TW358322B - Solder mask for manufacture of printed circuit boards - Google Patents

Solder mask for manufacture of printed circuit boards

Info

Publication number
TW358322B
TW358322B TW085115894A TW85115894A TW358322B TW 358322 B TW358322 B TW 358322B TW 085115894 A TW085115894 A TW 085115894A TW 85115894 A TW85115894 A TW 85115894A TW 358322 B TW358322 B TW 358322B
Authority
TW
Taiwan
Prior art keywords
copper foil
etching
exposure
exposed
photoresist
Prior art date
Application number
TW085115894A
Other languages
English (en)
Inventor
James Richard Paulus
Original Assignee
Allied Signal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allied Signal Inc filed Critical Allied Signal Inc
Application granted granted Critical
Publication of TW358322B publication Critical patent/TW358322B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW085115894A 1995-12-11 1996-12-23 Solder mask for manufacture of printed circuit boards TW358322B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/570,260 US5626774A (en) 1995-12-11 1995-12-11 Solder mask for manufacture of printed circuit boards

Publications (1)

Publication Number Publication Date
TW358322B true TW358322B (en) 1999-05-11

Family

ID=24278909

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085115894A TW358322B (en) 1995-12-11 1996-12-23 Solder mask for manufacture of printed circuit boards

Country Status (10)

Country Link
US (1) US5626774A (zh)
EP (1) EP0867106B1 (zh)
JP (1) JP2000501892A (zh)
KR (1) KR100437069B1 (zh)
AU (1) AU1413497A (zh)
CA (1) CA2239031A1 (zh)
DE (1) DE69605056T2 (zh)
MX (1) MX9804234A (zh)
TW (1) TW358322B (zh)
WO (1) WO1997022235A2 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10136114B4 (de) * 2001-07-26 2010-05-06 Carl Freudenberg Kg Verfahren zur Herstellung eines flächigen Schaltungsträgers
US6395625B1 (en) * 2001-10-12 2002-05-28 S & S Technology Corporation Method for manufacturing solder mask of printed circuit board
US6753480B2 (en) * 2001-10-12 2004-06-22 Ultratera Corporation Printed circuit board having permanent solder mask
EP1318707A1 (en) * 2001-10-16 2003-06-11 Ultratera Corporation Method for manufacturing solder mask of printed circuit board
EP1365450A1 (en) * 2002-05-24 2003-11-26 Ultratera Corporation An improved wire-bonded chip on board package
EP1369919A1 (en) * 2002-05-24 2003-12-10 Ultratera Corporation Flip chip package
CN1462172A (zh) * 2002-05-27 2003-12-17 联测科技股份有限公司 具固定防焊层的印刷电路板
JP2004066017A (ja) * 2002-08-01 2004-03-04 Nippon Paint Co Ltd ソルダーレジスト膜の形成方法
KR20040104144A (ko) * 2003-06-03 2004-12-10 삼성전기주식회사 솔더 레지스트 패턴 형성 방법
US7081209B2 (en) * 2003-07-09 2006-07-25 Taiwan Semiconductor Manufacturing Co., Ltd. Solder mask removal method
CN101772274B (zh) * 2009-01-04 2011-11-30 欣兴电子股份有限公司 线路基板的表面电镀方法
KR20150025245A (ko) * 2013-08-28 2015-03-10 삼성전기주식회사 인쇄회로기판용 동박 적층판 및 그의 제조방법
CN112638053B (zh) * 2019-09-24 2022-04-29 北京梦之墨科技有限公司 一种阻焊层图案化方法及装置、以及电路板
CN110621116A (zh) * 2019-09-25 2019-12-27 江苏上达电子有限公司 一种封装基板的制作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5047114A (en) * 1984-11-02 1991-09-10 Amp-Akzo Corporation Process for the production of metal clad thermoplastic base materials and printed circuits on thermoplastic base materials
US4980016A (en) * 1985-08-07 1990-12-25 Canon Kabushiki Kaisha Process for producing electric circuit board
US4992354A (en) * 1988-02-26 1991-02-12 Morton International, Inc. Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like
IE67319B1 (en) * 1989-10-11 1996-03-20 Waterford Res & Dev Ltd Antistatic adhesive tape
US5368884A (en) * 1991-11-06 1994-11-29 Nippon Paint Co., Ltd. Method of forming solder mask
US5334487A (en) * 1992-07-23 1994-08-02 International Business Machines Corporation Method for forming a patterned layer on a substrate

Also Published As

Publication number Publication date
CA2239031A1 (en) 1997-06-19
JP2000501892A (ja) 2000-02-15
WO1997022235A3 (en) 1997-08-14
DE69605056T2 (de) 2000-02-24
DE69605056D1 (de) 1999-12-09
MX9804234A (es) 1998-09-30
AU1413497A (en) 1997-07-03
EP0867106A2 (en) 1998-09-30
KR19990072084A (ko) 1999-09-27
KR100437069B1 (ko) 2004-07-16
US5626774A (en) 1997-05-06
WO1997022235A2 (en) 1997-06-19
EP0867106B1 (en) 1999-11-03

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