DE69330742D1 - Halbleiterscheiben-Speicherkassette Apparat und Transfereinrichtung für direkte Ladung und Entladung - Google Patents

Halbleiterscheiben-Speicherkassette Apparat und Transfereinrichtung für direkte Ladung und Entladung

Info

Publication number
DE69330742D1
DE69330742D1 DE69330742T DE69330742T DE69330742D1 DE 69330742 D1 DE69330742 D1 DE 69330742D1 DE 69330742 T DE69330742 T DE 69330742T DE 69330742 T DE69330742 T DE 69330742T DE 69330742 D1 DE69330742 D1 DE 69330742D1
Authority
DE
Germany
Prior art keywords
unloading
semiconductor wafer
transfer device
storage cassette
wafer storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69330742T
Other languages
English (en)
Other versions
DE69330742T2 (de
Inventor
Howard E Grunes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69330742D1 publication Critical patent/DE69330742D1/de
Publication of DE69330742T2 publication Critical patent/DE69330742T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
DE69330742T 1993-01-14 1993-12-30 Halbleiterscheiben-Speicherkassette Apparat und Transfereinrichtung für direkte Ladung und Entladung Expired - Fee Related DE69330742T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/004,331 US5387067A (en) 1993-01-14 1993-01-14 Direct load/unload semiconductor wafer cassette apparatus and transfer system

Publications (2)

Publication Number Publication Date
DE69330742D1 true DE69330742D1 (de) 2001-10-18
DE69330742T2 DE69330742T2 (de) 2002-07-04

Family

ID=21710239

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69330742T Expired - Fee Related DE69330742T2 (de) 1993-01-14 1993-12-30 Halbleiterscheiben-Speicherkassette Apparat und Transfereinrichtung für direkte Ladung und Entladung

Country Status (5)

Country Link
US (2) US5387067A (de)
EP (1) EP0606655B1 (de)
JP (1) JPH06271004A (de)
KR (1) KR100279955B1 (de)
DE (1) DE69330742T2 (de)

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US5898588A (en) * 1995-10-27 1999-04-27 Dainippon Screen Mfg. Co. Method and apparatus for controlling substrate processing apparatus
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US5830272A (en) * 1995-11-07 1998-11-03 Sputtered Films, Inc. System for and method of providing a controlled deposition on wafers
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US6135051A (en) * 1996-09-17 2000-10-24 Shamrock Technology Corp. End effector assembly for inclusion in a system for producing uniform deposits on a wafer
US5997235A (en) * 1996-09-20 1999-12-07 Brooks Automation, Inc. Swap out plate and assembly
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JPH10139159A (ja) * 1996-11-13 1998-05-26 Tokyo Electron Ltd カセットチャンバ及びカセット搬入搬出機構
DE19752510B4 (de) * 1997-11-27 2005-11-24 Brooks Automation (Germany) Gmbh Einrichtung und Verfahren zur Erkennung und Unterscheidung geometrisch verschiedener Arten von fächerbildenden Auflagen in Kassetten und darauf abgelegten scheibenförmigen Objekten
EP1004524B1 (de) * 1998-02-06 2014-12-31 Sumco Corporation Behälter zum tragen von blättern
US6079927A (en) * 1998-04-22 2000-06-27 Varian Semiconductor Equipment Associates, Inc. Automated wafer buffer for use with wafer processing equipment
US6217272B1 (en) 1998-10-01 2001-04-17 Applied Science And Technology, Inc. In-line sputter deposition system
US6328858B1 (en) 1998-10-01 2001-12-11 Nexx Systems Packaging, Llc Multi-layer sputter deposition apparatus
WO2000028587A1 (fr) 1998-11-09 2000-05-18 Tokyo Electron Limited Dispositif de traitement
US6302960B1 (en) 1998-11-23 2001-10-16 Applied Materials, Inc. Photoresist coater
ATE389237T1 (de) 1998-12-02 2008-03-15 Newport Corp Armgreiforgan für probehalteroboter
US6256555B1 (en) 1998-12-02 2001-07-03 Newport Corporation Robot arm with specimen edge gripping end effector
US6358128B1 (en) * 1999-03-05 2002-03-19 Ebara Corporation Polishing apparatus
US6092981A (en) * 1999-03-11 2000-07-25 Applied Materials, Inc. Modular substrate cassette
US6763281B2 (en) 1999-04-19 2004-07-13 Applied Materials, Inc Apparatus for alignment of automated workpiece handling systems
TW469483B (en) * 1999-04-19 2001-12-21 Applied Materials Inc Method and apparatus for aligning a cassette
US6151864A (en) * 1999-04-28 2000-11-28 Semiconductor Technologies & Instruments System and method for transferring components between packing media
US6357996B2 (en) 1999-05-14 2002-03-19 Newport Corporation Edge gripping specimen prealigner
US6682288B2 (en) 2000-07-27 2004-01-27 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6821912B2 (en) 2000-07-27 2004-11-23 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6530733B2 (en) 2000-07-27 2003-03-11 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US20040026036A1 (en) * 2001-02-23 2004-02-12 Hitachi Kokusai Electric Inc. Substrate processing apparatus and substrate processing method
JP4219579B2 (ja) * 2001-07-24 2009-02-04 東京エレクトロン株式会社 ウエハ移載システム及びウエハ移載方法、並びに無人搬送車システム
US7121414B2 (en) * 2001-12-28 2006-10-17 Brooks Automation, Inc. Semiconductor cassette reducer
DE10247051A1 (de) * 2002-10-09 2004-04-22 Polymer Latex Gmbh & Co Kg Latex und Verfahren zu seiner Herstellung
US6916147B2 (en) * 2002-10-25 2005-07-12 Applied Materials, Inc. Substrate storage cassette with substrate alignment feature
US7100954B2 (en) * 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
US20060045668A1 (en) * 2004-07-19 2006-03-02 Grabowski Al W System for handling of wafers within a process tool
CN2762903Y (zh) * 2004-12-30 2006-03-08 鸿富锦精密工业（深圳）有限公司 光学元件清洗机构
JP4523513B2 (ja) * 2005-08-05 2010-08-11 東京エレクトロン株式会社 基板受け渡し装置、基板受け渡し方法及び記憶媒体
JP4614455B2 (ja) 2006-04-19 2011-01-19 東京エレクトロン株式会社 基板搬送処理装置
US7547897B2 (en) * 2006-05-26 2009-06-16 Cree, Inc. High-temperature ion implantation apparatus and methods of fabricating semiconductor devices using high-temperature ion implantation
KR100806250B1 (ko) * 2007-01-17 2008-02-22 (주)인터노바 로드포트 직결식 로드락 챔버를 위한 풉 적재장치
JP4599431B2 (ja) * 2008-05-26 2010-12-15 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
US8246284B2 (en) 2009-03-05 2012-08-21 Applied Materials, Inc. Stacked load-lock apparatus and method for high throughput solar cell manufacturing
US8215890B2 (en) * 2009-03-12 2012-07-10 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor wafer robot alignment system and method
DE102012012088A1 (de) * 2012-06-18 2013-12-19 Jean-Paul Theis Verfahren zum Herstellen von Halbleiterdünnschichten auf Fremdsubstraten
KR20200000638A (ko) * 2018-06-25 2020-01-03 주성엔지니어링(주) 기판 처리 장치 및 기판 처리 방법
CN112786500A (zh) * 2019-11-11 2021-05-11 夏泰鑫半导体(青岛)有限公司 晶圆架及具有晶圆架的垂直晶舟
TWI751814B (zh) * 2020-09-22 2022-01-01 家登精密工業股份有限公司 支撐片狀物的中央支撐裝置及存放片狀物的儲存設備

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US4605469A (en) * 1983-11-10 1986-08-12 Texas Instruments Incorporated MBE system with in-situ mounting
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JP3006714B2 (ja) * 1988-12-02 2000-02-07 東京エレクトロン株式会社 縦型基板移載装置及び縦型熱処理装置並びに縦型熱処理装置における基板移載方法
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Also Published As

Publication number Publication date
DE69330742T2 (de) 2002-07-04
EP0606655B1 (de) 2001-09-12
US5556248A (en) 1996-09-17
US5387067A (en) 1995-02-07
JPH06271004A (ja) 1994-09-27
EP0606655A1 (de) 1994-07-20
KR940018900A (ko) 1994-08-19
KR100279955B1 (ko) 2001-03-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee