FR2958756B1 - Systeme de test d'un composant electronique haute frequence - Google Patents
Systeme de test d'un composant electronique haute frequenceInfo
- Publication number
- FR2958756B1 FR2958756B1 FR1052697A FR1052697A FR2958756B1 FR 2958756 B1 FR2958756 B1 FR 2958756B1 FR 1052697 A FR1052697 A FR 1052697A FR 1052697 A FR1052697 A FR 1052697A FR 2958756 B1 FR2958756 B1 FR 2958756B1
- Authority
- FR
- France
- Prior art keywords
- extenders
- bga
- test system
- testing
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004606 Fillers/Extenders Substances 0.000 abstract 3
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/045—Sockets or component fixtures for RF or HF testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
La présente invention concerne un système de test (20) de circuits intégrés (13) encapsulés à l'intérieur de boîtiers (10) de type BGA. L'invention propose un système de test comportant des prolongateurs (23) électriques destinés à raccorder électriquement chacune des billes (15) de connexions du boîtier de type BGA à un dispositif de mesure (24) du système de test. Ledit système est configuré de sorte que les prolongateurs électriques sont respectivement placés en regard des billes de connexions du boîtier BGA. Ces prolongateurs ont pour but de faciliter l'accès à quasiment l'ensemble des billes d'un circuit intégré en boîtier BGA sans nécessité de développer un circuit de test spécifique comme dans l'état de la technique.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1052697A FR2958756B1 (fr) | 2010-04-09 | 2010-04-09 | Systeme de test d'un composant electronique haute frequence |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1052697A FR2958756B1 (fr) | 2010-04-09 | 2010-04-09 | Systeme de test d'un composant electronique haute frequence |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2958756A1 FR2958756A1 (fr) | 2011-10-14 |
FR2958756B1 true FR2958756B1 (fr) | 2013-02-08 |
Family
ID=43244247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1052697A Expired - Fee Related FR2958756B1 (fr) | 2010-04-09 | 2010-04-09 | Systeme de test d'un composant electronique haute frequence |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2958756B1 (fr) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6046597A (en) * | 1995-10-04 | 2000-04-04 | Oz Technologies, Inc. | Test socket for an IC device |
US6069481A (en) * | 1995-10-31 | 2000-05-30 | Advantest Corporation | Socket for measuring a ball grid array semiconductor |
KR100393316B1 (ko) * | 1996-08-09 | 2003-09-19 | 가부시키가이샤 아드반테스트 | 반도체디바이스시험장치 |
US6204680B1 (en) * | 1997-04-15 | 2001-03-20 | Delaware Capital Formation, Inc. | Test socket |
US6079987A (en) * | 1997-12-26 | 2000-06-27 | Unitechno, Inc. | Connector for electronic parts |
JP2003050262A (ja) * | 2001-08-08 | 2003-02-21 | Hitachi Ltd | 高周波icソケット、半導体試験装置および半導体試験方法ならびに半導体装置の製造方法 |
JP2003066104A (ja) * | 2001-08-22 | 2003-03-05 | Advantest Corp | インサートおよびこれを備えた電子部品ハンドリング装置 |
US8102184B2 (en) * | 2006-01-17 | 2012-01-24 | Johnstech International | Test contact system for testing integrated circuits with packages having an array of signal and power contacts |
WO2008123608A1 (fr) * | 2007-04-04 | 2008-10-16 | Nhk Spring Co., Ltd. | Support de contact conducteur et unité de contact conducteur |
-
2010
- 2010-04-09 FR FR1052697A patent/FR2958756B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2958756A1 (fr) | 2011-10-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102170167B1 (ko) | 희생 범프를 구비한 패키지 무결성 모니터 | |
WO2003100445A3 (fr) | Sonde d'essai d'un dispositif soumis à essai | |
US7800391B2 (en) | Apparatus for testing a chip and methods of making and using the same | |
FR2963478B1 (fr) | Dispositif semi-conducteur comprenant un composant passif de condensateurs et procede pour sa fabrication. | |
US11815382B2 (en) | Flow meter | |
JP2015504316A5 (fr) | ||
TW200619656A (en) | On-chip self test circuit and self test method for signal distortion | |
MX2013000238A (es) | Sistemas y metodos para medir el uso de energia electrica en una estructura y sistemas y metodos para calibrarlo. | |
CN101063704B (zh) | 处理测试器与多个被测器件间的信号的装置、系统和方法 | |
TWI420121B (zh) | 經封裝積體電路以及用以測試裝置的方法及設備 | |
MY147606A (en) | System for testing and sorting electronic components | |
KR20150000830A (ko) | 주변 온도를 측정하기 위해 이동 단말기에 통합될 수 있는 모듈 | |
US20200123002A1 (en) | Absolute and differential pressure sensors and related methods | |
TW200632348A (en) | Semiconductor device, measuring device, and measuring method | |
FR2958756B1 (fr) | Systeme de test d'un composant electronique haute frequence | |
CN110462386A (zh) | 用于监测功率半导体裸芯的器件和方法 | |
US9110097B2 (en) | Test system | |
US10060944B2 (en) | Micromechanical sensor device and corresponding manufacturing method | |
KR101421048B1 (ko) | 능동소자 칩이 탑재된 반도체 검사 장치 | |
KR101613080B1 (ko) | 헬스케어 장치 | |
CN109891203B (zh) | 用于测量容器中的流体液位的装置和方法 | |
KR20170119452A (ko) | 반도체 패키지를 수납하기 위한 인서트 조립체 및 이를 포함하는 테스트 트레이 | |
TW200951449A (en) | Test system and probe device | |
FR3041209A1 (fr) | Systeme electronique compact et dispositif comprenant un tel systeme | |
Dzarnoski et al. | Ultra small hearing aid electronic packaging enabled by chip-in-flex |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 7 |
|
PLFP | Fee payment |
Year of fee payment: 8 |
|
PLFP | Fee payment |
Year of fee payment: 9 |
|
PLFP | Fee payment |
Year of fee payment: 10 |
|
PLFP | Fee payment |
Year of fee payment: 11 |
|
ST | Notification of lapse |
Effective date: 20211205 |