GB2288063B - Tape tensioning device for semiconductor wafers - Google Patents

Tape tensioning device for semiconductor wafers

Info

Publication number
GB2288063B
GB2288063B GB9410088A GB9410088A GB2288063B GB 2288063 B GB2288063 B GB 2288063B GB 9410088 A GB9410088 A GB 9410088A GB 9410088 A GB9410088 A GB 9410088A GB 2288063 B GB2288063 B GB 2288063B
Authority
GB
United Kingdom
Prior art keywords
tensioning device
semiconductor wafers
tape tensioning
tape
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9410088A
Other versions
GB2288063A (en
GB9410088D0 (en
Inventor
Masahiro Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teikoku Seiki KK
Original Assignee
Teikoku Seiki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teikoku Seiki KK filed Critical Teikoku Seiki KK
Publication of GB9410088D0 publication Critical patent/GB9410088D0/en
Publication of GB2288063A publication Critical patent/GB2288063A/en
Application granted granted Critical
Publication of GB2288063B publication Critical patent/GB2288063B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/02—Registering, tensioning, smoothing or guiding webs transversely
    • B65H23/022—Registering, tensioning, smoothing or guiding webs transversely by tentering devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/048—Registering, tensioning, smoothing or guiding webs longitudinally by positively actuated movable bars or rollers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GB9410088A 1994-03-22 1994-05-19 Tape tensioning device for semiconductor wafers Expired - Fee Related GB2288063B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7654294A JPH07263524A (en) 1994-03-22 1994-03-22 Tape stretching device in semiconductor fabrication apparatus, and semiconductor fabrication apparatus including the tape stretching device
FR9407584A FR2721295B1 (en) 1994-03-22 1994-06-21 A band extension device for a semiconductor production apparatus and a semiconductor production apparatus comprising this band extension device.

Publications (3)

Publication Number Publication Date
GB9410088D0 GB9410088D0 (en) 1994-07-06
GB2288063A GB2288063A (en) 1995-10-04
GB2288063B true GB2288063B (en) 1998-04-01

Family

ID=26231246

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9410088A Expired - Fee Related GB2288063B (en) 1994-03-22 1994-05-19 Tape tensioning device for semiconductor wafers

Country Status (4)

Country Link
JP (1) JPH07263524A (en)
DE (1) DE4423879A1 (en)
FR (1) FR2721295B1 (en)
GB (1) GB2288063B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100468748B1 (en) * 2002-07-12 2005-01-29 삼성전자주식회사 Dicing tape mounter applicable a pre-cut dicing tape and general dicing tape and In-line system having the dicing tape mounter
JP2010087265A (en) * 2008-09-30 2010-04-15 Takatori Corp Adhesive tape affixing device to substrate
JP2012129473A (en) * 2010-12-17 2012-07-05 Sekisui Chem Co Ltd Dicing-die bonding tape
JP6059921B2 (en) * 2012-08-31 2017-01-11 日東電工株式会社 Adhesive tape application method and adhesive tape application device
JP6234161B2 (en) * 2013-10-24 2017-11-22 株式会社ディスコ Adhesive tape sticking device
JP6941022B2 (en) * 2017-10-06 2021-09-29 株式会社ディスコ Expansion method and expansion device
CN112981918B (en) * 2021-02-24 2021-12-28 上海工程技术大学 A processingequipment for abandonment clothing

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2128580A (en) * 1982-09-06 1984-05-02 Kulicke & Soffa Handling system for laminar objects
JPS6449887A (en) * 1987-08-20 1989-02-27 Nitto Denko Corp Pasting device of frame to mount semiconductor wafer
JPH02214134A (en) * 1989-02-15 1990-08-27 Nitto Denko Corp Apparatus for applying tension to adhesive tape in semiconductor-wafer mounter

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5915385B2 (en) * 1978-11-02 1984-04-09 住友金属鉱山株式会社 Tape pasting device
JPS5851530A (en) * 1981-09-22 1983-03-26 Toshiba Corp Apparatus and method of arranging semiconductor pellet
JPH01143211A (en) * 1987-11-27 1989-06-05 Takatori Haitetsuku:Kk Sticking and cutting of protective tape for wafer and device therefor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2128580A (en) * 1982-09-06 1984-05-02 Kulicke & Soffa Handling system for laminar objects
JPS6449887A (en) * 1987-08-20 1989-02-27 Nitto Denko Corp Pasting device of frame to mount semiconductor wafer
JPH02214134A (en) * 1989-02-15 1990-08-27 Nitto Denko Corp Apparatus for applying tension to adhesive tape in semiconductor-wafer mounter

Also Published As

Publication number Publication date
GB2288063A (en) 1995-10-04
JPH07263524A (en) 1995-10-13
FR2721295A1 (en) 1995-12-22
GB9410088D0 (en) 1994-07-06
DE4423879A1 (en) 1995-09-28
FR2721295B1 (en) 1996-09-06

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19990519