TW368603B - Testing apparatus for semiconductor device - Google Patents

Testing apparatus for semiconductor device

Info

Publication number
TW368603B
TW368603B TW086111397A TW86111397A TW368603B TW 368603 B TW368603 B TW 368603B TW 086111397 A TW086111397 A TW 086111397A TW 86111397 A TW86111397 A TW 86111397A TW 368603 B TW368603 B TW 368603B
Authority
TW
Taiwan
Prior art keywords
testing
semiconductor device
tested semiconductor
zone
conductive
Prior art date
Application number
TW086111397A
Other languages
English (en)
Inventor
Akihiko Ito
Yoshihito Kobayashi
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Application granted granted Critical
Publication of TW368603B publication Critical patent/TW368603B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW086111397A 1996-08-09 1997-08-08 Testing apparatus for semiconductor device TW368603B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21158496 1996-08-09

Publications (1)

Publication Number Publication Date
TW368603B true TW368603B (en) 1999-09-01

Family

ID=16608192

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086111397A TW368603B (en) 1996-08-09 1997-08-08 Testing apparatus for semiconductor device

Country Status (7)

Country Link
US (1) US6320398B1 (zh)
KR (1) KR100393316B1 (zh)
CN (1) CN1083985C (zh)
AU (1) AU3785097A (zh)
MY (1) MY120128A (zh)
TW (1) TW368603B (zh)
WO (1) WO1998007041A1 (zh)

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US6731127B2 (en) * 2001-12-21 2004-05-04 Texas Instruments Incorporated Parallel integrated circuit test apparatus and test method
US6897670B2 (en) 2001-12-21 2005-05-24 Texas Instruments Incorporated Parallel integrated circuit test apparatus and test method
US6756800B2 (en) * 2002-04-16 2004-06-29 Teradyne, Inc. Semiconductor test system with easily changed interface unit
AU2002368120A1 (en) * 2002-07-30 2004-02-16 Advantest Corporation Electronic device test system
DE10392309T5 (de) * 2002-10-31 2005-01-05 Advantest Corp. Eine Anschlusseinheit, eine Platine zum Befestigen eines Prüflings, eine Nadelkarte und eine Bauelemente-Schnittstellenpartie
JP2005055330A (ja) * 2003-08-06 2005-03-03 Elpida Memory Inc 半導体装置への加圧装置
KR100685223B1 (ko) * 2003-08-08 2007-02-22 브레인파워컴퍼니 인쇄회로기판의 검사방법
US7208936B2 (en) * 2004-04-12 2007-04-24 Intel Corporation Socket lid and test device
DE102005007593B4 (de) * 2005-02-18 2008-05-29 Qimonda Ag Sockel-Vorrichtung zum Testen von Halbleiter-Bauelementen und Verfahren zum Aufnehmen eines Halbleiter-Bauelements in einer Sockel-Vorrichtung
US7528617B2 (en) * 2006-03-07 2009-05-05 Testmetrix, Inc. Apparatus having a member to receive a tray(s) that holds semiconductor devices for testing
KR100817054B1 (ko) * 2006-07-13 2008-03-26 삼성전자주식회사 패키지 테스트용 소켓, 테스트 소켓용 러버 및 테스트소켓용 가이드
JP4912080B2 (ja) * 2006-08-16 2012-04-04 株式会社アドバンテスト 電子部品ハンドリング装置およびその運用方法、ならびに試験用トレイおよびプッシャ
MY152599A (en) * 2007-02-14 2014-10-31 Eles Semiconductor Equipment S P A Test of electronic devices at package level using test boards without sockets
EP1959265A1 (en) * 2007-02-16 2008-08-20 Eles Semiconductor Equipment S.P.A. Testing integrated circuits on a wafer with a cartridge leaving exposed a surface thereof
US20090194872A1 (en) * 2008-01-31 2009-08-06 Broadcom Corporation Depopulating integrated circuit package ball locations to enable improved edge clearance in shipping tray
KR101534487B1 (ko) * 2009-07-01 2015-07-08 삼성전자주식회사 반도체 소자 및 반도체 소자의 프로브 핀 정렬 검사 방법.
FR2958756B1 (fr) * 2010-04-09 2013-02-08 European Aeronautic Defence & Space Co Eads France Systeme de test d'un composant electronique haute frequence
KR101499574B1 (ko) * 2010-06-15 2015-03-10 (주)테크윙 모듈아이씨 핸들러 및 모듈아이씨 핸들러에서의 로딩방법
JP5414739B2 (ja) * 2011-05-25 2014-02-12 三菱電機株式会社 半導体テスト治具
TWM425277U (en) * 2011-05-27 2012-03-21 Tek Crown Technology Co Ltd Testing connector for fast detaching and assembling electrical connection module
CN103116119A (zh) * 2011-11-17 2013-05-22 上海航天测控通信研究所 基于hm276层叠式电子产品的测试台及其测试方法
KR101164116B1 (ko) * 2012-02-29 2012-07-12 주식회사 유니테스트 번인 테스터용 테스트보드
WO2013168196A1 (ja) * 2012-05-10 2013-11-14 ユニテクノ株式会社 半導体搬送テスト治具
CN102707219A (zh) * 2012-06-21 2012-10-03 上海华岭集成电路技术股份有限公司 用于半导体器件测试的测试装置
US8466705B1 (en) * 2012-09-27 2013-06-18 Exatron, Inc. System and method for analyzing electronic devices having a cab for holding electronic devices
CN104576467B (zh) * 2015-01-05 2019-02-15 武汉新芯集成电路制造有限公司 一种快速装载sop芯片的模具
KR101780935B1 (ko) * 2016-03-30 2017-09-27 리노공업주식회사 검사소켓유니트
CN106483343A (zh) * 2016-11-03 2017-03-08 苏州创瑞机电科技有限公司 带加热功能的手动直针测试插座
CN113687111B (zh) * 2021-08-26 2024-02-06 深圳市佳润芯电子科技有限公司 一种能够调节方位坐标的集成电路板测试装置

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US4778950A (en) * 1985-07-22 1988-10-18 Digital Equipment Corporation Anisotropic elastomeric interconnecting system
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JPH04349057A (ja) 1991-05-27 1992-12-03 Fujitsu Ten Ltd アンチスキッド制御装置
US5227717A (en) * 1991-12-03 1993-07-13 Sym-Tek Systems, Inc. Contact assembly for automatic test handler
US5313156A (en) * 1991-12-04 1994-05-17 Advantest Corporation Apparatus for automatic handling
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US5419710A (en) * 1994-06-10 1995-05-30 Pfaff; Wayne K. Mounting apparatus for ball grid array device
JPH08194032A (ja) * 1995-01-18 1996-07-30 Advantest Corp Ｉｃテスタ用水平搬送型ハンドラ
JP2899543B2 (ja) * 1995-06-08 1999-06-02 信越ポリマー株式会社 半導体パッケージ接続用ソケット
JPH0933606A (ja) * 1995-07-20 1997-02-07 Shin Etsu Polymer Co Ltd 半導体素子検査用治具
JP2682521B2 (ja) * 1995-10-06 1997-11-26 日本電気株式会社 半導体装置用包装部材及びこれを用いた半導体装置のテスト方法
US5966022A (en) * 1996-11-08 1999-10-12 W. L. Gore & Associates, Inc. Wafer level burn-in system
MY128129A (en) * 1997-09-16 2007-01-31 Tan Yin Leong Electrical contactor for testing integrated circuit devices

Also Published As

Publication number Publication date
AU3785097A (en) 1998-03-06
US6320398B1 (en) 2001-11-20
CN1198817A (zh) 1998-11-11
KR19990064101A (ko) 1999-07-26
WO1998007041A1 (fr) 1998-02-19
MY120128A (en) 2005-09-30
CN1083985C (zh) 2002-05-01
KR100393316B1 (ko) 2003-09-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees