TW362263B - Semiconductor integrated circuit apparatus - Google Patents

Semiconductor integrated circuit apparatus

Info

Publication number
TW362263B
TW362263B TW086118421A TW86118421A TW362263B TW 362263 B TW362263 B TW 362263B TW 086118421 A TW086118421 A TW 086118421A TW 86118421 A TW86118421 A TW 86118421A TW 362263 B TW362263 B TW 362263B
Authority
TW
Taiwan
Prior art keywords
integrated circuit
semiconductor integrated
circuit apparatus
carrier substrate
penetration
Prior art date
Application number
TW086118421A
Other languages
English (en)
Inventor
Takeshi Muraki
Takayuki Yuyama
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW362263B publication Critical patent/TW362263B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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    • H01L2924/151—Die mounting substrate
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    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW086118421A 1997-05-30 1997-12-03 Semiconductor integrated circuit apparatus TW362263B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9142128A JPH10335567A (ja) 1997-05-30 1997-05-30 半導体集積回路装置

Publications (1)

Publication Number Publication Date
TW362263B true TW362263B (en) 1999-06-21

Family

ID=15308039

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086118421A TW362263B (en) 1997-05-30 1997-12-03 Semiconductor integrated circuit apparatus

Country Status (5)

Country Link
US (1) US5892288A (zh)
JP (1) JPH10335567A (zh)
KR (1) KR100294012B1 (zh)
CN (1) CN1118098C (zh)
TW (1) TW362263B (zh)

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JPH0837190A (ja) * 1994-07-22 1996-02-06 Nec Corp 半導体装置
JP2616565B2 (ja) * 1994-09-12 1997-06-04 日本電気株式会社 電子部品組立体
JP2546192B2 (ja) * 1994-09-30 1996-10-23 日本電気株式会社 フィルムキャリア半導体装置
US5583376A (en) * 1995-01-03 1996-12-10 Motorola, Inc. High performance semiconductor device with resin substrate and method for making the same
JPH08288424A (ja) * 1995-04-18 1996-11-01 Nec Corp 半導体装置
JPH08307033A (ja) * 1995-05-08 1996-11-22 Ibiden Co Ltd Ｉｃチップモジュール
JPH0936275A (ja) * 1995-07-21 1997-02-07 Toshiba Corp 表面実装型半導体装置の製造方法

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KR19980086440A (ko) 1998-12-05
JPH10335567A (ja) 1998-12-18
KR100294012B1 (ko) 2001-07-12
CN1118098C (zh) 2003-08-13
CN1201253A (zh) 1998-12-09
US5892288A (en) 1999-04-06

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