TW367570B - Semiconductor device and manufacturing method thereof, circuit board and flexible board - Google Patents

Semiconductor device and manufacturing method thereof, circuit board and flexible board

Info

Publication number
TW367570B
TW367570B TW086114538A TW86114538A TW367570B TW 367570 B TW367570 B TW 367570B TW 086114538 A TW086114538 A TW 086114538A TW 86114538 A TW86114538 A TW 86114538A TW 367570 B TW367570 B TW 367570B
Authority
TW
Taiwan
Prior art keywords
flexible board
board
circuit board
manufacturing
semiconductor device
Prior art date
Application number
TW086114538A
Other languages
English (en)
Inventor
Nobuaki Hashimoto
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of TW367570B publication Critical patent/TW367570B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW086114538A 1996-10-17 1997-10-04 Semiconductor device and manufacturing method thereof, circuit board and flexible board TW367570B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29753096 1996-10-17

Publications (1)

Publication Number Publication Date
TW367570B true TW367570B (en) 1999-08-21

Family

ID=17847732

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086114538A TW367570B (en) 1996-10-17 1997-10-04 Semiconductor device and manufacturing method thereof, circuit board and flexible board

Country Status (7)

Country Link
US (2) US6482673B2 (zh)
JP (1) JP3944915B2 (zh)
KR (2) KR100616479B1 (zh)
CN (1) CN1168137C (zh)
AU (1) AU4322097A (zh)
TW (1) TW367570B (zh)
WO (1) WO1998018164A1 (zh)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6285079B1 (en) 1998-06-02 2001-09-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device employing grid array electrodes and compact chip-size package
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US7557367B2 (en) 2004-06-04 2009-07-07 The Board Of Trustees Of The University Of Illinois Stretchable semiconductor elements and stretchable electrical circuits
US7704684B2 (en) 2003-12-01 2010-04-27 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating three-dimensional nanoscale structures
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
US7972875B2 (en) 2007-01-17 2011-07-05 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US8367035B2 (en) 2006-03-03 2013-02-05 The Board Of Trustees Of The University Of Illinois Methods of making spatially aligned nanotubes and nanotube arrays
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8470701B2 (en) 2008-04-03 2013-06-25 Advanced Diamond Technologies, Inc. Printable, flexible and stretchable diamond for thermal management
US8552299B2 (en) 2008-03-05 2013-10-08 The Board Of Trustees Of The University Of Illinois Stretchable and foldable electronic devices
US8666471B2 (en) 2010-03-17 2014-03-04 The Board Of Trustees Of The University Of Illinois Implantable biomedical devices on bioresorbable substrates
US8865489B2 (en) 2009-05-12 2014-10-21 The Board Of Trustees Of The University Of Illinois Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
TWI466488B (zh) * 2006-04-07 2014-12-21 Univ Illinois 用在橡膠基板上高效能電子組件之可延伸形式之單晶矽
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
US9691873B2 (en) 2011-12-01 2017-06-27 The Board Of Trustees Of The University Of Illinois Transient devices designed to undergo programmable transformations
TWI595672B (zh) * 2011-01-14 2017-08-11 美國伊利諾大學理事會 光學組件陣列、其成像系統、及控制一光學組件陣列之曲率的方法
US9765934B2 (en) 2011-05-16 2017-09-19 The Board Of Trustees Of The University Of Illinois Thermally managed LED arrays assembled by printing
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US10052066B2 (en) 2012-03-30 2018-08-21 The Board Of Trustees Of The University Of Illinois Appendage mountable electronic devices conformable to surfaces
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
US10918298B2 (en) 2009-12-16 2021-02-16 The Board Of Trustees Of The University Of Illinois High-speed, high-resolution electrophysiology in-vivo using conformal electronics
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6482673B2 (en) * 1996-10-17 2002-11-19 Seiko Epson Corporation Semiconductor device, method of making the same, circuit board, flexible substrate, and method of making substrate
JP3661444B2 (ja) * 1998-10-28 2005-06-15 株式会社ルネサステクノロジ 半導体装置、半導体ウエハ、半導体モジュールおよび半導体装置の製造方法
JP4489221B2 (ja) * 1999-12-14 2010-06-23 大日本印刷株式会社 転写用配線部材およびその製造方法
JP3645511B2 (ja) * 2001-10-09 2005-05-11 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2005311118A (ja) * 2004-04-22 2005-11-04 Seiko Epson Corp 半導体装置及びその製造方法、電気光学装置、並びに電子機器
US7105918B2 (en) * 2004-07-29 2006-09-12 Micron Technology, Inc. Interposer with flexible solder pad elements and methods of manufacturing the same
DE102004037610B3 (de) * 2004-08-03 2006-03-16 Infineon Technologies Ag Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung
JP4659634B2 (ja) * 2006-02-08 2011-03-30 富士通株式会社 フリップチップ実装方法
US7759782B2 (en) * 2006-04-07 2010-07-20 Tessera, Inc. Substrate for a microelectronic package and method of fabricating thereof
US7767497B2 (en) * 2007-07-12 2010-08-03 Tessera, Inc. Microelectronic package element and method of fabricating thereof
US8406004B2 (en) * 2008-12-09 2013-03-26 Stats Chippac Ltd. Integrated circuit packaging system and method of manufacture thereof
US7952176B2 (en) * 2008-12-09 2011-05-31 Stats Chippac Ltd. Integrated circuit packaging system and method of manufacture thereof
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US10790328B2 (en) 2017-11-28 2020-09-29 Asahi Kasei Microdevices Corporation Semiconductor package and camera module
JP7282710B2 (ja) * 2020-03-19 2023-05-29 株式会社東芝 半導体装置の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219942A (ja) 1983-05-30 1984-12-11 Nec Corp チツプキヤリア
JPS61100940A (ja) 1984-10-22 1986-05-19 Mitsubishi Electric Corp 半導体装置
JPS644038A (en) 1987-06-26 1989-01-09 Nec Corp Mounting structure of integrated circuit
US5489804A (en) * 1989-08-28 1996-02-06 Lsi Logic Corporation Flexible preformed planar structures for interposing between a chip and a substrate
US5148265A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5477611A (en) 1993-09-20 1995-12-26 Tessera, Inc. Method of forming interface between die and chip carrier
JP2674536B2 (ja) 1993-12-16 1997-11-12 日本電気株式会社 チップキャリア半導体装置及びその製造方法
US5663106A (en) * 1994-05-19 1997-09-02 Tessera, Inc. Method of encapsulating die and chip carrier
US5834339A (en) * 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
US5776796A (en) 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
KR0181615B1 (ko) 1995-01-30 1999-04-15 모리시다 요이치 반도체 장치의 실장체, 그 실장방법 및 실장용 밀봉재
JP3484554B2 (ja) 1995-02-28 2004-01-06 日本テキサス・インスツルメンツ株式会社 半導体装置
US5777379A (en) * 1995-08-18 1998-07-07 Tessera, Inc. Semiconductor assemblies with reinforced peripheral regions
US6482673B2 (en) * 1996-10-17 2002-11-19 Seiko Epson Corporation Semiconductor device, method of making the same, circuit board, flexible substrate, and method of making substrate
US5909633A (en) * 1996-11-29 1999-06-01 Matsushita Electric Industrial Co., Ltd. Method of manufacturing an electronic component
US6054337A (en) * 1996-12-13 2000-04-25 Tessera, Inc. Method of making a compliant multichip package
US6043109A (en) * 1999-02-09 2000-03-28 United Microelectronics Corp. Method of fabricating wafer-level package

Cited By (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6285079B1 (en) 1998-06-02 2001-09-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device employing grid array electrodes and compact chip-size package
US7704684B2 (en) 2003-12-01 2010-04-27 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating three-dimensional nanoscale structures
US10374072B2 (en) 2004-06-04 2019-08-06 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US9761444B2 (en) 2004-06-04 2017-09-12 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
US11088268B2 (en) 2004-06-04 2021-08-10 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
US10204864B2 (en) 2004-06-04 2019-02-12 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US7982296B2 (en) 2004-06-04 2011-07-19 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
US8039847B2 (en) 2004-06-04 2011-10-18 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US11456258B2 (en) 2004-06-04 2022-09-27 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US8198621B2 (en) 2004-06-04 2012-06-12 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US9450043B2 (en) 2004-06-04 2016-09-20 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US10355113B2 (en) 2004-06-04 2019-07-16 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US8394706B2 (en) 2004-06-04 2013-03-12 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US8440546B2 (en) 2004-06-04 2013-05-14 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
US7557367B2 (en) 2004-06-04 2009-07-07 The Board Of Trustees Of The University Of Illinois Stretchable semiconductor elements and stretchable electrical circuits
US9768086B2 (en) 2004-06-04 2017-09-19 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
US7622367B1 (en) 2004-06-04 2009-11-24 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
US8664699B2 (en) 2004-06-04 2014-03-04 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
US8754396B2 (en) 2004-06-04 2014-06-17 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US8729524B2 (en) 2004-06-04 2014-05-20 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US8367035B2 (en) 2006-03-03 2013-02-05 The Board Of Trustees Of The University Of Illinois Methods of making spatially aligned nanotubes and nanotube arrays
TWI466488B (zh) * 2006-04-07 2014-12-21 Univ Illinois 用在橡膠基板上高效能電子組件之可延伸形式之單晶矽
US9601671B2 (en) 2007-01-17 2017-03-21 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US8722458B2 (en) 2007-01-17 2014-05-13 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US11309305B2 (en) 2007-01-17 2022-04-19 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US10424572B2 (en) 2007-01-17 2019-09-24 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US10504882B2 (en) 2007-01-17 2019-12-10 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US10361180B2 (en) 2007-01-17 2019-07-23 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US7972875B2 (en) 2007-01-17 2011-07-05 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US8552299B2 (en) 2008-03-05 2013-10-08 The Board Of Trustees Of The University Of Illinois Stretchable and foldable electronic devices
US8905772B2 (en) 2008-03-05 2014-12-09 The Board Of Trustees Of The University Of Illinois Stretchable and foldable electronic devices
US10292261B2 (en) 2008-03-05 2019-05-14 The Board Of Trustees Of The University Of Illinois Stretchable and foldable electronic devices
US10064269B2 (en) 2008-03-05 2018-08-28 The Board Of Trustees Of The University Of Illinois Stretchable and foldable electronic devices
US8470701B2 (en) 2008-04-03 2013-06-25 Advanced Diamond Technologies, Inc. Printable, flexible and stretchable diamond for thermal management
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US9012784B2 (en) 2008-10-07 2015-04-21 Mc10, Inc. Extremely stretchable electronics
US8536667B2 (en) 2008-10-07 2013-09-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US9647171B2 (en) 2009-05-12 2017-05-09 The Board Of Trustees Of The University Of Illinois Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
US10546841B2 (en) 2009-05-12 2020-01-28 The Board Of Trustees Of The University Of Illinois Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
US8865489B2 (en) 2009-05-12 2014-10-21 The Board Of Trustees Of The University Of Illinois Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
US10918298B2 (en) 2009-12-16 2021-02-16 The Board Of Trustees Of The University Of Illinois High-speed, high-resolution electrophysiology in-vivo using conformal electronics
US11057991B2 (en) 2009-12-16 2021-07-06 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US8666471B2 (en) 2010-03-17 2014-03-04 The Board Of Trustees Of The University Of Illinois Implantable biomedical devices on bioresorbable substrates
US9986924B2 (en) 2010-03-17 2018-06-05 The Board Of Trustees Of The University Of Illinois Implantable biomedical devices on bioresorbable substrates
TWI595672B (zh) * 2011-01-14 2017-08-11 美國伊利諾大學理事會 光學組件陣列、其成像系統、及控制一光學組件陣列之曲率的方法
US9765934B2 (en) 2011-05-16 2017-09-19 The Board Of Trustees Of The University Of Illinois Thermally managed LED arrays assembled by printing
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
US10349860B2 (en) 2011-06-03 2019-07-16 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
US9691873B2 (en) 2011-12-01 2017-06-27 The Board Of Trustees Of The University Of Illinois Transient devices designed to undergo programmable transformations
US10396173B2 (en) 2011-12-01 2019-08-27 The Board Of Trustees Of The University Of Illinois Transient devices designed to undergo programmable transformations
US10357201B2 (en) 2012-03-30 2019-07-23 The Board Of Trustees Of The University Of Illinois Appendage mountable electronic devices conformable to surfaces
US10052066B2 (en) 2012-03-30 2018-08-21 The Board Of Trustees Of The University Of Illinois Appendage mountable electronic devices conformable to surfaces
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants

Also Published As

Publication number Publication date
WO1998018164A1 (fr) 1998-04-30
JP3944915B2 (ja) 2007-07-18
US20010019852A1 (en) 2001-09-06
KR100555341B1 (ko) 2006-06-21
AU4322097A (en) 1998-05-15
CN1168137C (zh) 2004-09-22
KR19990072171A (ko) 1999-09-27
CN1206498A (zh) 1999-01-27
KR20050093865A (ko) 2005-09-23
US6727595B2 (en) 2004-04-27
US20030027375A1 (en) 2003-02-06
US6482673B2 (en) 2002-11-19
KR100616479B1 (ko) 2006-08-28

Similar Documents

Publication Publication Date Title
TW367570B (en) Semiconductor device and manufacturing method thereof, circuit board and flexible board
DE3686091T2 (de) Integrierte halbleiterschaltungen mit schaltungselementen zur untersuchung der integrierten schaltungen sowie mittel zum pruefen der schaltungselemente.
HK1003684A1 (en) Chip carrier and semiconductor device using the same
DE3476493D1 (en) A semiconductor integrated circuit device comprising an mos transistor and a bipolar transistor and a manufacturing method of the same
EP0713250A3 (en) Material for semiconductor substrate, its manufacture and product from this substrate
TW379850U (en) Resin-encapsulated semiconductor device and method of mfg. the same
SG87012A1 (en) Epoxy resin composition and semiconductor device using the same
SG76592A1 (en) Semiconductor integrated circuit device and process for manufacturing the same
DE3584915D1 (de) Halbleitermaterial und substrat.
AU6406696A (en) Improved method and apparatus for scrubbing the bond pads of an integrated circuit during wafer sort
ES8103478A1 (es) Dispositivo de marco de conductores electricos utilizable con pastillas de circuito integrado de tamanos diferentes y con numeros distintos de areas terminales.
EP0494311A4 (en) Method of inspecting semiconductor device, apparatus for inspecting the same, and method of manufacturing the same
TW348300B (en) Semiconductor device fabrication method and apparatus using connecting implants
KR910007095A (ko) 수지밀봉용 금형 및 이를 이용하여 수지를 밀봉하는 반도체 장치의 제조방법
DE3583998D1 (de) Polyimidvorlaeufer-harzzusammensetzung und halbleiterkomponente, die dieselbe verwendet.
DE3273569D1 (en) Semiconductor device having an electrode, and method for producing the same
TW344123B (en) Semiconductor device and process for producing the same
TW354855B (en) Connecting structure of semiconductor element
TW347585B (en) Lead frame, semiconductor device using the same and manufacturing of semiconductor device thereof
KR870005450A (ko) 반도체층을 통한 전기적 단락이 없는 반도체 장치와 그 제조방법
HK1027827A1 (en) Semiconductor sealing resin composition semiconductor device sealed with the same and process for preparing semiconductor device
MY123345A (en) Semiconductor device, its fabrication method and electronic device
DE69031291D1 (de) Testmethode, Testschaltung und integrierter Halbleiterschaltkreis mit Testschaltung
DE69610109D1 (de) Halbleiterkomponente mit verbesserter sicherheit;halbleiterschaltkreisanordung und verfahren zur herstellung derselben
DE3787500D1 (de) Isolierharz-Zusammensetzung und Halbleitervorrichtung unter deren Verwendung.

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees