MX9804234A - Mascara soldada para fabricar tableros de circuitos impresos. - Google Patents
Mascara soldada para fabricar tableros de circuitos impresos.Info
- Publication number
- MX9804234A MX9804234A MX9804234A MX9804234A MX9804234A MX 9804234 A MX9804234 A MX 9804234A MX 9804234 A MX9804234 A MX 9804234A MX 9804234 A MX9804234 A MX 9804234A MX 9804234 A MX9804234 A MX 9804234A
- Authority
- MX
- Mexico
- Prior art keywords
- solder mask
- printed circuit
- manufacture
- circuit boards
- copper foil
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
La presente invencion se refiere a una máscara soldada permanente que se aplica a la superficie de un tablero de circuitos impresos utilizando un portador hoja de cobre. La mascara soldada de preferencia es una o dos capas de una resina termoendurecible, por ejemplo, resina epoxica. Las características del circuito, seleccionadas, se exponen mediante mordentado en porciones de la hoja de cobre y eliminando la resina termoendurecible subyacente. Después, se retira la hoja de cobre remanente dejando la máscara soldada sobre la superficie del tablero de circuito impreso.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/570,260 US5626774A (en) | 1995-12-11 | 1995-12-11 | Solder mask for manufacture of printed circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
MX9804234A true MX9804234A (es) | 1998-09-30 |
Family
ID=24278909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9804234A MX9804234A (es) | 1995-12-11 | 1998-05-28 | Mascara soldada para fabricar tableros de circuitos impresos. |
Country Status (10)
Country | Link |
---|---|
US (1) | US5626774A (es) |
EP (1) | EP0867106B1 (es) |
JP (1) | JP2000501892A (es) |
KR (1) | KR100437069B1 (es) |
AU (1) | AU1413497A (es) |
CA (1) | CA2239031A1 (es) |
DE (1) | DE69605056T2 (es) |
MX (1) | MX9804234A (es) |
TW (1) | TW358322B (es) |
WO (1) | WO1997022235A2 (es) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10136114B4 (de) * | 2001-07-26 | 2010-05-06 | Carl Freudenberg Kg | Verfahren zur Herstellung eines flächigen Schaltungsträgers |
US6753480B2 (en) * | 2001-10-12 | 2004-06-22 | Ultratera Corporation | Printed circuit board having permanent solder mask |
US6395625B1 (en) * | 2001-10-12 | 2002-05-28 | S & S Technology Corporation | Method for manufacturing solder mask of printed circuit board |
EP1318707A1 (en) * | 2001-10-16 | 2003-06-11 | Ultratera Corporation | Method for manufacturing solder mask of printed circuit board |
EP1369919A1 (en) * | 2002-05-24 | 2003-12-10 | Ultratera Corporation | Flip chip package |
EP1365450A1 (en) * | 2002-05-24 | 2003-11-26 | Ultratera Corporation | An improved wire-bonded chip on board package |
CN1462172A (zh) * | 2002-05-27 | 2003-12-17 | 联测科技股份有限公司 | 具固定防焊层的印刷电路板 |
JP2004066017A (ja) * | 2002-08-01 | 2004-03-04 | Nippon Paint Co Ltd | ソルダーレジスト膜の形成方法 |
KR20040104144A (ko) * | 2003-06-03 | 2004-12-10 | 삼성전기주식회사 | 솔더 레지스트 패턴 형성 방법 |
US7081209B2 (en) * | 2003-07-09 | 2006-07-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Solder mask removal method |
CN101772274B (zh) * | 2009-01-04 | 2011-11-30 | 欣兴电子股份有限公司 | 线路基板的表面电镀方法 |
KR20150025245A (ko) * | 2013-08-28 | 2015-03-10 | 삼성전기주식회사 | 인쇄회로기판용 동박 적층판 및 그의 제조방법 |
CN112638053B (zh) * | 2019-09-24 | 2022-04-29 | 北京梦之墨科技有限公司 | 一种阻焊层图案化方法及装置、以及电路板 |
CN110621116A (zh) * | 2019-09-25 | 2019-12-27 | 江苏上达电子有限公司 | 一种封装基板的制作方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5047114A (en) * | 1984-11-02 | 1991-09-10 | Amp-Akzo Corporation | Process for the production of metal clad thermoplastic base materials and printed circuits on thermoplastic base materials |
US4980016A (en) * | 1985-08-07 | 1990-12-25 | Canon Kabushiki Kaisha | Process for producing electric circuit board |
US4992354A (en) * | 1988-02-26 | 1991-02-12 | Morton International, Inc. | Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like |
IE67319B1 (en) * | 1989-10-11 | 1996-03-20 | Waterford Res & Dev Ltd | Antistatic adhesive tape |
US5368884A (en) * | 1991-11-06 | 1994-11-29 | Nippon Paint Co., Ltd. | Method of forming solder mask |
US5334487A (en) * | 1992-07-23 | 1994-08-02 | International Business Machines Corporation | Method for forming a patterned layer on a substrate |
-
1995
- 1995-12-11 US US08/570,260 patent/US5626774A/en not_active Expired - Lifetime
-
1996
- 1996-12-11 WO PCT/US1996/019625 patent/WO1997022235A2/en active IP Right Grant
- 1996-12-11 AU AU14134/97A patent/AU1413497A/en not_active Abandoned
- 1996-12-11 JP JP9522156A patent/JP2000501892A/ja active Pending
- 1996-12-11 CA CA002239031A patent/CA2239031A1/en not_active Abandoned
- 1996-12-11 EP EP96944288A patent/EP0867106B1/en not_active Expired - Lifetime
- 1996-12-11 DE DE69605056T patent/DE69605056T2/de not_active Expired - Fee Related
- 1996-12-11 KR KR10-1998-0704392A patent/KR100437069B1/ko not_active IP Right Cessation
- 1996-12-23 TW TW085115894A patent/TW358322B/zh active
-
1998
- 1998-05-28 MX MX9804234A patent/MX9804234A/es active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2000501892A (ja) | 2000-02-15 |
WO1997022235A2 (en) | 1997-06-19 |
AU1413497A (en) | 1997-07-03 |
KR100437069B1 (ko) | 2004-07-16 |
EP0867106B1 (en) | 1999-11-03 |
EP0867106A2 (en) | 1998-09-30 |
WO1997022235A3 (en) | 1997-08-14 |
US5626774A (en) | 1997-05-06 |
KR19990072084A (ko) | 1999-09-27 |
DE69605056D1 (de) | 1999-12-09 |
TW358322B (en) | 1999-05-11 |
CA2239031A1 (en) | 1997-06-19 |
DE69605056T2 (de) | 2000-02-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |