TW425645B - Wafer scale packaging scheme - Google Patents
Wafer scale packaging scheme Download PDFInfo
- Publication number
- TW425645B TW425645B TW088111047A TW88111047A TW425645B TW 425645 B TW425645 B TW 425645B TW 088111047 A TW088111047 A TW 088111047A TW 88111047 A TW88111047 A TW 88111047A TW 425645 B TW425645 B TW 425645B
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- wafer
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- H01L2924/14—Integrated circuits
Description
425645 4 9 I 4 cw f. doc/008 A7 B7 五、發明説明(ί ) 本發明是有關於一種積體電路構裝方法,且特別是有 關於一種可以降低構裝成本之多個單一晶片的構裝方法。 半導體業生產技術的持續硏發,不但在效率上不斷地 改善,同時也因此降低生產成本。尤其是在晶片的製造上, 每一電晶體所需之製造成本已逐年持續降低,此乃不爭之 事實。然而,此種演進創造的利益,卻因爲晶片構裝成本 上,降低步調較爲趨緩的情形而抵銷了部分利益。直至現 今,晶片生產與晶片構裝已被視爲本質上獨立的技術,而 且晶片生產的技術改良,不一定添加價値於晶片構裝" 近來,晶圓等級構裝(wafer scale packaging)已廣爲大 眾所應用。藉此也就意味著整個晶圓在其被切割爲個別晶 片前,即完成構裝。M. Hou近來所發表之”Wafer level packaging for CSP,s,,(in Semiconductor International, July 1998 pp. 305-308),即是一個很好的例子。晶片等級構裝 (chip scale packages, CSPs)大約在1996年時首先發跡。從 當時開始便有許多改良,例如Hou所揭露的結構就是很好 的例證。在製程方面,她言及個別晶片構裝的組裝製程已 成爲晶圓製造的延伸製程,而非晶片構裝加工的個別步 驟。 簡言之,Hou所述之製程包括封膠灌模於整個晶圓的 表面。然而需要一種特別的灌模壓合方法,以因應各種應 用型態之晶圓,而接合錫凸塊(solder bump)先已形成於整 個晶圓的表面上,錫鉛凸塊能夠穿過封膠而再次暴露於封 裝的表面,而提供製程之可靠度。Hou強調此種方法主要 適用於低密度之構裝。 (請先閎讀背面之注意事項再填寫本頁) -裝. 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中国國家標準(CNS > A4規格(210X297公釐) 425645 49 N twf. doc/008 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(π ) 因此本發明的主要目的就是在提供一種構裝及一種半 導體晶片構裝的製程。 本發明的另一目的在於上述製程使得一晶圓上所有晶 片可以同時進行包裝。 本發明的再一目的在於上述製程實施時無逼^ 迫邊或夾具。 本發明還有一目的在於上述製程可以應用於具有高密 度內連線之構裝。 本發明更有一目的在於上述製程與個別晶片構裝的製 程相較,其所形成之構裝在成本上顯著地便宜許多。 爲達成本發明之上述目的’先在晶片上沈積一'聚合材 料層,比如聚亞醯胺(P〇丨yimide),含矽合成橡膠(silicone elastomer),或苯基環丁稀(benzocyclobutene)。晶片的護 層(passivating layer)中有多個栓塞(stud)穿透其中,而介層 窗開口(via hole)穿透聚合材料層,與栓塞之表面連接。依 據本發明之一實施例,聚合材料層係覆蓋於一重配置線路 層(redistribution network)上,而重配置線路層則是配置於 晶片先前已平坦化之表面上。個別晶片上,晶片等級 (chip-level)的線路係共同連接至晶圓之切割道(kerf),因此 可以藉由電鍍的方法將導電柱形成於介層窗開口中。在形 成焊接凸塊後,晶圓即切割成個別的晶片,藉此個別的重 配置線路層則得以分離。在第二實施例中,則未採用重配 置線路層。而導電柱可以藉由無電鍍(electr〇less plating) 的方法形成於介層窗開口中。在第三實施例中,同樣也不 採用重配置線路層,但藉由一接觸層使電鍍得以進行。聚 ___ t 本紙張Λ度適.用中國國家標準(CNS ) a4規格(21〇'犬297公釐) (請先聞讀背面之注項再填寫本頁} -裝· 訂 經濟部智慧財產局員工消費合作社印製 4 G Λ h 侧⑽如靡 A7 B7 五、發明説明(々) 合材料層亦可作爲最終之平坦化層。 圖式之簡單說明: 第la圖爲整個已構裝之積體電路的剖面圖,包括在頂 層的聚合材料.,其係藉由一延伸之介層窗開口與一重配置 層和底部晶片連接。 第lb圖爲整個已構裝之積體電路的剖面圖,包括在頂 層的聚合材料,其係直接藉由一延伸之介層窗開α形成晶 片級之連接。 第2圖繪示積體電路構裝前之構件。 第3圖所繪示爲第2圖之結構增加平坦化層,其中包 括用以容納栓塞之穿孔及一接觸層。 第4圖繪示第3圖之結構續以增加一重配置線路層。 第5圖繪示第4圖之結構續以增加一聚合材料層,且 介層窗開口已形成於其中。 第6圖繪示第5圖之結構中介層窗開口過塡入金屬後 形成一導電栓塞。 第7a圖繪示第6圖之結構續以回蝕刻,並形成錫鉛凸 塊於栓塞突出端,以形成棒棒糖結構。 第7b圖類似第7a圖除了一凸塊底部金屬插入錫鉛凸 塊與聚合材料層之間。 第S圖繪示第2圖之結構續以增加一聚合材料層,而 介層窗開口直接形成於連接墊上方。 第9圖類似第8圖之結構,其中介層窗開口過塡入金 屬後形成一導電栓塞。 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標隼(CNS > A4规格(210X 297公釐) 425645 4914twi'.doc/008 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(u ) 第l〇a圖繪示第9圖之結構續以形成一錫鉛凸塊於栓 塞之突出端。 第10b圖類似第10a圖除了一凸塊底層金屬插入錫錯 凸塊與聚合材料層之間。 第11a圖及第lib圖繪示依據感光型態之聚合材料之 特性及曝光條件,可以改變形成於其中之介層窗開口的形 狀。 第12圖繪示晶片中個別之重配置線路層可以彼此相連 於切割道,以形成一共同配置線路。 第13圖顯示一獨立之栓塞,甚乎完全覆蓋一聚合 材料層。 實施例 本發明係揭露一種構裝及其製程’用以對整個晶圓包 覆一層聚合材料(polymeric material),其可以運用多種習 知技術來達成,比如旋塗(sPin coating)、浸泡塗佈 (dipping)、噴塗(spray ing)、或者形成乾膜。本發明亦揭露 諸多低成本建構晶片表面接點與構裝外表面之錫鉛凸塊間 電性連接的方法。以下將敘述本發明之二個實施例。在第 一實施例中,形成構裝中部分元件係採用電鍍的方法,但 熟習該技術者應知無電鍍亦可以取代部分特定製程的電鍍 步驟,如此仍未脫離本發明之精神範圍。 第la圖所繪示爲一實施例之示意圖。圖中繪示一積體 電路之剖面圖,已有多層積層形成於矽基底1上。積層2、 3、4分別表示元件層及二層連線。每一積層均已經過平坦 (請先閲讀背面之注意事項再填寫本頁)
本紙張尺度適用中國國家標準(CNS > A4悦格(210X297公釐) 425645 B7 49 14t\vf.doc/0 0 8 五、發明説明(c) --------f ί裝-- (請先閱讀背面之注^項再填寫本頁) 化。最上層之連線,其包含輸入/輸出墊6、7(1/0 pad), 而形成於積層4之上表面,並覆以保護層13(通常爲氮化 矽),接著覆以最終平坦化層5(典型爲聚亞醯胺,然非爲 必要)。一般而Η,晶片所黏附之卡或板上,焊點的圖案 並不與栓塞8的圖案重疊。亦可能在構裝之外表面需要多 個球格狀陣列(Ball Grid Array, BGA)的圖案,端看此晶片 黏附於何處而定。爲了解決上述問題,一般係運用一重配 置線路(redistribution network)來解決,而此重配置線路通 常配置於平坦化層5之上表面。部分重配置線路如積層14 所示。本型構裝的的另一特徵在於一接觸層(contacting layer),位於積層5與10的接面間(未繪示於第la圖,將 示於後續圖示)。 以習知製程技術而標準覆晶(flip chip)之晶片的製 造程序至此步驟即完成。然就此晶片等級構裝方法而言, 製程則續以形成一塑膠層10(聚合材料),以提供晶片對外 部環境及機械上之保護。爲了與積層14形成電性連接, 介層窗開口 11需塡入適當之導電材料,而形成新的錫鉛 凸塊12(solderbump),黏附於其上端。 桌lb圖所繪不爲第—實施例的示意圖,一種較低成本 經濟部智慧財產局負工消費合作社印製 之構裝。不同於第la圖者爲此實施例中未有重配置線路。 此亦表示接合栓塞之圖案與下一層級構裝之焊點圖案相 同。此項簡化使得最終平坦化層5(繪於第ia圖)可以自結 構中省略。反而,聚合材料層15得以向下延伸至保護層 13 ° 吾人已驗證三種聚合材料適於應用在本發明所揭露之 _ ί 本紙張尺度爾*^^準(CNS > Μ規格(210.χ 297公聲-^ A7 B7 49l4t\vf. doc/008 五、發明説明(d ) 晶片等級構裝型態。這三種聚合材料爲聚亜醯月安 (polyimide),含砂合成樣膠(silicone elastomer),及苯基環 丁嫌(benzocyclobutene,BCB)。上述二種材料均可以未固 化型態,利用旋塗方式形成,接著透過其與一硬化劑反應 而硬化(固化),通常還會加熱以加速反應,然並非絕對必 要。此外,聚亞醯胺亦可以乾膜(dry film)的型態取得,其 可以藉由一黏著劑直接貼合於一表面。究竟選擇何種材 料,可依據一些參數做決定。這些參數包括: 熱膨脹係數(Temperature Coefficient 〇f Expansion, TCE)…要較低,以匹配金屬栓塞的熱膨脹係數,減低栓塞 與聚合材料間的局部應力。 楊氏係數 Y(Y〇ung’s modulus, degree of inelasticity)--- 要較低,以降低傳遞至栓塞之應力,以及減低矽與塑膠間 的熱膨脹差異及熱應力。 吸水性…要較低,以確保穩定性(stability)。 水分滲透性…要較低,以保護半導體。 附著性…要較高。 關於電器特性,比如介電常數(dielectric constant)、介 電質損耗(dielectric loss)、電阻率(resistivity)等,此三種 材質都足以符合所需。 顯然地,選擇正確的材質需要根據諸多參數,比如積 層厚度,預定之操作溫度範圍,構裝所暴露的大氣環境, 球格狀陣列密度,晶片大小、輸入/輸出接點數等。此外, 如下所述’使用這些材料的感光型式可以提供諸多好處, 包括便於形成介層窗開口。因此,若這些感光型式的材質 本紙張尺度適用中國國家操準(CNS > A4規格(2丨0X297公* ) (請先閱讀背面之注意事項再填寫本頁) —裝 订 經濟部智慧財產局貝工消费合作社印製 2564 5 49141 vvf.doc/008 A7 B7 五、發明説明( 『比如聚亞酶胺及一此點在材 ,了列表一爲吾人摘錄這些材料的部分特性。其中 數據 材質特性 聚亞醯胺 ----— 成橡膠 --—----- BCB 固化溫度 350°C _室溫 ------ 250 °Γ 楊氏係數 3.4Gpa ._____获常小 2 Qpa 吸水性 3% _低 0.2% 熱膨脹係數η 40*l〇-6/°C l*l〇-6/ °c ----— 52* l〇'6/ 附著性 中等--好 非常好 ·—— 中等一好 {請先閱讀背面之注項再填寫本頁) 表一 縱使聚合材料層可以吸收設計上既有之應力,而不會 產生如破裂等問題’然而塡入介層窗開口之金屬栓塞亦需 有較佳之彈性性能’使得某些情形下金屬栓塞可以彎曲而 不至於斷裂。舉例來說,一長度爲L之金屬栓塞,一端爲 固定知而另一端爲自由端’假設要自由端產生d的位移, 需要施力F。則施力F的値可由下列等式計算: F=(3Y^l)/L3 , y ^ 其中Y=楊氏係數,1=慣性矩。 經濟部智慧財產局員工消費合作社印製 因此,欲減低產生一既定位移所需之施力(亦即使栓塞 具有彈性),則楊氏係數與慣性矩都需縮小。就楊氏係數 考量,金和錫鉛都是不錯的選擇,而就其他因素考量,銅 是較佳的選擇。然而,慣性矩I是正比於栓塞之質量,也 就是說栓塞之直徑要較小,密度要較低。 接著吾人將揭露本發明之三個實施例。雖然此三個實 本紙張尺度適用中國國家標準(CNS ) A4規格(2!0X297公趁) A7 B7
49 I 4 twf. d Oc/OOS 五、發明説明(1 ) 施例整體製程均不相同,然而其初始之步驟是相同的: 請參照第2圖,所有實施例均始於提供一半導體晶圓, 而晶圓中已形成有多個晶片。每一晶片在晶圓表面上均具 有一圖案,且每一晶片之圖案間均以一區域分隔,即習知 之切割道(kerf)。切割到係用以在後續製程中鋸片得以將 晶圓切割成個別的晶片。如圖所示,積體電路21已形成 於矽基底20上。積層22爲一保護層,相似於第la、lb 圖中的積層13,而連接墊23(相對於第la圖的栓塞7)則 如所示暴露於外界。 笛一實施例 如第3圖’積層30表示如第2圖中連接墊23下方的 所有結構,包括積層22。積層31爲一聚亞醯胺,利用旋 塗方式沈積於積層30的表面,而開口 32係藉由典型之微 影技術形成於其中,包括採用感光型態之聚亞醯胺。積層 31之厚度一般大約介於3至20微米之間。接著,沈積一 鉻銅合金之積層33,藉由濺鍍的方式形成,其厚度大約介 於500至2〇00埃,然此爲一般製程但非絕對必要。 積層33(如第3圖所示)覆蓋整個晶圓表面,接著光阻 層形成並定義,使得欲形成重配置線路區域未覆蓋光阻 外’其餘區域均覆蓋光阻。本發明的重要特徵之一,在於 個別的晶片重配置線路之間係藉由切割道所提供的額外空 間彼此連接’因此形成如第12圖所示之共同配置線路 (common distribution network)。其中個別晶片重配置線路 圖案93-96在切割道區域98間彼此連接,因此形成共同 (請先閱讀背面之注意事項再填寫本頁) 裝_ .?τ 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) Α4規格< 210 X 297公釐) 4 256 4 5 49i4t\vf. doc/008 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(〒) 配置線路,其一端如圖中99所標示。 接著利用電鍍的方法增加金屬的厚度,以形成共同配 置線路。金屬層33通電使得金屬可以鍍在未覆蓋光阻層 之所有區域。此層金屬較佳爲銅,然而諸如鋁等金屬亦可 利用無電鍍的方式應用於此處。電鍍步驟完成後可以增加 金屬層厚度約〇·5至5微米,接著則剝除光阻層。如第4 圖中積層41所示即爲重配置線路的一部份,而未覆蓋重 配置線路部分的接觸層33可以選擇性地剝除。 接下來,形成一聚合材料層,如第5圖中積層51所示。 其厚度約介於2〇至25〇微米。然後介層窗開口 52形成於 其中,相當於第la圖中的介層窗開口 11。形成此介層窗 開口的方法可採用幾種不同的子製程: (a) 聚合材料爲感光型態,以BCB及聚亞醯胺爲例, 即有許多商業化的此類合成物可以取得。則介層窗開口 52 利用一適當之光罩進行曝光及顯影即可形成。藉由控制感 光材料的種類及曝光的條件,即可控制介層窗開口的形 狀。舉例來說’若感光材料係生成光罩之反相(negative image) ’則將使得介層窗開口靠近底部的部分較寬,也就 是靠近積層41的部分較寬,如第na圖所示。另一方面, 若感光材料係生成光罩之正相(positive image),或者曝光 系統之聚焦深度(depth of focus)較低,且影像係聚焦於二 表面之中點,則造成介層窗開口於中間的部位最窄,如第 lib圖所示。—般而言,此種介層窗開口形成之栓塞將比 習知栓塞(單純圓柱形)具有較佳之強度及附著力。 (b) 聚合材料層藉由一光阻罩幕以慣用的方式蝕刻。由 (請先閲讀背面之注意事項再填寫本頁) -裝· 訂 本紙張尺度適用+關家標牟(CNS ) A4聽 ( 21G X 297公釐) 49 14twf.d〇c/008 A7 B7 -----—-------- 5 五、發明説明((ϋ) 於光阻及聚合材料對於後續步驟之飩刻劑的反應有些相 似,因此通常會使用一硬覃幕層(比如化學氣相沈積之氧 化矽層)。 (C)聚合材料層係藉由雷射鑽孔而蝕刻。對於聚合材料 層厚度超過100微米時,此方法爲較佳之方式。舉例而言, 準分子雷射^^丨I^^laser,波長209nm)或C〇2雷射(波長 10·6微米)均適於應用於本發明,其均可形成直徑約50微 米的孔。 接著,利用第二次電鍍步驟(透過共同配置線路使積層 41通電)’形成另一層金屬鍍於積層41所暴露出之所有表 面(此層金屬較佳是銅,然而其他金屬如金、錫鉛合金, 或鋁亦可以應用於此。換句話說,介層窗開口 52將塡滿 金屬,而在介層窗開口恰好塡滿後緊接著形成栓塞。在過 塡(overfilling)介層窗開口 52後即形成如第6圖所示之外 觀結構,其中栓塞67具有一圓形頂面突出於積層51的表 面。栓塞於聚合材料層表面的突出部分係用來固定(anchor) 錫鉛凸塊,而錫鉛凸塊係於下一步驟中生長形成。藉由將 聚合材料做某一程度的回蝕可加強此固定效能,如第7a 圖所示,而使得栓塞與錫鉛凸塊結合形成棒棒糖(lollipop) 結構。 請參照第7a圖,一錫銘凸塊Ή生長形成於桂塞67突 出之頂部。由於栓塞67依然可以藉由共同配置線路形成 電性導通,因此電鍍是完成此步驟的較佳方法。一般而言, 電鍍提供較佳之控制,尤其是在沈積層的合成層控制上, 比起比如藉由無電鍍達成的方式,具有較佳之控制效果。 f請先閱讀背面之注意事項再填寫本頁) -裝
•1T 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 425645 49Utwf.doc/0 0 8 A 7 ---- B7 ---- - ___________—___ 五、發明説明((I ) 此實施例的〜種變化型態,在栓塞的突出部分形成錫 給凸塊71前’先覆蓋—層凸塊底層金屬72(Under Ball Meul, UBM),$口第7b圖所示。此層係以一般習用之方法 形成’先沈積於整個表面,再進行微影定義及蝕刻。提供 此額外凸塊底層金屬之優點在於可增加錫鉛凸塊底部的接 觸面積,以強化接合性。當需要較大尺寸之錫鉛凸塊時亦 可運用此結構。上述二結構中,錫鉛凸塊之直徑約介於1〇〇 至300微米’而錫鉛凸塊之間距(pitch)—般約介於2〇〇至 800微米。 當錫凸塊形成後,晶圓即沿切割道切割使其分離成 多個個別晶片。而此步驟中共同配置線路將被破壞,但每 一晶片仍保留其各自之重配置線路。 第二實施例 與第一實施例不同的是,本實施例中未構裝之晶片表 面上沒有重配置線路。因此,製程上由第2圖所示之結構 直接進行聚合材料層80之形成步驟(如第8圖所示)。聚合 材料層之厚度約介於20至250微米。如第一實施例,介 層窗開口 82接著形成於其中,在此還增加一個限制,即 介層窗開口需直接位於連接墊23的上方。這些介層窗開 口相當於第lb圖中的介層窗開口,將容納導電栓塞II。 爲了形成此介層窗開口,可運用下列三種子製程之一: (a)聚合材料爲感光型態,以BC1B及聚亞醯胺爲例, 即有許多商業化的此類合成物可以取得。則介層窗開口 82 利用一適當之光罩進行曝光及顯影即可形成。藉由控制感 __ 以 本紙張尺度適用中國國家標率(CNS ) A4洗格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) -裝_ 訂 經濟部智慧財產局員工消費合作社印製 256 4 5 4 9 1 41 w f, d 〇 c / 0 〇 8 A7 B7 五、發明説明(丨y 光材料的種類及曝光的條件,即可控制介層窗開口的形 狀。舉例來說,若感光材料係生成光罩之反相(negative image) ’則將使得介層窗開口靠近底部的部分較寬,也就 是靠近積層41的部分較寬,如第lla圖所示。另一方面, 若感光材料係生成光罩之正相(positive image),或者曝光 系統之聚焦深度(depth of focus)較低,且影像係聚焦於二 表面之中點’則造成介層窗開口於中間的部位最窄,如第 lib圖所示。一般而言,此種介層窗開口形成之栓塞將比 習知栓塞(單純圓柱形)具有較佳之強度及附著力。 (b) 聚合材料層藉由一光阻罩幕以慣用的方式蝕刻D由 於光阻及聚合材料對於後續步驟之鈾刻劑的反應有些相 似’因此通常會使用一硬罩幕層(比如化學氣相沈積之氧 化砂層)。 (c) 聚合材料層係藉由雷射鑽孔而蝕刻。對於聚合材料 層厚度超過100微米時,此方法爲較佳之方式。舉例而言, 準分子雷射(eximer laser,波長209nm)或C02雷射(波長 10_6微米)均適於應用於本發明,其均可形成直徑約微 米的孔。 接著’利用無電鍍(因爲此實施例中輸入/輸出墊諸如6 或7無法用以接電),另一層金屬鍍於所有暴露出之連接 墊23表面(此金屬層較佳爲銅,但其他金屬諸如金,接合 金屬或鎳亦可以應用於此)。換句話說,介層窗開口 8〇將 塡滿金屬。 在介層窗開口恰好塡滿後緊接著繼續塡入介層窗開Q 82。在過塡介層窗開口 82後即形成如第9圖所示之外觀 (請先閱讀背面之注^>項再填寫本頁〕 裝 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標率(CNS > A4規格(2丨0X297公嫠) ------1 4 256 4 5 五、發明説明(丨、) 結構,其中栓塞87具有一圓形頂面突出於積層80的表面。 如第一實施例’栓塞於聚合材料層表面的突出部分係用來 固定錫鉛凸塊’而錫鉛凸塊係於下一步驟中生長形成。 請參照第圖’錫鉛凸塊生成於栓塞87之突出 頂部上。由於栓塞87無法接電,因此以無電鍍形成之。 此實施例的一種變化型態,在栓塞的突出部分生成錫 錯凸塊前,先覆蓋一層凸塊底層金屬88(如第10b圖所示)。 此層係以一般習用之方法形成’先沈積於整個表面,再進 行微影定義及蝕刻。提供此額外凸塊底層金屬之優點在於 可增加錫鉛凸塊底部的接觸面積,以強化接合性。當需要 較大尺寸之錫鉛凸塊時亦可運用此結構。上述二結構中, 錫鉛凸塊之直徑約介於1〇〇至3〇〇微米’而錫鉛凸塊之間 距一般約介於200至800微米。 另一種可供選擇,低成本的變化製程’係利用網版刮 塗(screen printing)或模版印刷(stenciling)形成錫銘·凸塊, 以取代無電鍍方式。此種可行的錫鉛凸塊形成方法將使凸 塊直徑增加約100微米,而間距將增加約200微米。 當錫鉛凸塊81形成後,晶圓即沿切割道切割使其分離 成多個個別晶片。 第三實施例 相同於第二實施例,此實施例中未構裝之晶片表面上 無重配置線路。然而,不像第二實施例,此處較佳之金屬 沈積方法爲電鍍。於是,一接觸金屬層沈積於整個保護層 表面。請參照第13圖之積餍45。緊接著,塗佈一層光阻 it 本紙張尺度逋用中國囷家操率(CNS ) A4規格(210X297公簸) (請先閱讀背面之注意事項再填寫本頁) .裝. 訂 經濟部智.¾財產局8工消费合作社印製 > D 〇 4 b > D 〇 4 b A7 B7 49 I 4 twf. doc/008 五、發明説明( 層,而其中有介層窗開口形成於其中’其形成方式類似於 第一及第二實施例中所提及感光型態之聚合材料層,更包 括其中所提及控制這些介層窗開口形狀的相關技術。接著 利用電鍍的方法,將介層窗開口塡入金屬,並剝除光阻層, 而留下獨立之金屬栓塞於原處,如第13圖中之46所示。 然後,利用-特別的蝕刻步驟,去除接觸金屬層:而 未傷害獨立之金屬栓塞。接下來,一聚合材料用於晶圓以 形成一積層,其厚度略低於獨立金屬栓塞之高度/藉以使 得未被覆蓋之特定部分栓塞突出於聚合材料層$表^。接 著如第二實施例般’利用無電鍍或網版印刷的方法形成錫 給凸塊’以完成本實施例之結構。 ' 雖然本發明已以較佳實施例揭露如上,然任何熟習此 技藝者應知’在不脫離本發明之精神和範 許之更動與潤飾。 = --------{裝------訂 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局B工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4说格(210乂297公釐)
Claims (1)
- 經濟部智慧財產局員工消費合作杜印利衣 4 256 4 b a8 B8 C8 491 4twf.doc/008 j-jg 六、申請專利範圍 1. 一種晶圓等級構裝製程,包括: 提供一半導體晶圓,該半導體晶圓包括複數個晶片圖 案以一切割道區域分隔,並具有一表面之保護層,及複數 個接合墊穿透該保護層; 形成一聚合物主體,其具有複數個金屬栓塞,該些金 屬栓塞與該些連接墊接觸並固定於其上,且自該些連接墊 垂直地穿透該聚合物主體;以及 其中該些金屬栓塞之直徑、高度與材質使得該些金屬 栓塞可以彎曲,以吸收該半導體晶圓與該聚合物主體間的 熱應力。 2. 如申請專利範圍第1項所述之晶圓等級構裝製程, 其中該聚合物主體包括聚亞醯胺、含矽合成橡膠及苯基環 丁烯三者其中之一。 3. 如申請專利範圍第1項所述之晶圓等級構裝製程, 更包括形成複數個介層窗開口於該聚合物主體,並形成該 些金屬栓塞於該些介層窗開口中。 4. 如申請專利範圍第3項所述之晶圓等級構裝製程, 其中該些介層窗開口之形成係藉由化學蝕刻及雷射鑽孔其 中之一。 5. 如申請專利範圍第3項所述之晶圓等級構裝製程, 其中該些金屬栓塞之形成方法包括電鍍及無電鍍其中之 6. 如申請專利範圍第1項所述之晶圓等級構裝製程, 其中施加於長度爲L之一金屬栓塞的彎曲力F,使其造成 d之位移,係根據公式F=(3YId)/L3獲得,其中Y爲楊氏 I? (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 經濟部智慧財產局員工消費合作社印製 425645 综 C8 4914twf.doc/008 Qg 六、申請專利範圍 係數,i爲慣性矩。 7. 如申請專利範圍第1項所述之晶圓等級構裝製程, 其中該聚合物主體之形成方法包括旋塗法、浸泡塗佈、以 及以一乾膜與一黏著塗層貼合三種方法其中之一= 8. —種晶圓等級構裝製程,包括下列步驟: (a) 提供一半導體晶圓,該半導體晶圓包括複數個晶片 圖案以一切割道區域分隔,並具有一表面之保護層,及複 數個接合墊穿透該保護層; (b) 於該保護層上沈積一平坦化層,其材質爲聚亞醯 胺,並定義及蝕刻該聚亞醯胺層,以形成複數個開口於些 接合墊上; (c) 於該聚亞醯胺層上沈積一凸塊底層金屬,沈積一第 一光阻層於該凸塊底層金屬上,定義該第一光阻層,形成 未覆蓋該第一光阻層之該凸塊底層金屬區域,以定義一共 同配置線路,包括複數個晶片等級重配置線路,並彼此於 該切割道區連接; (d) 利用電鍍的方法,於未覆蓋該第一光阻層之該凸塊 底層金屬區域,沈積一第一金屬層; (e) 去除該第一光阻層,並選擇性地去除該凸塊底層金 屬中未覆蓋該第一金屬層之部分; (f) 形成一聚合材料層,並形成複數個介層窗開口於其 中,並向下延伸至該共同配置線路; (g) 利用電鍍的方法,於未覆蓋該聚合材料層之金屬區 域,沈積一第二金屬層,直到該第二金屬層過塡該些切層 窗開口,藉以形成複數個栓塞,且該些栓塞具有延伸至該 -----------^ 裝--------訂---------旅 {請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 4914twf.doc/008 Dg 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 聚合材料層上的突出部分; (h)利用電鍍的方法,形成複數個錫鉛凸塊,以該些栓 塞之突出部分爲中心,並附著其上;以及 ⑴切割該晶圓,藉以切割於切割道區域中之線路,使 得該共同配置線路電性隔離,而形成該些晶片等級重配置 線路。 9. 如申請專利範圍第8項所述之晶圓等級構裝製程, 其中該聚合材料層之材質包括聚亞醯胺、含矽合成橡膠及 苯基環丁烯三者其中之一。 10. 如申請專利範圍第8項所述之晶圓等級構裝製程, 其中該聚合材料層之厚度約介於20至250微米。 11. 如申請專利範圍第8項所述之晶圓等級構裝製程, 其中形成該些介層窗開口於該聚合材料層之步驟更包括採 用一感光型態之聚合材料層,透過一光罩進行曝光,並經 過顯影以形成該些介層窗開口。 12. 如申請專利範圍第8項所述之晶圓等級構裝製程, 其中形成該些介層窗開口於該聚合材料層之步驟更包括利 用一光阻罩幕與一硬罩幕覆蓋於該聚合材料層上,並蝕刻 該聚合材料層。 13. 如申請專利範圍第8項所述之晶圓等級構裝製程, 其中形成該些介層窗開口於該聚合材料層之步驟更包括利 用雷射鑽孔的方法。 14. 如申請專利範圍第8項所述之晶圓等級構裝製程,, 其中該第二金屬層之厚度約介於20至250微米,而其材 質係選自於由銅、金、接合材料及鋁所組成之族群中的一 -----------f l 裝 -------訂 -------- (請先閱讀背面之注意事項再填寫本頁) 本紙張义度適用中國國家標準(CNS)A4規格(210 X 297公釐) A8 B8 C8 OB 425645 4914twf.doc/〇〇8 六、申請專利範圍 種材質。 15. 如申請專利範圍第11項所述之晶圓等級構裝製程, 其中該感光型態之聚合材料層提供該光罩之反相,使得該 些介層窗開口靠近該第一金屬層部分的口徑較寬。 16. 如申請專利範圍第11項所述之晶圓等級構裝製程, 更包括: 採用一感光型態之聚合材料層,其提供該光罩之正相, 並具有一上表面及一下表面; 利用一曝光系統,其具有一低聚焦深度; 進行該聚合材料層之曝光,聚焦於該上、下表面中間 之平面,藉以使得該些介層窗開口於其中間位置之口徑最 窄。 17. 如申請專利範圍第8項所述之晶圓等級構裝製程, 更包括回蝕刻該聚合材料層該些栓塞與該些錫鉛凸塊共同 形成一棒棒糖結構。 18. 如申請專利範圍第8項所述之晶圓等級構裝製程, 更包括在形成該些錫鉛凸塊前,在該些栓塞未被覆蓋的部 分覆蓋一凸塊底層金屬。 19. 一種晶圓等級構裝製程,包括下列步驟: (a) 提供一半導體晶圓,該半導體晶圓具有複數個積體 電路,並具有一表面之保護層,及複數個接合墊連接該些 積體電路之接點; (b) 形成一聚合材料層,並形成複數個介層窗開口於其 中,而該些介層窗開口位於該些接合墊上,並向下延伸至 該些接合電; 本紙張尺度適用中國國家標準(CNS)Al規格(210 X 297公釐) -----------^ 裝--------訂·-------- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 425645 49l4t\vf.d〇c/〇〇S AS H8 C8 08 :、申請專利範圍 ⑷藉由無電鑛的方法,在未覆蓋該聚合 金屬區域沈積一金屬層,直到該金屬層過塡等此八有 □ ’藉以形成複數個栓塞,其具有突出部分 材料層上,並突出一特定厚度: 主tu聚tj ⑷藉由無電鍍的方法,形成複數個錫錯 栓塞之突出部分爲中心,並附著其上;以及 β二 (e)切割該晶圓以形成複數個獨立的晶片。 二:範圍第19項所述之晶圓等級構裝製程, 苯基環丁烯三者其中之一。 3矽口成橡膠及 21. 如申請專利範圍第19項所述之 其中該聚合材料層之厚度約介於2〇至25〇 ',構裝製程, 22. 如申請專利範圍第19項所述 其中形成該些介層窗開口於該聚合材料構裝製程, 用-感光型態之聚合材料層,透過 2驟更包括採 過顯影以形成該些介層窗開口。 L行曝光,並經 23‘如申請專利範圍第19項所述 其中形成該些介層窗開口於該聚合 ^ 級構裝製程, 用—光阻罩幕與—硬罩幕覆蓋於該步驟更包括利 該聚合材料層。 ㈡材枓餍上’並蝕刻 24_如申請專利範圍第d項所述 其中形成該些介層窗開口於該聚合級構裝製程, 用雷射鑽孔的方法。 科層之步驟更包括利 25·如鴨糊範醜a項職 其中該感光型態之聚合材料層提供’圖等級構裝製程, ’光簞之反相,使得該 (請先閱讀背面之注意事項再填寫本頁) 裝--------訂--------- 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 4 2 5 6 4 5 B8 Γ'ϋ 49I4twf.doc/〇〇S 六、申請專利範圍 些介層窗開口靠近該第一金屬層部分的口徑較寬。 26·如申請專利範圍第22項所述之晶圓等級構裝製程, 更包括: 採用一感光型態之聚合材料層’其提供該光罩之正相, 並具有一上表面及一下表面; 利用一曝光系統,其具有一低聚焦深度; 進行該聚合材料層之曝光,聚焦於該上、下表面中間 之平面,藉以使得該些介層窗開口於其中間位置之口徑最 窄。 27. 如申請專利範圍第19項所述之晶圓等級構裝製程, 其中該些栓塞之突出部分突出於該聚合材料層之該特定厚 度約介於1〇至75微米。 28. 如申請專利範圍第19項所述之晶圓等級構裝製程, 更包括在形成該些錫鉛凸塊前,在該些栓塞未被覆蓋的部 分覆蓋一凸塊底層金屬。 29. 如申請專利範圍第19項所述之晶圓等級構裝製程, 其中步驟(d)形成該些检塞之方法,包括利用網版刮塗及模 版印刷其中之一,取代無電鍍方式。 30. —種晶圓等級構裝製程,包括下列步驟: (a) 提供一半導體晶圓,該半導體晶圓具有複數個積體 電路,並具有一表面之保護層,及複數個接合墊連接該些 積體電路之接點; (b) 於該保護層上,沈積一接觸金屬層; (c) 形成一光阻層,並形成複數個介層窗開口於其中’ 且該些介層窗開口向下延伸至該接觸金屬層; ------------,'.裝----I---訂-------- (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS>A4規格(210 x 297公釐) 經濟部智慧財產局員工消費合作社印制^ ^ a ·· ' A8 id, R8 49 14twf_doc/0 0 8 六、申請專利範圍 (d) 藉由電鍍的方法,沈積一金屬層於該接觸金屬層未 被該光阻層覆蓋之區域,直至該些介層窗開口爲該金屬層 所塡滿; (e) 去除該光阻層,藉以形成複數個獨立之金屬栓塞; ⑴在未傷害該些金屬栓塞的情形下,去除該接觸金屬 層; (g) 塗佈一聚合材料層於整個該晶圓,藉以使得該些金 屬栓塞之部分未被覆蓋該聚合材料層; (h) 形成複數個錫鉛凸塊,以該些金屬栓塞之突出部分 爲中心,並附著其上;以及 ⑴切割該晶圓以形成複數個獨立的晶片。 31. —種晶圓等級構裝,包括: 一半導體晶圓,該半導體晶圓包括複數個晶片圖案以 一切割道區域分隔,並具有一表面之保護層.,及複數個接 合墊穿透該保護層; 一聚合材料主體,具有複數個金屬栓塞,該些金屬栓 塞與該些連接墊接觸並固定於其上,且自該些連接墊垂直 地穿透該聚合物主體;以及 其中該些金屬栓塞之直徑、高度與材質使得該些金屬 栓塞可以彎曲,以吸收該半導體晶圓與該聚合物主體間的 熱應力。 32. 如申請專利範圍第31項所述之晶圓等級構裝,其 中該聚合材料主體之材質包括聚亞醯胺、含矽合成橡膠及 苯基環丁烯三者其中之一。 33. 如申請專利範圍第31項所述之晶圓等級構裝,其 (請先閱讀背面之注意事項再填寫本貝) 人^--------訂---------線f 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐) 4. 4. A8 B8 CS ns 4 9 1 41 t', d 〇 c / 0 0 8 六、申請專利範圍 中該聚合材料主體之厚度約介於20至250微米。 34·如申請專利範圍第31項所述之晶圓等級構裝,其 中該些金屬栓塞之寬度約介於10至200微米。 35. 如申請專利範圍第31項所述之晶圓等級構裝,其 中該些金屬栓塞包括電鍍銅。 36. 如申請專利範圍第31項所述之晶圓等級構裝,施 加於長度爲L之一金屬栓塞的彎曲力F,使其造成d之位 移,係根據公式F=(3YId)/L3獲得,其中Y爲楊氏係數,I 爲慣性矩。 -----------^ 裝-------訂---------線~ I (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局負工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(21〇 x 297公^ )
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