TW353159B - Method of developing positive photoresist and compositions therefor - Google Patents
Method of developing positive photoresist and compositions thereforInfo
- Publication number
- TW353159B TW353159B TW085100831A TW85100831A TW353159B TW 353159 B TW353159 B TW 353159B TW 085100831 A TW085100831 A TW 085100831A TW 85100831 A TW85100831 A TW 85100831A TW 353159 B TW353159 B TW 353159B
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- substrate
- developer composition
- positive photoresist
- class
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37617295A | 1995-01-20 | 1995-01-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW353159B true TW353159B (en) | 1999-02-21 |
Family
ID=23483983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085100831A TW353159B (en) | 1995-01-20 | 1996-01-24 | Method of developing positive photoresist and compositions therefor |
Country Status (8)
Country | Link |
---|---|
US (1) | US5821036A (zh) |
EP (1) | EP0804753B1 (zh) |
JP (1) | JP3578462B2 (zh) |
KR (1) | KR100394445B1 (zh) |
CN (1) | CN1072813C (zh) |
DE (1) | DE69612656T2 (zh) |
TW (1) | TW353159B (zh) |
WO (1) | WO1996022564A1 (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3728945B2 (ja) | 1998-10-30 | 2005-12-21 | オルガノ株式会社 | フォトレジスト現像廃液からの現像液の回収再利用方法及び装置 |
TW527363B (en) * | 1999-09-08 | 2003-04-11 | Shinetsu Chemical Co | Polymers, chemical amplification resist compositions and patterning process |
US6120978A (en) * | 2000-01-06 | 2000-09-19 | Air Products And Chemicals, Inc. | Use of N,N-dialkyl ureas in photoresist developers |
US6136514A (en) * | 2000-01-31 | 2000-10-24 | Advanced Micro Devices, Inc. | Resist developer saving system using material to reduce surface tension and wet resist surface |
JP2002049161A (ja) * | 2000-08-04 | 2002-02-15 | Clariant (Japan) Kk | 被覆層現像用界面活性剤水溶液 |
US20020187438A1 (en) * | 2001-06-12 | 2002-12-12 | Ching-Yu Chang | Development method for manufacturing semiconductors |
KR100814452B1 (ko) * | 2001-10-03 | 2008-03-17 | 에이에스엠엘 유에스, 인코포레이티드 | 표면에 가까운 액체 분배 젯트 사이의 상호 오염을 줄이기 위한 방법과 장치 |
WO2003073169A2 (en) * | 2002-02-21 | 2003-09-04 | Honeywell International Inc. | Fluorinated molecules and methods of making and using same |
WO2003095505A1 (en) * | 2002-05-07 | 2003-11-20 | Honeywell International Inc. | Fluorinated polymers |
US20040091813A1 (en) * | 2002-11-05 | 2004-05-13 | Honeywell International Inc. | Fluorinated polymers |
KR100634164B1 (ko) * | 2003-03-13 | 2006-10-16 | 삼성전자주식회사 | 반도체 제조 공정에 사용되는 세정액 |
TWI304917B (en) * | 2003-05-20 | 2009-01-01 | Tokyo Ohka Kogyo Co Ltd | Positive photoresist composition for discharge nozzle type application and resist pattern formation method |
US7083903B2 (en) * | 2003-06-17 | 2006-08-01 | Lam Research Corporation | Methods of etching photoresist on substrates |
US20060008731A1 (en) * | 2004-07-09 | 2006-01-12 | Michael Van Der Puy | Novel photoresist monomers and polymers |
US20060008730A1 (en) * | 2004-07-09 | 2006-01-12 | Puy Michael V D | Monomers for photoresists bearing acid-labile groups of reduced optical density |
US7605063B2 (en) * | 2006-05-10 | 2009-10-20 | Lam Research Corporation | Photoresist stripping chamber and methods of etching photoresist on substrates |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4628023A (en) * | 1981-04-10 | 1986-12-09 | Shipley Company Inc. | Metal ion free photoresist developer composition with lower alkyl quaternary ammonium hydrozide as alkalai agent and a quaternary ammonium compound as surfactant |
US4784937A (en) * | 1985-08-06 | 1988-11-15 | Tokyo Ohka Kogyo Co., Ltd. | Developing solution for positive-working photoresist comprising a metal ion free organic base and an anionic surfactant |
US4710449A (en) * | 1986-01-29 | 1987-12-01 | Petrarch Systems, Inc. | High contrast low metal ion positive photoresist developing method using aqueous base solutions with surfactants |
US4732836A (en) * | 1986-05-02 | 1988-03-22 | Hoechst Celanese Corporation | Novel mixed ester O-quinone photosensitizers |
US4863827A (en) * | 1986-10-20 | 1989-09-05 | American Hoechst Corporation | Postive working multi-level photoresist |
DE3827567A1 (de) * | 1988-08-13 | 1990-02-22 | Basf Ag | Waessrige entwicklerloesung fuer positiv arbeitende photoresists |
-
1996
- 1996-01-19 DE DE69612656T patent/DE69612656T2/de not_active Expired - Fee Related
- 1996-01-19 EP EP96904493A patent/EP0804753B1/en not_active Expired - Lifetime
- 1996-01-19 CN CN96191526A patent/CN1072813C/zh not_active Expired - Fee Related
- 1996-01-19 KR KR1019970704871A patent/KR100394445B1/ko not_active IP Right Cessation
- 1996-01-19 JP JP52244196A patent/JP3578462B2/ja not_active Expired - Fee Related
- 1996-01-19 WO PCT/US1996/000917 patent/WO1996022564A1/en active IP Right Grant
- 1996-01-24 TW TW085100831A patent/TW353159B/zh active
-
1997
- 1997-10-27 US US08/960,105 patent/US5821036A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0804753A1 (en) | 1997-11-05 |
DE69612656T2 (de) | 2001-10-18 |
KR19980701480A (ko) | 1998-05-15 |
JP3578462B2 (ja) | 2004-10-20 |
DE69612656D1 (de) | 2001-06-07 |
US5821036A (en) | 1998-10-13 |
EP0804753B1 (en) | 2001-05-02 |
CN1072813C (zh) | 2001-10-10 |
JPH10512973A (ja) | 1998-12-08 |
CN1168179A (zh) | 1997-12-17 |
WO1996022564A1 (en) | 1996-07-25 |
KR100394445B1 (ko) | 2004-05-24 |
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