JP2746763B2 (ja) * | 1991-02-18 | 1998-05-06 | シャープ株式会社 | バーンイン装置およびこれを用いるバーンイン方法 |
JP2761562B2 (ja) * | 1994-06-15 | 1998-06-04 | 株式会社アドバンテスト | Icハンドラのic搬送キャリア |
KR100206644B1 (ko) * | 1994-09-22 | 1999-07-01 | 오우라 히로시 | 반도체 디바이스의 자동검사장치 및 방법 |
JPH08233899A (ja) * | 1995-02-28 | 1996-09-13 | Ando Electric Co Ltd | Icのコンタクト機構 |
SG90713A1 (en) * | 1995-07-28 | 2002-08-20 | Advantest Corp | Semiconductor device testing apparatus and semiconductor device testing system having a plurality of semiconductor device testing apparatus |
US6078188A (en) * | 1995-09-04 | 2000-06-20 | Advantest Corporation | Semiconductor device transporting and handling apparatus |
JP3644553B2 (ja) * | 1995-11-20 | 2005-04-27 | 株式会社アドバンテスト | Icソケット |
US6208155B1 (en) * | 1998-01-27 | 2001-03-27 | Cerprobe Corporation | Probe tip and method for making electrical contact with a solder ball contact of an integrated circuit device |
US6300781B1 (en) * | 1998-10-30 | 2001-10-09 | St Assembly Test Services Pte Ltd | Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system |
-
1998
- 1998-04-01 JP JP10557698A patent/JP3951436B2/ja not_active Expired - Fee Related
-
1999
- 1999-03-18 TW TW088104219A patent/TW428096B/zh not_active IP Right Cessation
- 1999-04-01 US US09/283,571 patent/US6573739B1/en not_active Expired - Fee Related
- 1999-04-01 KR KR1019990011454A patent/KR100810380B1/ko not_active IP Right Cessation
-
2007
- 2007-12-24 KR KR1020070136881A patent/KR20080009186A/ko not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI732433B (zh) * | 2020-01-21 | 2021-07-01 | 四方自動化機械股份有限公司 | 利用金屬載盤進行晶片自動化測試分類的系統及方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100810380B1 (ko) | 2008-03-07 |
KR19990082838A (ko) | 1999-11-25 |
JP3951436B2 (ja) | 2007-08-01 |
KR20080009186A (ko) | 2008-01-25 |
US6573739B1 (en) | 2003-06-03 |
JPH11287841A (ja) | 1999-10-19 |
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Legal Events
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GD4A | Issue of patent certificate for granted invention patent | ||
MK4A | Expiration of patent term of an invention patent |