TW351851B - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- TW351851B TW351851B TW086113977A TW86113977A TW351851B TW 351851 B TW351851 B TW 351851B TW 086113977 A TW086113977 A TW 086113977A TW 86113977 A TW86113977 A TW 86113977A TW 351851 B TW351851 B TW 351851B
- Authority
- TW
- Taiwan
- Prior art keywords
- bipolar transistor
- planar bipolar
- semiconductor substrate
- npn
- semiconductor device
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/732—Vertical transistors
- H01L29/7322—Vertical transistors having emitter-base and base-collector junctions leaving at the same surface of the body, e.g. planar transistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Bipolar Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9068242A JPH10270567A (ja) | 1997-03-21 | 1997-03-21 | トランジスタ保護素子 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW351851B true TW351851B (en) | 1999-02-01 |
Family
ID=13368119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086113977A TW351851B (en) | 1997-03-21 | 1997-09-25 | Semiconductor device |
Country Status (5)
Country | Link |
---|---|
US (1) | US6013941A (zh) |
JP (1) | JPH10270567A (zh) |
KR (1) | KR100553015B1 (zh) |
CN (1) | CN1136611C (zh) |
TW (1) | TW351851B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1150628C (zh) * | 1996-11-07 | 2004-05-19 | 株式会社日立制作所 | 半导体集成电路器件及其制造方法 |
US6825504B2 (en) | 1999-05-03 | 2004-11-30 | Hitachi, Ltd. | Semiconductor integrated circuit device and method of manufacturing the same |
US6777784B1 (en) * | 2000-10-17 | 2004-08-17 | National Semiconductor Corporation | Bipolar transistor-based electrostatic discharge (ESD) protection structure with a heat sink |
US6465870B2 (en) * | 2001-01-25 | 2002-10-15 | International Business Machines Corporation | ESD robust silicon germanium transistor with emitter NP-block mask extrinsic base ballasting resistor with doped facet region |
JP3551153B2 (ja) * | 2001-02-01 | 2004-08-04 | 日産自動車株式会社 | 半導体装置 |
CN1886834A (zh) * | 2003-11-27 | 2006-12-27 | 松下电器产业株式会社 | 具备静电破坏保护元件的半导体装置 |
KR100604527B1 (ko) * | 2003-12-31 | 2006-07-24 | 동부일렉트로닉스 주식회사 | 바이폴라 트랜지스터 제조방법 |
FR2914497B1 (fr) * | 2007-04-02 | 2009-06-12 | St Microelectronics Sa | Structure de composants haute frequence a faibles capacites parasites |
JP4803747B2 (ja) * | 2007-06-18 | 2011-10-26 | ルネサスエレクトロニクス株式会社 | 半導体集積回路 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4868624A (en) * | 1980-05-09 | 1989-09-19 | Regents Of The University Of Minnesota | Channel collector transistor |
JPS59104165A (ja) * | 1982-12-06 | 1984-06-15 | Mitsubishi Electric Corp | 電力用トランジスタ |
US4982244A (en) * | 1982-12-20 | 1991-01-01 | National Semiconductor Corporation | Buried Schottky clamped transistor |
JPS59159560A (ja) * | 1983-03-01 | 1984-09-10 | Toshiba Corp | 半導体装置 |
GB8326451D0 (en) * | 1983-10-03 | 1983-11-02 | Texas Instruments Ltd | Darlington transistors |
US4967243A (en) * | 1988-07-19 | 1990-10-30 | General Electric Company | Power transistor structure with high speed integral antiparallel Schottky diode |
FR2677171B1 (fr) * | 1991-05-31 | 1994-01-28 | Sgs Thomson Microelectronics Sa | Transistor de gain en courant predetermine dans un circuit integre bipolaire. |
JPH07122715A (ja) * | 1994-04-27 | 1995-05-12 | Toshiba Corp | 半導体装置 |
JPH08274184A (ja) * | 1995-03-31 | 1996-10-18 | Toshiba Microelectron Corp | 半導体集積回路の保護回路装置 |
-
1997
- 1997-03-21 JP JP9068242A patent/JPH10270567A/ja not_active Withdrawn
- 1997-09-25 TW TW086113977A patent/TW351851B/zh not_active IP Right Cessation
- 1997-10-01 US US08/942,304 patent/US6013941A/en not_active Expired - Lifetime
-
1998
- 1998-02-12 KR KR1019980004170A patent/KR100553015B1/ko not_active IP Right Cessation
- 1998-03-20 CN CNB981058337A patent/CN1136611C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6013941A (en) | 2000-01-11 |
KR100553015B1 (ko) | 2007-11-12 |
KR19980079713A (ko) | 1998-11-25 |
CN1194466A (zh) | 1998-09-30 |
CN1136611C (zh) | 2004-01-28 |
JPH10270567A (ja) | 1998-10-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |