TW344089B - Loading and unloading station for semiconductor processing installations - Google Patents

Loading and unloading station for semiconductor processing installations

Info

Publication number
TW344089B
TW344089B TW085101887A TW85101887A TW344089B TW 344089 B TW344089 B TW 344089B TW 085101887 A TW085101887 A TW 085101887A TW 85101887 A TW85101887 A TW 85101887A TW 344089 B TW344089 B TW 344089B
Authority
TW
Taiwan
Prior art keywords
container
semiconductor processing
loading
transporting
unloading station
Prior art date
Application number
TW085101887A
Other languages
Chinese (zh)
Inventor
Mages Andreas
Scheler Werner
Blaschitz Herbert
Schulz Alfred
Schneider Heinz
Original Assignee
Jenoptik Jena Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenoptik Jena Gmbh filed Critical Jenoptik Jena Gmbh
Application granted granted Critical
Publication of TW344089B publication Critical patent/TW344089B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Abstract

A loading and unloading station for semiconductor processing installations having a sealable charging opening through which disk-shaped objects in a transporting container can be reloaded after an enclosing member has been removed, in which the transporting container has a container cover perpendicular to a reload plane through substantially the whole length, which is characterized in that, during reloading of the disk-shaped objects, the container cover of the transporting container engages with and links to the enclosure member such that the container cover and the enclosure member are jointly taken off to the semiconductor processing installation and the charging opening and the transport container can be opened simultaneously; and the reloading is carried out by extending an operation device into the charging opening, the operation device being installed on the semiconductor processing installation; in which the transporting container and the enclosing member are coupled with each other and placed on a first platform of the transporting container which is horizontally movable and aligned and fastened by a method.
TW085101887A 1995-03-28 1996-02-15 Loading and unloading station for semiconductor processing installations TW344089B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19511024 1995-03-28
DE19542646A DE19542646C2 (en) 1995-03-28 1995-11-15 Loading and unloading station for semiconductor processing systems

Publications (1)

Publication Number Publication Date
TW344089B true TW344089B (en) 1998-11-01

Family

ID=7757757

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085101887A TW344089B (en) 1995-03-28 1996-02-15 Loading and unloading station for semiconductor processing installations

Country Status (4)

Country Link
JP (1) JP5020994B2 (en)
KR (1) KR100271586B1 (en)
DE (1) DE19542646C2 (en)
TW (1) TW344089B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW344847B (en) 1996-08-29 1998-11-11 Tokyo Electron Co Ltd Substrate treatment system, substrate transfer system, and substrate transfer method
DE19805624A1 (en) 1998-02-12 1999-09-23 Acr Automation In Cleanroom Lock for opening and closing clean room transport boxes
DE19806231C1 (en) * 1998-02-16 1999-07-22 Jenoptik Jena Gmbh Device for gripping an object by a gripping component with interacting adjustable gripping components
US6368040B1 (en) 1998-02-18 2002-04-09 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
US6106213A (en) * 1998-02-27 2000-08-22 Pri Automation, Inc. Automated door assembly for use in semiconductor wafer manufacturing
DE19813684C2 (en) 1998-03-27 2001-08-16 Brooks Automation Gmbh Device for receiving transport containers at a loading and unloading station
DE19826949A1 (en) * 1998-06-17 1999-12-23 Georg Kunkel Conveyor for plate-shaped substrates
WO2000033376A1 (en) * 1998-12-02 2000-06-08 Dainichi Shoji K.K. Container
DE19951200C2 (en) * 1999-10-22 2003-01-30 Ortner Cls Gmbh Cleanroom Logi transport device
DE10119702A1 (en) * 2001-04-20 2002-10-24 Brooks Automation Gmbh Device for testing the latching force for the latches of clean room transport boxes
JP4821756B2 (en) * 2007-10-19 2011-11-24 東京エレクトロン株式会社 To-be-processed object transfer mechanism, to-be-processed object transfer method, and to-be-processed object processing system
DE102018206618B3 (en) * 2018-04-27 2019-05-23 Fabmatics Gmbh Device and method for opening and closing a transport box
CN115057081A (en) * 2022-06-23 2022-09-16 上海大族富创得科技有限公司 Light shield storage box opening and closing device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758127A (en) * 1983-06-24 1988-07-19 Canon Kabushiki Kaisha Original feeding apparatus and a cassette for containing the original
JPS62264637A (en) * 1986-05-12 1987-11-17 Nec Corp Interface for integrated circuit processing
JPS6328046A (en) * 1986-07-22 1988-02-05 Toshiba Mach Co Ltd Casette conveying box
US5186594A (en) * 1990-04-19 1993-02-16 Applied Materials, Inc. Dual cassette load lock
DE4024973C2 (en) * 1990-08-07 1994-11-03 Ibm Arrangement for storing, transporting and introducing substrates
JPH04360545A (en) * 1991-06-07 1992-12-14 Sharp Corp Parts supplying equipment
JPH081923B2 (en) * 1991-06-24 1996-01-10 ティーディーケイ株式会社 Clean transfer method and device
JP3084828B2 (en) * 1991-09-20 2000-09-04 神鋼電機株式会社 Mechanical interface device
JPH05109863A (en) * 1991-10-17 1993-04-30 Shinko Electric Co Ltd Mechanical interface device
JPH05338728A (en) * 1992-06-05 1993-12-21 Fujitsu Ltd Wafer carrying method and device thereof
JP3162852B2 (en) * 1993-01-19 2001-05-08 日置電機株式会社 Magazine rack feeder for circuit board inspection machine
JPH0714906A (en) * 1993-06-21 1995-01-17 Shinko Electric Co Ltd Opening and closing mechanism for lid of portable closed container
DE4326309C1 (en) * 1993-08-05 1994-09-15 Jenoptik Jena Gmbh Device for transferring wafer magazines

Also Published As

Publication number Publication date
DE19542646C2 (en) 2003-04-30
DE19542646A1 (en) 1996-10-02
JP2009170945A (en) 2009-07-30
KR960035954A (en) 1996-10-28
JP5020994B2 (en) 2012-09-05
KR100271586B1 (en) 2000-11-15

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Legal Events

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MK4A Expiration of patent term of an invention patent