TWI304917B - Positive photoresist composition for discharge nozzle type application and resist pattern formation method - Google Patents
Positive photoresist composition for discharge nozzle type application and resist pattern formation method Download PDFInfo
- Publication number
- TWI304917B TWI304917B TW093111012A TW93111012A TWI304917B TW I304917 B TWI304917 B TW I304917B TW 093111012 A TW093111012 A TW 093111012A TW 93111012 A TW93111012 A TW 93111012A TW I304917 B TWI304917 B TW I304917B
- Authority
- TW
- Taiwan
- Prior art keywords
- resist pattern
- discharge nozzle
- photoresist composition
- formation method
- pattern formation
- Prior art date
Links
- 229920002120 photoresistant polymer Polymers 0.000 title description 3
- 230000007261 regionalization Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 description 2
Classifications
-
- G—PHYSICS
- G08—SIGNALLING
- G08G—TRAFFIC CONTROL SYSTEMS
- G08G1/00—Traffic control systems for road vehicles
- G08G1/01—Detecting movement of traffic to be counted or controlled
- G08G1/052—Detecting movement of traffic to be counted or controlled with provision for determining speed or overspeed
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F19/00—Advertising or display means not otherwise provided for
- G09F19/22—Advertising or display means on roads, walls or similar surfaces, e.g. illuminated
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Business, Economics & Management (AREA)
- Accounting & Taxation (AREA)
- Marketing (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Materials For Photolithography (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
I3:0491第7隨测2號 民國103年1月3曰更正 使具有狹縫狀排出口之排出噴嘴與基板相對移動,將正型 光阻組成物塗佈於基板之塗佈面全面的方法,將申請專利 範圍第1項至第12項中任一項記載之正型光阻組成物塗 佈於基板上,在將正型光阻組成物塗佈於該基板上.後,使 該基板旋轉的步驟。 14·(刪除)I3:0491, 7th, 1st, 3rd, 3rd, 3rd, Republic of China, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd, 3rd The positive-type photoresist composition according to any one of the first to twelfth aspects of the patent application is applied to a substrate, and the positive-type photoresist composition is applied onto the substrate. The step of rotation. 14·(delete)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003141807 | 2003-05-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200502683A TW200502683A (en) | 2005-01-16 |
TWI304917B true TWI304917B (en) | 2009-01-01 |
Family
ID=34362594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093111012A TWI304917B (en) | 2003-05-20 | 2004-04-20 | Positive photoresist composition for discharge nozzle type application and resist pattern formation method |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100636568B1 (en) |
CN (1) | CN1282035C (en) |
TW (1) | TWI304917B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101209049B1 (en) * | 2004-12-24 | 2012-12-07 | 스미또모 가가꾸 가부시끼가이샤 | Photosensitive resin and thin film panel comprising pattern made of the photosensitive resin and method for manufacturing the thin film panel |
JP4759483B2 (en) * | 2006-09-25 | 2011-08-31 | Azエレクトロニックマテリアルズ株式会社 | Photoresist composition, method of applying photoresist composition, and method of forming resist pattern |
JP4591625B1 (en) * | 2010-04-01 | 2010-12-01 | Jsr株式会社 | Positive radiation-sensitive composition, interlayer insulating film and method for forming the same |
JP5792548B2 (en) * | 2011-07-28 | 2015-10-14 | 東京応化工業株式会社 | Glass processing method |
TWI443465B (en) * | 2012-04-23 | 2014-07-01 | Chi Mei Corp | Photo-curing polysiloxane composition, protecting film and element containing said protecting film |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100394445B1 (en) * | 1995-01-20 | 2004-05-24 | 인터내셔널 비지네스 머신즈 코포레이션 | Method for developing positive photoresist and composition therefor |
TW594406B (en) * | 1998-02-25 | 2004-06-21 | Ibm | Irradiation sensitive positive-tone resists using polymers containing two acid sensitive protecting groups |
JP3802732B2 (en) * | 2000-05-12 | 2006-07-26 | 信越化学工業株式会社 | Resist material and pattern forming method |
KR100816342B1 (en) * | 2001-10-19 | 2008-03-24 | 삼성전자주식회사 | Photoresist composition having a high heat resistance |
-
2004
- 2004-04-20 TW TW093111012A patent/TWI304917B/en not_active IP Right Cessation
- 2004-05-14 KR KR1020040034342A patent/KR100636568B1/en not_active IP Right Cessation
- 2004-05-18 CN CNB2004100447967A patent/CN1282035C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW200502683A (en) | 2005-01-16 |
CN1550899A (en) | 2004-12-01 |
KR20040100926A (en) | 2004-12-02 |
KR100636568B1 (en) | 2006-10-19 |
CN1282035C (en) | 2006-10-25 |
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