TW377520B - Light-producing display element, method for connecting same to electric wiring substrate and method for manufacturing same - Google Patents
Light-producing display element, method for connecting same to electric wiring substrate and method for manufacturing sameInfo
- Publication number
- TW377520B TW377520B TW086119849A TW86119849A TW377520B TW 377520 B TW377520 B TW 377520B TW 086119849 A TW086119849 A TW 086119849A TW 86119849 A TW86119849 A TW 86119849A TW 377520 B TW377520 B TW 377520B
- Authority
- TW
- Taiwan
- Prior art keywords
- unit substrate
- led chip
- same
- light
- display element
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 6
- 238000000034 method Methods 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000013078 crystal Substances 0.000 abstract 1
- 239000011159 matrix material Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35137496 | 1996-12-27 | ||
JP29295897A JP3337405B2 (ja) | 1996-12-27 | 1997-10-24 | 発光表示素子およびその電気配線基板への接続方法ならびに製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW377520B true TW377520B (en) | 1999-12-21 |
Family
ID=26559192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086119849A TW377520B (en) | 1996-12-27 | 1997-12-27 | Light-producing display element, method for connecting same to electric wiring substrate and method for manufacturing same |
Country Status (6)
Country | Link |
---|---|
US (1) | US6018167A (zh) |
JP (1) | JP3337405B2 (zh) |
KR (1) | KR100296202B1 (zh) |
CN (1) | CN1155113C (zh) |
DE (1) | DE19757850A1 (zh) |
TW (1) | TW377520B (zh) |
Families Citing this family (51)
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JP3343071B2 (ja) * | 1998-03-03 | 2002-11-11 | 富士写真フイルム株式会社 | 撮像素子の実装方法 |
US6392778B1 (en) | 1999-03-17 | 2002-05-21 | Koninklijke Philips Electronics N.V. | Opto-electronic element |
KR100832956B1 (ko) * | 2000-04-24 | 2008-05-27 | 로무 가부시키가이샤 | 측면발광반도체 발광장치 |
US6952025B2 (en) | 2000-06-08 | 2005-10-04 | Showa Denko K.K. | Semiconductor light-emitting device |
JP2002093202A (ja) * | 2000-09-13 | 2002-03-29 | Ryoden Trading Co Ltd | 面発光バックライト装置の製造方法及び面発光バックライト装置 |
JP3930710B2 (ja) * | 2000-09-13 | 2007-06-13 | シチズン電子株式会社 | チップ型発光ダイオード及びその製造方法 |
US6630203B2 (en) | 2001-06-15 | 2003-10-07 | Nanopierce Technologies, Inc. | Electroless process for the preparation of particle enhanced electric contact surfaces |
CN1636167A (zh) * | 2000-10-24 | 2005-07-06 | 纳诺皮尔斯技术公司 | 用于印刷微粒改良的电触点的方法和材料 |
US20020079505A1 (en) * | 2000-12-21 | 2002-06-27 | Stefan Becker | Semiconductor light unit and method for production of the same |
WO2002067017A2 (en) * | 2001-01-22 | 2002-08-29 | Nanopierce Technologies, Inc. | Optical device module and method of fabrication |
JP3747807B2 (ja) * | 2001-06-12 | 2006-02-22 | ソニー株式会社 | 素子実装基板及び不良素子の修復方法 |
JP3696131B2 (ja) * | 2001-07-10 | 2005-09-14 | 株式会社東芝 | アクティブマトリクス基板及びその製造方法 |
DE10228446A1 (de) * | 2002-06-26 | 2004-01-15 | Hella Kg Hueck & Co. | Anordnung mit elektrischen Bauteilen |
TW200509329A (en) * | 2003-08-26 | 2005-03-01 | Yung-Shu Yang | LED package material and process |
DE10339982B4 (de) * | 2003-08-29 | 2009-10-08 | Osram Opto Semiconductors Gmbh | Verfahren zum Aufbringen einer Antireflexschicht auf eine Mehrzahl von strahlungsemittierenden Halbleiterchips |
DE102004052688B4 (de) * | 2004-10-29 | 2007-06-28 | Osram Opto Semiconductors Gmbh | Lumineszenzdiodenchip sowie optoelektronisches Bauteil mit solch einem Lumineszenzdiodenchip |
CN100452452C (zh) * | 2005-05-17 | 2009-01-14 | 财团法人工业技术研究院 | 备有发光二极管的翻转侧置结构的发光装置 |
DE102005041064B4 (de) * | 2005-08-30 | 2023-01-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
JPWO2007083378A1 (ja) * | 2006-01-20 | 2009-06-11 | 富士通株式会社 | チップ部品の実装構造、実装方法及び電子装置 |
US7847306B2 (en) * | 2006-10-23 | 2010-12-07 | Hong Kong Applied Science and Technology Research Insitute Company, Ltd. | Light emitting diode device, method of fabrication and use thereof |
KR100845089B1 (ko) | 2007-02-08 | 2008-07-09 | 충북대학교 산학협력단 | 발광다이오드의 인캡슐레이션 방법 |
DE102007009351A1 (de) * | 2007-02-23 | 2008-08-28 | Noctron Holding S.A. | Leuchtmittel |
DE102007022947B4 (de) | 2007-04-26 | 2022-05-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
DE102007019776A1 (de) | 2007-04-26 | 2008-10-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente |
DE102007035896A1 (de) * | 2007-07-31 | 2009-02-05 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper und optoelektronisches Bauelement |
CN101499504B (zh) * | 2008-01-28 | 2012-10-10 | 晶元光电股份有限公司 | 发光元件的封装结构 |
DE102008025318A1 (de) * | 2008-05-27 | 2009-12-10 | Setrinx S.A.R.L. | Leuchtchip und Leuchtvorrichtung mit einem solchen |
DE102008031930B4 (de) * | 2008-07-08 | 2014-09-25 | Rüdiger Lanz | Beleuchtungsvorrichtung mit Mikro-Linsenarray |
JP5262533B2 (ja) * | 2008-09-30 | 2013-08-14 | 豊田合成株式会社 | 半導体装置の製造方法 |
WO2010119395A1 (en) * | 2009-04-17 | 2010-10-21 | Koninklijke Philips Electronics N.V. | Transparent oled device with high intensity |
CN101969093A (zh) * | 2010-08-16 | 2011-02-09 | 中微光电子(潍坊)有限公司 | 一种led器件 |
US9070851B2 (en) | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
JP5537446B2 (ja) * | 2011-01-14 | 2014-07-02 | 株式会社東芝 | 発光装置、発光モジュール、発光装置の製造方法 |
CN102299120A (zh) * | 2011-05-20 | 2011-12-28 | 电子科技大学 | 一种光电子器件的封装方法 |
CN102299121A (zh) * | 2011-05-20 | 2011-12-28 | 电子科技大学 | 一种光电子器件的封装方法 |
CN102299119A (zh) * | 2011-05-20 | 2011-12-28 | 电子科技大学 | 一种光电子器件的封装方法 |
CN102299122A (zh) * | 2011-05-20 | 2011-12-28 | 电子科技大学 | 一种光电子器件的封装方法 |
CN102299118A (zh) * | 2011-05-20 | 2011-12-28 | 电子科技大学 | 一种光电子器件的封装方法 |
CN103733361B (zh) * | 2011-08-08 | 2016-06-29 | 旭硝子株式会社 | 玻璃陶瓷体、发光元件搭载用基板、和发光装置 |
DE102013202910A1 (de) * | 2013-02-22 | 2014-09-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
CN104409583A (zh) * | 2014-12-25 | 2015-03-11 | 湘能华磊光电股份有限公司 | 一种半导体芯片的制造方法 |
CN105140374A (zh) * | 2015-08-13 | 2015-12-09 | 山东浪潮华光光电子股份有限公司 | 一种免打线led封装结构及其制备方法 |
CN205944139U (zh) | 2016-03-30 | 2017-02-08 | 首尔伟傲世有限公司 | 紫外线发光二极管封装件以及包含此的发光二极管模块 |
KR102699567B1 (ko) | 2016-07-11 | 2024-08-29 | 삼성디스플레이 주식회사 | 초소형 발광 소자를 포함하는 픽셀 구조체, 표시장치 및 그 제조방법 |
DE102016114277B4 (de) | 2016-08-02 | 2021-08-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Lichtemittierendes Bauteil |
DE102016122810A1 (de) * | 2016-11-25 | 2018-05-30 | Osram Opto Semiconductors Gmbh | Bauteil mit einem lichtemittierenden halbleiterchip |
EP3396725B1 (en) * | 2017-04-25 | 2021-01-13 | Nichia Corporation | Light emitting device and method of manufacturing same |
CN107895756A (zh) * | 2017-10-17 | 2018-04-10 | 丽智电子(昆山)有限公司 | 一种发光二极管器件 |
KR102540894B1 (ko) * | 2018-07-05 | 2023-06-09 | 삼성디스플레이 주식회사 | 발광장치 및 그의 제조방법 |
KR102559097B1 (ko) * | 2018-07-27 | 2023-07-26 | 삼성디스플레이 주식회사 | 발광 장치, 그의 제조 방법, 및 이를 구비한 표시 장치 |
DE102018118762A1 (de) | 2018-08-02 | 2020-02-06 | Osram Opto Semiconductors Gmbh | Laserbauelement mit einem Laserchip |
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JPS5310862Y2 (zh) * | 1972-12-28 | 1978-03-23 | ||
JPS52137279A (en) * | 1976-05-12 | 1977-11-16 | Hitachi Ltd | Semiconductor device for optical coupling |
US4143385A (en) * | 1976-09-30 | 1979-03-06 | Hitachi, Ltd. | Photocoupler |
JPS5422186A (en) * | 1977-07-20 | 1979-02-19 | Matsushita Electric Ind Co Ltd | Light emitting diode device |
JPS5644591A (en) * | 1979-09-20 | 1981-04-23 | Shinobu Akima | Pipe body for heat exchanger |
JPS5749284A (en) * | 1980-09-09 | 1982-03-23 | Matsushita Electric Ind Co Ltd | Manufacture of light-emitting display device |
US4709253A (en) * | 1986-05-02 | 1987-11-24 | Amp Incorporated | Surface mountable diode |
US5265792A (en) * | 1992-08-20 | 1993-11-30 | Hewlett-Packard Company | Light source and technique for mounting light emitting diodes |
JP3022049B2 (ja) * | 1993-05-14 | 2000-03-15 | シャープ株式会社 | チップ部品型の発光ダイオードの実装方法 |
JPH077185A (ja) * | 1993-06-15 | 1995-01-10 | Stanley Electric Co Ltd | Led発光ユニット |
US5440575A (en) * | 1994-04-06 | 1995-08-08 | At&T Corp. | Article comprising a semiconductor laser with stble facet coating |
JP3299839B2 (ja) * | 1994-04-08 | 2002-07-08 | シャープ株式会社 | 半導体発光素子の製造方法 |
JP3127195B2 (ja) * | 1994-12-06 | 2001-01-22 | シャープ株式会社 | 発光デバイスおよびその製造方法 |
JP3195720B2 (ja) * | 1994-12-20 | 2001-08-06 | シャープ株式会社 | 多色led素子およびその多色led素子を用いたled表示装置、並びに多色led素子の製造方法 |
US5861636A (en) * | 1995-04-11 | 1999-01-19 | Nec Corporation | Surface emitting visible light emiting diode having ring-shaped electrode |
JP3129944B2 (ja) * | 1995-08-10 | 2001-01-31 | シャープ株式会社 | 半導体発光素子およびその製造方法 |
-
1997
- 1997-10-24 JP JP29295897A patent/JP3337405B2/ja not_active Expired - Fee Related
- 1997-12-24 DE DE19757850A patent/DE19757850A1/de not_active Ceased
- 1997-12-27 KR KR1019970082674A patent/KR100296202B1/ko not_active IP Right Cessation
- 1997-12-27 CN CNB971297169A patent/CN1155113C/zh not_active Expired - Fee Related
- 1997-12-27 TW TW086119849A patent/TW377520B/zh not_active IP Right Cessation
- 1997-12-29 US US08/998,713 patent/US6018167A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH10242533A (ja) | 1998-09-11 |
KR100296202B1 (ko) | 2001-10-25 |
US6018167A (en) | 2000-01-25 |
JP3337405B2 (ja) | 2002-10-21 |
KR19980064844A (ko) | 1998-10-07 |
CN1155113C (zh) | 2004-06-23 |
DE19757850A1 (de) | 1998-07-02 |
CN1189702A (zh) | 1998-08-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |